Sensing device having a thermal antenna and a method for sensing electromagnetic radiation

Patent metadata

Field	Value
Publication number	US-9568367-B2
Application number	US-201113697375-A
Country	US
Kind code	B2
Filing date	May 23, 2011
Priority date	May 30, 2010
Publication date	Feb 14, 2017
Grant date	Feb 14, 2017

Abstract

A method and a sensing device are provided. The sensing device may include: a thermal antenna that includes a resistive material and has a cross section that has dimensions that are of an order of a micron or of a sub-micron. The thermal antenna may receive electromagnetic radiation and directly convert it to heat. The sensing device may also include a supporting element, a thermal sensor arranged to generate detection signals responsive to a temperature of a sensed area of the thermal sensor, a holding element that may support and thermally isolate the thermal antenna and the thermal sensor and thermally isolate, and a readout circuit that may process the detection signals to provide information about the electromagnetic radiation that is directly converted to heat by the thermal antenna. The thermal antenna and the thermal sensor are spatially separated from the supporting element.

First claim

We claim:

1. A sensing device, comprising:
a thermal antenna that comprises a resistive material, wherein the thermal antenna has at least one cross section that has dimensions that are of an order of a micron or of a sub-micron, wherein the thermal antenna is arranged to receive electromagnetic radiation and to directly convert the electromagnetic radiation to heat; wherein the thermal antenna is shaped as a first loop and is arranged to act as a band pass filter for at least one frequency range out of infrared frequency range and terahertz frequency range;
a supporting element arranged to support a holding element;
a thermal sensor arranged to generate detection signals responsive to a temperature of a sensed area of the thermal antenna;
wherein the holding element is shaped as a second loop for receiving radiation at a second frequency range that differs from the at least one frequency range out of the infrared frequency range and the terahertz frequency range;
wherein the holding element is arranged to:
support the thermal antenna and the thermal sensor; and
thermally isolate the thermal antenna and the thermal sensor from the supporting element; and

a readout circuit that is electrically coupled to the thermal sensor, the readout circuit is arranged to receive the detection signals and to process the detection signals to provide information about the electromagnetic radiation that is directly converted to heat by the thermal antenna; and
wherein the thermal sensor and the thermal antenna are spatially separated from the supporting element.

2. The sensing device according to claim 1 , wherein the thermal antenna is configured so that heat developed in the thermal antenna as a result of a direct conversion of the electromagnetic radiation to heat exceeds by magnitude a heat developed in the thermal antenna as a result of a flow of an electrical current developed in the thermal antenna as a result of the electromagnetic radiation.

3. The sensing device according to claim 1 , wherein the thermal antenna is arranged to convert infrared radiation within the infrared frequency range to heat.

4. The sensing device according to claim 1 , wherein the thermal antenna is arranged to convert terahertz radiation within the terahertz frequency range to heat.

5. The sensing device according to claim 1 , wherein the thermal antenna is arranged to act as a band pass filter for the infrared frequency range and for the terahertz frequency range.

6. The sensing device according to claim 1 , wherein the thermal antenna is bigger than the thermal sensor.

7. The sensing device according to claim 1 , wherein the thermal antenna is at least four times bigger than the thermal sensor.

8. The sensing device according to claim 1 , wherein a spatial separation between the supporting element and each of the thermal antenna and the thermal sensor is obtained by utilizing a Micro Electro Mechanical System (MEMS) micro-machined process.

9. The sensing device according to claim 1 , wherein a spatial separation between the supporting element and each of the thermal antenna and the thermal sensor is obtained by utilizing a Nano Electro Mechanical System (NEMS) nano-machined process.

10. The sensing device according to claim 1 , wherein the thermal sensor is a diode.

11. The sensing device according to claim 1 , wherein the thermal sensor is a transistor.

12. The sensing device according to claim 11 , wherein the transistor is a Metal Oxide Semiconductor (MOS) transistor and the MOS transistor is arranged to operate, when generating the detection signals, at a sub-threshold region.

13. The sensing device according to claim 11 , wherein the transistor is a Metal Oxide Semiconductor (MOS) transistor and the MOS transistor is arranged to operate, when generating the detection signals, outside a sub-threshold region.

14. The sensing device according to claim 11 , wherein drain and gate terminals of the MOS transistor are connected to one interconnect; and wherein bulk and source terminals of the MOS transistor are connected to another interconnect.

15. The sensing device according to claim 1 , wherein the supporting element is formed on an oxide layer.

16. The sensing device according to claim 1 , wherein the supporting element is formed on an oxide layer and the readout circuit is a Complementary Metal Oxide Semiconductor (CMOS) readout circuit.

17. The sensing device according to claim 1 , wherein the supporting element comprises an oxide layer.

18. The sensing device according to claim 1 , wherein the supporting element comprises a silicon germanium layer.

19. The sensing device according to claim 1 , further comprising an electromagnetic reflector that is spaced apart from the thermal antenna.

20. The sensing device according to claim 1 , further comprising a reflector that is spaced apart from the thermal antenna by one fourth of an electromagnetic radiation wavelength of interest.

21. The sensing device according to claim 1 , further comprising a reflector that is spaced apart from the thermal antenna, wherein the thermal antenna faces the reflector.

22. The sensing device according to claim 1 , further comprising a reflector that is spaced apart from the thermal antenna and is positioned as a certain direction in relation to the thermal antenna, wherein the thermal antenna is directed at a direction that is opposite to the certain direction.

23. The sensing device according to claim 1 , wherein the supporting element is connected to the holding element at a single contact point.

24. The sensing device according to claim 1 , wherein the sensed area is distant from a contact point between the thermal antenna and the holding element.

25. The sensing device according to claim 1 , wherein the sensed area is proximate to a contact point between the thermal antenna and the holding element.

26. The sensing device according to claim 1 , wherein the sensed area and a contact point between the thermal antenna and the holding element are located at opposite sides of the loop.

27. The sensing device according to claim 1 , comprising multiple pixels; wherein each pixel comprises a thermal antenna, a thermal sensor and a holding element; wherein the multiple pixels are arranged to form a frequency selective surface (FSS) array.

28. The sensing device according to claim 27 , wherein the multiple pixels are backed by a fourth quarter wavelength grounded conducting reflector.

29. The sensing device according to claim 28 wherein an impedance of the thermal antenna is 377 Ohms.

30. The sensing device according to claim 27 , wherein the multiple pixels are coupled to the readout circuit by row lines and bit lines; wherein at least one segment of the holding element of each pixel is proximate to a line selected of a row line and a bit line such that the line virtually short circuits the electromagnetic radiation absorbed at least in one segment of the holding element.

31. The sensing device according to claim 1 , wherein the thermal antenna comprises multiple loops.

32. The sensing device according to claim 1 , wherein the entirety of the thermal antenna is configured to receive the electromagnetic radiation.

33. The sensing device according to claim 1 , comprising multiple pixels; wherein each pixel compri

Assignees

• Nemirovsky Yael
• Corcos Dan
• Katz Shlomo
• Svetlitza Alexander
• Dolgin Madlena
• Technion Res & Dev Foundation

Inventors

• Nemirovsky Yael
• Corcos Dan
• Katz Shlomo
• Svetlitza Alexander
• Dolgin Madlena

Classifications

• G01T7/00

  Details of radiation-measuring instruments · CPC title

• H01Q21/061

  Two dimensional planar arrays · CPC title

• H01Q7/00

  Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop · CPC title

• H01Q19/10

  using reflecting surfaces · CPC title

• G01J5/024 Primary

  Special manufacturing steps or sacrificial layers or layer structures · CPC title