Honeycomb structure

Patent metadata

Field	Value
Publication number	US-9567885-B2
Application number	US-201514633612-A
Country	US
Kind code	B2
Filing date	Feb 27, 2015
Priority date	Mar 4, 2014
Publication date	Feb 14, 2017
Grant date	Feb 14, 2017

Abstract

There is provided a honeycomb structure where a crack at a honeycomb substrate is reduced. A honeycomb structure has a honeycomb substrate that has a porous partition wall defining a plurality of cells extending from an inflow end face as one end face to an outflow end face as another end face and becoming channels for a fluid, and an outer circumference coating layer disposed at an outer circumference of the honeycomb substrate. At 25 to 800° C., a thermal expansion coefficient of the outer circumference coating layer is larger than a thermal expansion coefficient of the honeycomb substrate. The thermal expansion coefficients of the outer circumference coating layer and the thermal expansion coefficient at 25 to 800° C. preferably meet a relationship represented by the expression: 1.1<(the thermal expansion coefficient of the outer circumference coating layer/the thermal expansion coefficient of the honeycomb substrate)<40.

First claim

What is claimed is:

1. A honeycomb structure, comprising:
a honeycomb substrate that has a porous partition wall defining a plurality of cells, the cells extending from an inflow end face as one end face to an outflow end face as another end face and becoming channels for a fluid; and
an outer circumference coating layer disposed on an outer circumference of the honeycomb substrate,
wherein the outer circumference coating layer contains mica, or the outer circumference coating layer contains alumina and at least one kind selected from the group consisting of alumina fiber, calcined mica and bio-soluble fiber, and
wherein at 25 to 800° C., a thermal expansion coefficient of the outer circumference coating layer is larger than a thermal expansion coefficient of the honeycomb substrate.

2. The honeycomb structure according to claim 1 , wherein the thermal expansion coefficient of the outer circumference coating layer and the thermal expansion coefficient of the honeycomb substrate at 25 to 800° C. meet a relationship represented by Expression: 1.1<(the thermal expansion coefficient of the outer circumference coating layer/the thermal expansion coefficient of the honeycomb substrate)<40.

3. The honeycomb structure according to claim 2 , wherein the honeycomb substrate contains at least one kind selected from the group consisting of silicon carbide, alumina titanate, silicon nitride and cordierite.

4. The honeycomb structure according to claim 1 , wherein the honeycomb substrate contains at least one kind selected from the group consisting of silicon carbide, alumina titanate, silicon nitride and cordierite.

Assignees

• Ngk Insulators Ltd

Inventors

• Ito Mitsuhiro

Classifications

• C04B2111/0081

  as catalysts or catalyst carriers · CPC title

• C04B35/565

  based on silicon carbide · CPC title

• C04B2237/062

  based on silica or silicates · CPC title

• C04B41/009

  characterised by the material treated · CPC title

• C04B2111/32

  Expansion-inhibited materials · CPC title