Vector inductor having multiple mutually coupled metalization layers providing high quality factor

Patent metadata

Field	Value
Publication number	US-9570222-B2
Application number	US-201313955617-A
Country	US
Kind code	B2
Filing date	Jul 31, 2013
Priority date	May 28, 2013
Publication date	Feb 14, 2017
Grant date	Feb 14, 2017

Abstract

An inductor component includes a plurality of conductive elements, each formed as an individual patch of conductive material, with the conductive elements arranged in a vertical stack and tightly coupled to one another. Dielectric is disposed between more adjacent conductive elements, the dielectric has a permittivity and is sufficiently thin so as to provide a mutual inductance factor of at least one-half or greater between adjacent ones of the conductive elements. The dielectric is typically thinner than the adjacent conductors.

First claim

What is claimed is:

1. An inductor apparatus comprising:
multiple subassemblies including a plurality of conductive elements and a dielectric; the plurality of conductive elements having similar dimensions, each formed as an individual patch of conductive material without a curved propagation path, the plurality of conductive elements arranged in a vertical stack with respect to one another, wherein the plurality of conductive elements comprise a top conductive element, a bottom conductive element, and one or more inner conductive elements of the vertical stack; and
the dielectric disposed between at least two or more adjacent conductive elements of the plurality of conductive elements, the dielectric being sufficiently thin so as to provide a mutual inductance factor of at least one-half (½) or greater between the at least two or more adjacent conductive elements of the plurality of conductive elements, wherein the dielectric has a thickness less than a thickness of each of the at least two or more adjacent conductive elements of the plurality of conductive elements,
wherein the multiple subassemblies are attached to one another with one or more adhesive layers.

2. The apparatus of claim 1 wherein a relative permittivity of the dielectric disposed between the at least two or more adjacent conductive elements in at least one of the multiple subassemblies exhibits a dielectric loss tangent (Tand) much less than 1.

3. The apparatus of claim 1 wherein each of the plurality of conductive elements of at least one of the multiple subassemblies are electrically connected to one another by a plurality of sidewalls.

4. A parallel resonant circuit comprising the inductor apparatus of claim 1 , wherein the parallel resonant circuit comprises a first capacitor connected to the top conductive element of at least one of the multiple subassemblies of the inductor apparatus, and wherein the parallel resonant circuit further comprises a second capacitor connected to the bottom conductive element of at least one of the multiple subassemblies of the inductor apparatus.

5. The apparatus of claim 1 wherein the one or more inner conductive elements of the vertical stack of at least one of the multiple subassemblies comprises a plurality of inner conductive elements.

6. A series resonant circuit comprising the inductor apparatus of claim 1 , wherein the series resonant circuit comprises a first capacitor connected to the top conductive element of at least one of the multiple subassemblies of the inductor apparatus, and wherein the series resonant circuit comprises a second capacitor connected to the bottom conductive element of at least one of the multiple subassemblies of the inductor apparatus.

7. The apparatus of claim 1 wherein at least one of the top conductive element or the bottom conductive element of the stack of at least one of the multiple subassemblies is thicker than each of the one or more inner conductive elements of the vertical stack of at least one of the multiple subassemblies.

8. The apparatus of claim 1 further comprising a printed circuit board substrate, wherein the dielectric comprises a dielectric layer of the printed circuit board substrate, and wherein the top conductive element of at least one of the multiple subassemblies includes a first metal layer of the printed circuit board substrate, wherein the bottom conductive element of at least one of the multiple subassemblies includes a second metal layer of the printed circuit board substrate.

9. The apparatus of claim 8 wherein the printed circuit board substrate comprises an embedded capacitor layer.

10. An inductor apparatus comprising:
multiple subassemblies including a plurality of conductors and a thin dielectric; the plurality of conductors having similar dimensions, each formed as an individual patch of conductive material without a curved propagation path, the plurality of conductors arranged vertically with respect to one another to form a conductor stack, wherein the plurality of conductors comprise an uppermost conductor, a bottommost conductor, and one or more inner conductors of the conductor stack; and
the thin dielectric disposed between two or more adjacent conductors of the plurality of conductors, the thin dielectric having a thickness less than a thickness of each of the two or more adjacent conductors of the plurality of conductors,
wherein the multiple subassemblies are attached to one another with one or more adhesive layers.

11. The apparatus of claim 10 wherein the one or more inner conductors of the vertical stack of at least one of the multiple subassemblies comprises a plurality of inner conductors.

12. The apparatus of claim 10 wherein each of the plurality of conductors are formed from a generally rectangular strip of metal.

13. The apparatus of claim 10 wherein each of the plurality of conductors comprises a metal strip that includes a first stub on a first end of the respective metal strip and a second stub on a second end of the respective metal strip opposite to the first end.

14. The apparatus of claim 10 wherein each of the plurality of conductors have a thickness in a range of from about 0.33 mils to 0.7 mils.

15. The apparatus of claim 10 wherein the thin dielectric of at least one of the multiple subassemblies has a thickness in a range of from 0.3 to 0.315 mils.

16. The apparatus of claim 10 wherein at least one of the uppermost conductor or the bottommost conductor of the stack of at least one of the multiple subassemblies is thicker than each of the one or more inner conductors of the stack of at least one of the multiple subassemblies.

17. The apparatus of claim 10 wherein the plurality of conductors of at least one of the multiple subassemblies have a width in a range of from 40 to 80 mils.

Assignees

• Tdk Corp

Inventors

• Gupta Dev V
• Moussa Mehdi Si

Classifications

• H10W90/754

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/734

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W72/5363

  the connected ends being wedge-shaped · CPC title

• H10W72/931

  Shapes of bond pads · CPC title

• H10W72/536

  the connected ends being ball-shaped · CPC title