Ambient cure weatherable coatings

US9567480B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9567480-B2
Application numberUS-201314423503-A
CountryUS
Kind codeB2
Filing dateOct 23, 2013
Priority dateOct 24, 2012
Publication dateFeb 14, 2017
Grant dateFeb 14, 2017

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

An adduct including a reaction product of (a) at least a first cycloaliphatic amine compound; (b) at least a second cycloaliphatic amine compound; and (c) at least one cycloaliphatic epoxy resin compound; a curable epoxy resin coating composition including (i) the above adduct; and (ii) at least one thermosetting epoxy resin compound; said curable composition being curable at ambient temperature; and a cured weatherable coating prepared from the above curable composition.

First claim

Opening claim text (preview).

The invention claimed is: 1. An adduct comprising a reaction product of (a) at least a first cycloaliphatic amine compound; (b) at least a second cycloaliphatic amine compound; and (c) at least one cycloaliphatic epoxy resin compound; wherein the first and second cycloaliphatic amine compounds comprise bis(2-(piperazin-1-yl)ethyl amine; aminoethyl piperazine; isophorone diamine; bis-am inomethylcyclohexane; bis(aminocyclohexyl)methane; or mixtures thereof; provided that the first and second cycloaliphatic amine compounds are not the same compound. 2. The adduct of claim 1 , wherein the at least one cycloaliphatic epoxy resin compound comprises cyclohexanedimethanol epoxy resin; hydrogenated bisphenol A epoxy resin; or mixtures thereof. 3. The adduct of claim 1 , wherein the at least one cycloaliphatic epoxy resin compound comprises 1,4-cyclohexanedimethanol epoxy resin. 4. The adduct of claim 1 , wherein the at least one cycloaliphatic epoxy resin compound comprises a mixture of 1,3-cyclohexanedimethanol epoxy resin and 1,4-cyclohexanedimethanol epoxy resin. 5. The adduct of claim 1 , wherein the first and second cycloaliphatic amine compounds independently have between 2 and 6 amine nitrogen atoms per molecule. 6. The adduct of claim 1 , wherein the first cycloaliphatic amine compound comprises isophorone diamine. 7. The adduct of claim 1 , wherein the second cycloaliphatic amine compound comprises bis(2-(piperazin-1-yl)ethyl amine, bis(aminocyclohexyl)methane, bis-aminomethylcyclohexane, or mixtures thereof. 8. The adduct of claim 1 , wherein the molar ratio of the sum of active hydrogen (N—H) of the first and second cycloaliphatic amine compound to the epoxy functionality of the at least one epoxy resin compound is from about 2 to about 20. 9. A process for preparing a curable composition comprising admixing (A) the adduct of claim 1 ; wherein the at least one cycloaliphatic epoxy resin compound comprises 1,4-cyclohexanedimethanol epoxy resin; hydrogenated bisphenol A epoxy resin; or mixtures thereof; and (B) at least one thermosetting epoxy resin compound; said curable composition being curable at ambient temperature. 10. The process of claim 9 , wherein (C) at least one accelerator compound is admixed with compounds (A) and (B). 11. An adduct comprising a blend of (I) at least a first adduct comprising: (a) at least a first cycloaliphatic amine compound; and (b) at least one cycloaliphatic epoxy resin compound; and (II) at least a second adduct comprising: (a) at least a second cycloaliphatic amine compound; and (b) at least one cycloaliphatic epoxy resin compound; wherein the first and second cycloaliphatic amine compounds comprise bis(2-(piperazin-1-yl)ethyl amine; am inoethyl piperazine; isophorone diamine; bis-aminomethylcyclohexane; bis(aminocyclohexyl)methane; or mixtures thereof; provided that the first and second cycloaliphatic amine compounds are not the same compound. 12. A process for preparing a curable composition comprising admixing (A) the adduct of claim 11 ; wherein the at least one cycloaliphatic epoxy resin compound comprises 1,4-cyclohexanedimethanol epoxy resin; hydrogenated bisphenol A epoxy resin; or mixtures thereof; and (B) at least one thermosetting epoxy resin compound; said curable composition being curable at ambient temperature. 13. A process for preparing an adduct comprising reacting (a) at least a first cycloaliphatic amine compound; (b) at least a second cycloaliphatic amine compound; and (c) at least one cycloaliphatic epoxy resin compound wherein the first and second cycloaliphatic amine compounds comprise bis(2-(piperazin-1-yl)ethyl amine; aminoethyl piperazine; isophorone diamine; bis-am inomethylcyclohexane; bis(aminocyclohexyl)methane; or mixtures thereof; provided that the first and second cycloaliphatic amine compounds are not the same compound. 