Substrate structure, complementary metal oxide semiconductor device, and method of manufacturing complementary metal oxide semiconductor device

Patent metadata

Field	Value
Publication number	US-9570359-B2
Application number	US-201414510354-A
Country	US
Kind code	B2
Filing date	Oct 9, 2014
Priority date	Oct 31, 2013
Publication date	Feb 14, 2017
Grant date	Feb 14, 2017

Abstract

A substrate structure, a complementary metal oxide semiconductor (CMOS) device including the substrate structure, and a method of manufacturing the CMOS device are disclosed, where the substrate structure includes: a substrate, at least one seed layer on the substrate formed of a material including boron (B) and/or phosphorus (P), and a buffer layer on the seed layer. This substrate structure makes it possible to reduce the thickness of the buffer layer and also improve the performance characteristics of a semiconductor device formed with the substrate structure.

First claim

What is claimed is:

1. A substrate structure comprising:
a substrate;
at least one seed layer provided directly on the substrate wherein the at least one seed layer comprises a graded seed layer having a composition gradient and formed of BGe;
at least one buffer layer directly on the seed layer wherein the buffer layer comprises at least one layer comprising SiGe or GeSn; and
a semiconductor layer directly on the at least one buffer layer, wherein the semiconductor is formed of a group III-V material that comprises at least one of InGaAs, InP, InSb, InGaSb, GaSb, and InAs.

2. The substrate structure of claim 1 , further wherein the buffer layer comprises a graded buffer layer having a composition gradient, and formed of SiGe.

3. The substrate structure of claim 1 , further wherein the buffer layer comprises a Ge buffer-layer component layer directly on the seed layer and an SiGe buffer-layer component layer on the Ge layer.

4. A complementary metal oxide semiconductor (CMOS) device comprising:
a substrate;
at least one seed layer provided directly on the substrate and formed of a material comprising boron (B), BGe, or BSiGe, wherein the seed layer comprises first, second, third and fourth seed-layer component layers, and further wherein the seed-layer component layers comprise boron (B) layers and BGe layers alternately arranged, or BGe layers and BSiGe layers alternately arranged;
at least one buffer layer directly on the seed layer, wherein the buffer layer comprises at least one layer comprising SiGe or GeSn;
a first layer for a first type transistor, the first layer being disposed directly on the buffer layer, wherein the first layer comprises at least one of InGaAs, InP, InSb, InGaSb, GaSb, and InAs;
a second layer for a second type transistor, the second layer being spaced apart from the first layer and disposed directly on the buffer layer, wherein the second layer comprises germanium (Ge); and
a first insulation layer between the first layer and the second layer.

5. The CMOS device of claim 4 , wherein the first type transistor comprises an n-type metal oxide semiconductor field effect transistor (MOSFET), and the second type transistor comprises a p-type MOSFET.

6. The CMOS device of claim 4 , wherein the first insulation layer is disposed directly on the buffer layer.

7. The CMOS device of claim 4 , wherein the first insulation layer passes through the buffer layer and the seed layer.

8. The CMOS device of claim 4 , further comprising a second insulation layer, the second insulation layer being spaced apart from the first insulation layer and being provided on sides of the seed layer, the buffer layer, the first layer and the second layer.

9. The complementary metal oxide semiconductor (CMOS) device of claim 4 , further wherein the buffer layer comprises a graded buffer layer having a composition gradient, and formed of SiGe.

10. The complementary metal oxide semiconductor (CMOS) device of claim 4 , further wherein the buffer layer comprises a Ge buffer-layer component layer directly on the seed layer and an SiGe buffer-layer component layer on the Ge layer.

11. A complementary metal oxide semiconductor (CMOS) device comprising:
a silicon substrate;
at least one seed layer provided directly on the substrate wherein the at least one seed layer comprises a graded seed layer having a composition gradient and formed of BGe;
at least one buffer layer directly on the seed layer, wherein the at least one buffer layer comprises a graded buffer layer having a composition gradient and formed of SiGe;
a first layer for a first type transistor, the first layer being disposed directly on the buffer layer, wherein the first layer comprises at least one of InGaAs, InP, InSb, InGaSb, GaSb, and InAs;
a second layer for a second type transistor, the second layer being spaced apart from the first layer and formed directly on and extending from the silicon substrate, wherein the second layer comprises germanium (Ge); and
an insulation layer between the first layer and the second layer.

12. The CMOS device of claim 11 , wherein the insulation layer is disposed on the seed layer between the second layer and the buffer layer.

13. The CMOS device of claim 11 , wherein the first type transistor comprises an n-type metal oxide semiconductor field effect transistor (MOSFET), and the second type transistor comprises a p-type MOSFET.

14. The complementary metal oxide semiconductor (CMOS) device of claim 11 , further wherein the buffer layer comprises a Ge buffer-layer component layer directly on the seed layer and an SiGe buffer-layer component layer on the Ge layer.

Assignees

• Samsung Electronics Co Ltd

Inventors

• Yang Moon-Seung
• Uddin Mohammad Rakib
• Lee Myoung-Jae
• Lee Sang-Moon
• Lee Sung-Hun
• Cho Seong-Ho

Classifications

• H10P14/3414

  being group IIIA-VIA materials · CPC title

• H10P14/3411

  Silicon, silicon germanium or germanium · CPC title

• H10P14/3251

  consisting of three or more layers · CPC title

• H10P14/3212

  including tin · CPC title

• H10P14/3211

  Silicon, silicon germanium or germanium · CPC title