Mask alignment system for semiconductor processing

Patent metadata

Field	Value
Publication number	US-9570309-B2
Application number	US-201314101974-A
Country	US
Kind code	B2
Filing date	Dec 10, 2013
Priority date	Dec 13, 2012
Publication date	Feb 14, 2017
Grant date	Feb 14, 2017

Abstract

A mask alignment system for providing precise and repeatable alignment between ion implantation masks and workpieces. The system includes a mask frame having a plurality of ion implantation masks loosely connected thereto. The mask frame is provided with a plurality of frame alignment cavities, and each mask is provided with a plurality of mask alignment cavities. The system further includes a platen for holding workpieces. The platen may be provided with a plurality of mask alignment pins and frame alignment pins configured to engage the mask alignment cavities and frame alignment cavities, respectively. The mask frame can be lowered onto the platen, with the frame alignment cavities moving into registration with the frame alignment pins to provide rough alignment between the masks and workpieces. The mask alignment cavities are then moved into registration with the mask alignment pins, thereby shifting each individual mask into precise alignment with a respective workpiece.

First claim

The invention claimed is:

1. A mask alignment system comprising:
a mask frame having a plurality of frame alignment cavities formed therein;
an ion implantation mask movably connected to the mask frame, the mask having a plurality of mask alignment cavities formed therein; and
a platen having a plurality of mask alignment pins extending therefrom, the plurality of mask alignment pins configured to engage the mask alignment cavities, the platen further having a plurality of frame alignment pins extending therefrom, the plurality of frame alignment pins configured to engage the frame alignment cavities;
wherein the mask is disposed between the mask frame and the platen and is configured to engage the platen.

2. The mask alignment system of claim 1 , further comprising a chuck disposed on the platen for holding a workpiece.

3. The mask alignment system of claim 2 further comprising a carrier disposed on the platen for positioning the workpiece on the chuck.

4. The mask alignment system of claim 1 , wherein at least one of the mask alignment cavities has a contoured surface that is configured to guide a respective mask alignment pin into a desired position with respect to the mask alignment cavity.

5. The mask alignment system of claim 4 , wherein at least one mask alignment cavity is conical.

6. The mask alignment system of claim 4 , wherein at least one mask alignment cavity is V-shaped.

7. The mask alignment system of claim 1 , wherein the mask is connected to the mask frame by a plurality of bolts that loosely engage the mask.

8. The mask alignment system of claim 1 , wherein the mask is biased away from the mask frame by at least one spring.

9. The mask alignment system of claim 1 , wherein the mask alignment pins are configured to facilitate positioning of a workpiece on the platen.

10. A mask alignment method comprising:
lowering a mask frame having a plurality of ion implantation masks onto a platen holding a plurality of workpieces, wherein the masks are disposed between the mask frame and the platen and are movably connected to the mask frame;
moving frame alignment cavities of the mask frame into registration with corresponding frame alignment pins on the platen, thereby roughly aligning the masks with the workpieces; and
moving mask alignment cavities of the masks into registration with corresponding mask alignment pins on the platen, thereby shifting each mask into precise alignment with a respective workpiece.

11. The method of claim 10 , further comprising placing each workpiece on a respective chuck on the platen to secure the workpieces on the platen.

12. The method of claim 11 , further comprising moving each workpiece into engagement with a plurality of the mask alignment pins to position and align the workpieces on the platen.

13. The method of claim 10 , further comprising placing each workpiece on a respective carrier on the platen to position the workpieces.

14. The method of claim 10 , wherein the mask alignment cavities are defined by contoured surfaces, and wherein the step of moving the mask alignment cavities of the masks into registration with corresponding mask alignment pins on the platen comprises bringing the mask alignment pins into engagement with the contoured surfaces of respective mask alignment cavities, whereby the mask alignment pins are guided into precisely-located registration with the respective mask alignment cavities.

Assignees

• Varian Semiconductor Equipment Ass Inc

Inventors

• Webb Aaron P
• Carlson Charles T
• Weaver William T
• Grant Christopher N

Classifications

• H10P72/57 Primary

  Mask-wafer alignment · CPC title

• H10P30/22 Primary

  using masks · CPC title

• H01L21/266 Primary

  Electricity · mapped topic

• H01L21/682

  Electricity · mapped topic