Flexible package-to-socket interposer

Patent metadata

Field	Value
Publication number	US-9570386-B2
Application number	US-201514727776-A
Country	US
Kind code	B2
Filing date	Jun 1, 2015
Priority date	Oct 23, 2012
Publication date	Feb 14, 2017
Grant date	Feb 14, 2017

Abstract

A flexible interposer for the attachment of a microelectronic package to a microelectronic socket, wherein a first portion of the flexible substrate may be positioned between the microelectronic package and the microelectronic socket, and a second portion of the flexible interposer may extend from between the microelectronic package and the microelectronic socket to electrically contact an external component. In one embodiment, the external component may be a microelectronic substrate and the microelectronic socket may be attached to the microelectronic substrate.

First claim

What is claimed is:

1. A microelectronic structure, comprising:
a flexible interposer having a first surface and a second surface, wherein the flexible interposer comprises:
a plurality of flexible dielectric layers;
a plurality of interconnects proximate the flexible interposer first surface;
a plurality of contacts disposed proximate the flexible interposer second surface;
at least one signal routing trace disposed between two flexible dielectric layer of the plurality of flexible dielectric layers;
at least one first conductive via extending between at least one of the plurality of interconnects and the at least one signal routing trace; and
at least one second conductive via extending between at least one of the plurality of interconnects and at least one of the plurality of contacts;

a microelectronic socket;
a microelectronic package, wherein a first portion of the flexible interposer is disposed between the microelectronic socket and the microelectronic package, wherein the flexible interposer electrically connects the microelectronic package to the microelectronic socket through the at least one second conductive via; and
an external component, wherein a second portion of the flexible interposer is attached to the external components and electrically connects the microelectronic package to the external component.

2. The microelectronic structure of claim 1 , further comprising a microelectronic substrate, wherein the microelectronic socket is electrically connected to the microelectronic substrate.

3. The microelectronic structure of claim 2 , wherein the external component comprises the microelectronic substrate.

4. The microelectronic structure of claim 3 , further comprising the flexible interposer second portion attached to the microelectronic substrate through a plurality substrate interconnects extending between the flexible interposer and the microelectronic substrate.

5. The microelectronic structure of claim 4 , wherein the plurality substrate interconnects comprise a plurality of solder substrate interconnects.

6. The microelectronic structure of claim 2 , further including a connection structure attached to the microelectronic substrate wherein the flexible interposer second portion is electrically connected to the connection structure.

7. The microelectronic structure of claim 1 , further including a second flexible interposer attached to the external component, wherein the flexible interposer is connected to the second flexible interposer.

8. The microelectronic structure of claim 1 , wherein the at least one interconnect comprises at least one micro-spring.

9. The microelectronic structure of claim 1 , wherein the at least one interconnect comprises a conductive material selected from the group comprising copper, silver, gold and aluminum.

10. The microelectronic structure of claim 1 , wherein the at least one interconnect comprises a deformable conductive material.

11. The microelectronic structure of claim 10 , wherein the at least one interconnect comprises a polymer filled with a conductive material.

12. The microelectronic structure of claim 10 , wherein the at least one interconnect comprises an adhesive filled with a conductive material.

13. A microelectronic structure, comprising:
a flexible interposer having a first surface and a second surface, wherein the flexible interposer comprises:
a plurality of flexible dielectric layers;
a plurality of interconnects proximate the flexible interposer first surface;
a plurality of contacts disposed proximate the flexible interposer second surface;
at least one signal routing trace disposed between two flexible dielectric layer of the plurality of flexible dielectric layers;
at least one first conductive via extending between at least one of the plurality of interconnects and the at least one signal routing trace; and
at least one second conductive via extending between at least one of the plurality of interconnects and at least one of the plurality of contacts;

a microelectronic socket; and
a microelectronic package, wherein a first portion of the flexible interposer is disposed between the microelectronic socket and the microelectronic package, wherein the flexible interposer electrically connects the microelectronic package to the microelectronic socket through the at least one second conductive via, wherein the microelectronic package contacts at least one of the plurality of interconnects proximate the flexible interposer first surface, wherein the microelectronic socket contacts at least one of the plurality of contacts disposed proximate the flexible interposer second surface with at least one conductive structure extending through the microelectronic socket, and wherein the microelectronic socket is attached to a microelectronic substrate with at least one socket-to-substrate interconnect extending between the microelectronic substrate and at least one conductive structure of the microelectronic socket.

14. The microelectronic structure of claim 13 , further comprising an external component, wherein a second portion of the flexible interposer is attached to the external components and electrically connects the microelectronic package to the external component.

15. The microelectronic structure of claim 14 , wherein the external component comprises the microelectronic substrate.

16. The microelectronic structure of claim 15 , further comprising the flexible interposer second portion attached to the microelectronic substrate through a plurality substrate interconnects extending between the flexible interposer and the microelectronic substrate.

17. The microelectronic structure of claim 16 , wherein the plurality substrate interconnects comprise a plurality of solder substrate interconnects.

18. The microelectronic structure of claim 13 , further including a connection structure attached to the microelectronic substrate wherein the flexible interposer second portion is electrically connected to the connection structure.

19. The microelectronic structure of claim 13 , further including a second flexible interposer attached to the external component, wherein the flexible interposer is connected to the second flexible interposer.

20. The microelectronic structure of claim 13 , wherein the at least one interconnect comprises at least one micro-spring.

21. The microelectronic structure of claim 13 , wherein the at least one interconnect comprises a conductive material selected from the group comprising copper, silver, gold and aluminum.

22. The microelectronic structure of claim 13 , wherein the at least one interconnect comprises a deformable conductive material.

23. The microelectronic structure of claim 22 , wherein the at least one interconnect comprises a polymer filled with a conductive material.

24. The microelectronic structure of claim 22 , wherein the at least one interconnect comprises an adhesive filled with a conductive material.

25. The microelectronic structure of claim 13 , wherein the at least one conductive structure of the microelectronic socket includes a flexible projection contacting at least one of a plurality of contacts disposed proximate the flexible interposer second surface.

26. The microelectronic structure of claim 13 , wherein the at least one socket-to-substrate interconnect comprises solder interconnects.

Assignees

• Intel Corp
• Intel Corp

Inventors

• Tran Donald T
• Zhang Zhichao

Classifications

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W72/07253

  changes in shapes · CPC title

• H10W72/07252

  changes in structures or sizes · CPC title

• H10W72/07236

  Soldering or alloying · CPC title

• H10W72/234

  Cross-sectional shape, i.e. in side view · CPC title