Lens array optical coupling to photonic chip

Patent metadata

Field	Value
Publication number	US-9568679-B2
Application number	US-201514936366-A
Country	US
Kind code	B2
Filing date	Nov 9, 2015
Priority date	Aug 16, 2011
Publication date	Feb 14, 2017
Grant date	Feb 14, 2017

Abstract

A photonic integrated circuit apparatus is disclosed. The apparatus includes a photonic chip and a lens array coupling element. The photonic chip includes a waveguide at a side edge surface of the photonic chip. The lens array coupling element is mounted on a top surface of the photonic chip and on the side edge surface. The coupling element includes a lens array that is configured to modify spot sizes of light traversing to or from the waveguide. The coupling element further includes an overhang on a side of the coupling element that opposes the lens array and that abuts the top surface of the photonic chip. The overhang includes a vertical stop surface that has a depth configured to horizontally align an edge of the waveguide with a focal length of the lens array and that vertically aligns focal points of the lens array with the edge of the waveguide.

First claim

What is claimed is:

1. A photonic integrated circuit apparatus comprising:
a photonic chip including a waveguide comprising at least one slot; and
a lens array coupling element mounted on a top surface of the photonic chip, said coupling element including a lens array and including an overhang on a side of the coupling element that opposes the lens array, said overhang including a vertical stop surface that has a depth configured to horizontally align an edge of the waveguide and a surface of the lens array coupling element with a focal length of the lens array and that vertically aligns focal points of the lens array with the edge of the waveguide, wherein the overhang further comprises at least one reference feature that protrudes from the vertical stop surface and has sidewalls that are not perpendicular to a bottom reference feature surface.

2. The apparatus of claim 1 , wherein the overhang includes a second surface having a height configured to effect the vertical alignment with the focal points and the edge of the waveguide.

3. The apparatus of claim 1 , wherein said at least one slot and reference feature are configured to provide a reference for lateral alignment between the focal points of the lens array and the edge of the waveguide.

4. The apparatus of claim 1 , wherein the lens array coupling element further comprises conductive pads disposed on a third surface that is above and is normal to the vertical stop surface and wherein the photonic chip further comprises conductive pads aligned with the conductive pads of the lens array coupling element.

5. The apparatus of claim 3 , wherein the at least one reference feature is disposed in the at least one slot.

6. A photonic integrated circuit coupling system comprising:
a photonic chip including a waveguide that has apertures at a side edge surface of the photonic chip and at least one slot;
an other optical device configured to transmit or receive light to or from the apertures of the waveguide; and
a lens array coupling element mounted on a top surface of the photonic chip, said coupling element including a lens array, said coupling element further including an overhang on a side of the coupling element that opposes the lens array, said overhang including a vertical stop surface that has a depth configured to horizontally align an edge of the waveguide and a surface of the lens array coupling element with a focal length of the lens array and that vertically aligns focal points of the lens array with the edge of the waveguide, wherein the overhang further comprises at least one reference feature that protrudes from the vertical stop surface and has sidewalls that are not perpendicular to a bottom reference feature surface.

7. The system of claim 6 , wherein the other optical device is a second photonic chip including a second waveguide, a fiber array, or a laser array.

8. The system of claim 7 , wherein said other optical device includes a second lens array that is aligned with the lens array of the coupling element such that light from the lens array is collimated between the second lens array and the lens array of the coupling element.

9. The system of claim 6 , wherein said at least one slot and reference feature are configured to provide a reference for lateral alignment between the focal points of the lens array and the edge of the waveguide.

10. The system of claim 6 , wherein the lens array coupling element further comprises conductive pads disposed on a third surface that is above and is normal to the vertical stop surface and wherein photonic chip further comprises conductive pads aligned with the conductive pads of the lens array coupling element.

11. The system of claim 9 , wherein the at least one reference feature is disposed in the at least one slots.

12. A photonic chip coupling device comprising:
a first portion including at least one lens; and
a second portion on an opposing side of the coupling device with respect to the first portion, the second portion including an overhang with a first surface having a depth configured to horizontally align an edge of the waveguide and a surface of the coupling device with a focal length of the at least one lens, wherein the first surface is further configured such that the overhang vertically aligns a focal point of the at least one lens with the edge of a waveguide at a side edge surface of the photonic chip, wherein the overhang further comprises at least one reference feature that protrudes from the vertical stop surface and has sidewalls that are not perpendicular to a bottom reference feature surface.

13. The device of claim 12 , wherein the overhang includes a second surface having a height configured to effect the vertical alignment with the focal point and the edge of the waveguide.

14. The device of claim 12 , wherein the reference feature is configured to provide a reference for lateral alignment between the focal point of the at least one lens and the edge of the waveguide.

15. The device of claim 12 , further comprising at least one conductive pad that is disposed on a third surface that is above and is normal to the first surface.

16. The device of claim 14 , wherein the at least one reference feature is on the first surface and includes a bottom surface that has a length that is equal to the depth of the first surface.

17. The apparatus of claim 1 , wherein the edge of the waveguide abuts the surface of the lens array coupling element at the focal points of the lens array.

Assignees

• IBM

Inventors

• Doany Fuad E
• Lee Benjamin G
• Schow Clint L

Classifications

• H10P50/00

  Etching of wafers, substrates or parts of devices · CPC title

• G02B6/4244

  Mounting of the optical elements · CPC title

• G02B6/425

  Optical features (semiconductor laser arrays H01S5/40; hybrid LED arrays H10W90/00) · CPC title

• G02B6/32 Primary

  having lens focusing means {positioned between opposed fibre ends (with lens being an integral part of the single fibre end G02B6/262)} · CPC title

• G02B6/4204 Primary

  the coupling comprising intermediate optical elements, e.g. lenses, holograms (encapsulated active devices H01S5/02208) · CPC title