14. A process for preparing an adduct comprising blending: (I) at least a first adduct comprising the reaction product of: (a) at least a first cycloaliphatic amine compound; and (b) at least one cycloaliphatic epoxy resin compound; and (II) at least a second adduct comprising the reaction product of: (a) at least a second cycloaliphatic amine compound; and (b) at least one cycloaliphatic epoxy resin compound wherein the first and second cycloaliphatic amine compounds comprise bis(2-(piperazin-1-yl)ethyl amine; am inoethyl piperazine; isophorone diamine; bis-am inomethylcyclohexane; bis(aminocyclohexyl)methane; or mixtures thereof; provided that the first and second cycloaliphatic amine compounds are not the same compound. 15. A curable epoxy resin composition comprising (i) an adduct comprising a reaction product of (a) at least a first cycloaliphatic amine compound; (b) at least a second cycloaliphatic amine compound; and (c) at least one cycloaliphatic epoxy resin compound; and (ii) at least one thermosetting epoxy resin compound wherein the first and second cycloaliphatic amine compounds comprise bis(2-(piperazin-1-yl)ethyl amine; am inoethyl piperazine; isophorone diamine; bis-am inomethylcyclohexane; bis(aminocyclohexyl)methane; or mixtures thereof; provided that the first and second cycloaliphatic amine compounds are not the same compound. 16. The curable epoxy resin composition of claim 15 , wherein the at least one cycloaliphatic epoxy resin compound or comprises cyclohexanedimethanol epoxy resin; hydrogenated bisphenol A epoxy resin; or mixtures thereof. 17. The curable epoxy resin composition of claim 15 , wherein the molar ratio of active hydrogen (N-H) in the at least one adduct to the epoxy functionality in the at least one thermosetting epoxy resin compound is from about 0.5 to about 1.5. 18. The curable epoxy resin composition of claim 15 , wherein either the first or second cycloaliphatic amine compound comprises bis(2-(piperazin-l-yl)ethyl amine. 19. The curable epoxy resin composition of claim 15 , wherein the at least one thermosetting epoxy resin compound comprises 1,4-cyclohexanedimethanol epoxy resin. 20. The curable epoxy resin composition of claim 15 , including at least one of a cure catalyst; a second epoxide compound separate and different from the at least one thermosetting epoxy resin compound, a filler, a reactive diluent, a flexibilizing agent, a processing aide, a toughening agent, or a mixture thereof. 21. A process for preparing thermoset comprising: (I) providing a curable composition of: (i) an adduct of (a) at least one cycloaliphatic amine compound, and (b) at least one epoxy resin compound; wherein the at least one epoxy resin compound comprises 1,4-cyclohexanedimethanol epoxy resin; hydrogenated bisphenol A epoxy resin; or mixtures thereof; and (ii) at least one thermosetting epoxy resin compound; said curable composition being curable at ambient temperature; and (II) curing the curable composition of step (I); wherein the at least one cycloaliphatic amine compound comprises bis(2-(piperazin-1-yl)ethyl amine; aminoethvl piperazine; isophorone diamine; bis-aminomethylcyclohexane; bis(aminocyclohexyl)methane; or mixtures thereof. 22. The process of claim 21 , wherein (iii) at least one accelerator compound is admixed with compounds (i) and (ii) in step (I). 23. A cured thermoset article prepared by the process of claim 21 . 24. The cured thermoset article of claim 23 comprising a weatherable coating.

Assignees

Inventors

Classifications

  • C09D163/00Primary

    Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins · CPC title

  • containing nitrogen · CPC title

  • carbocyclic · CPC title

  • aliphatic · CPC title

  • cycloaliphatic · CPC title

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What does patent US9567480B2 cover?
An adduct including a reaction product of (a) at least a first cycloaliphatic amine compound; (b) at least a second cycloaliphatic amine compound; and (c) at least one cycloaliphatic epoxy resin compound; a curable epoxy resin coating composition including (i) the above adduct; and (ii) at least one thermosetting epoxy resin compound; said curable composition being curable at ambient temperatur…
Who is the assignee on this patent?
Blue Cube Ip Llc
What technology area does this patent fall under?
Primary CPC classification C09D163/00. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Feb 14 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).