Thermally shrinkable laminate film for deep drawing, packaged article, and method for packaging of cheese

US9566768B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9566768-B2
Application numberUS-80847508-A
CountryUS
Kind codeB2
Filing dateNov 17, 2008
Priority dateDec 17, 2007
Publication dateFeb 14, 2017
Grant dateFeb 14, 2017

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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Abstract

Official abstract text for this publication.

The invention has for its object to provide a heat-shrinkable laminated film for deep drawing, which has an increased carbon dioxide transmission rate (CO 2 TR) and an enhanced ratio (CO 2 TR/O 2 TR) of carbon dioxide transmission rate-to-oxygen transmission rate (O 2 TR), and is less susceptible to pinholes. In the inventive heat-shrinkable laminated film for deep drawing, a polyamide resin composition layer (a) containing a polyamide resin mixture comprising 60 to 95% by mass of an aliphatic polyamide resin (A) and 5 to 40% by mass of a polyamide base resin (B) having a heat of crystalline fusion of 5 to 40 J/g is laminated onto a heat-sealing resin layer (a) containing a polyolefin resin via an adhesive resin layer (b).

First claim

Opening claim text (preview).

What we claim is: 1. A heat-shrinkable laminated film for deep drawing, wherein a polyamide resin composition layer (a) containing a polyamide resin mixture comprising 60 to 95% by mass of an aliphatic polyamide resin (A) and 5 to 40% by mass of a polyamide base resin (B) having a heat of crystalline fusion of 5 to 35 J/g and a density of 0.95 to 1.10 g/cm3 is laminated onto a heat-sealing resin layer (c) containing a polyolefin resin via an adhesive resin layer (b), and the heat of crystalline fusion ΔHA of the aliphatic polyamide (A) and the heat of crystalline fusion ΔHB of the polyamide base resin (B) satisfy the following condition (1): Δ HA>ΔHB   (1), wherein said aliphatic polyamide resin (A) consists of only a nylon 6-66 or only a nylon 6-12, and wherein said polyamide base resin (B) is a polyamide/polyether block copolymer. 2. The heat-shrinkable laminated film for deep drawing according to claim 1 , which has a heat shrinkage of 3 to 35% at 90° C. in machine and transverse directions, an oxygen transmission rate of up to 300 ml/m2·day·am at 23° C. and an 80% relative humidity, a carbon dioxide transmission of at least 500 ml/m2·day·atm at 23° C. and an 80% relative humidity, and a carbon dioxide transmission rate-to-oxygen transmission rate of at least 6. 3. The heat-shrinkable laminated film for deep drawing according to claim 2 , which has a carbon dioxide transmission rate of at least 800 ml/m2·day·atm at 23° C. and an 80% relative humidity and a carbon dioxide transmission rate-to-oxygen transmission rate of at least 7. 4. The heat-shrinkable laminated film for deep drawing according to claim 3 , wherein said polyamide resin composition layer (a) has a thickness of 5 to 50 μm. 5. The heat-shrinkable laminated film for deep drawing according to claim 4 , wherein a polyester base resin layer (d) is laminated onto said polyamide resin composition layer (a). 6. A package, wherein a matter to be packed is packed up in top and bottom films obtained by deep drawing of the heat-shrinkable laminated film for deep drawing according to claim 5 . 7. The package according to claim 6 , wherein the matter to be packed is cheese.

Assignees

Inventors

Classifications

  • Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain (of polyhydrazides C08L79/06; of polyamideimides or polyamide acids C08L79/08); Compositions of derivatives of such polymers · CPC title

  • Shrinkable or shrunk [e.g., due to heat, solvent, volatile agent, restraint removal, etc.] · CPC title

  • comprising polyamides · CPC title

  • Food packaging · CPC title

  • characterised by the choice of material · CPC title

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What does patent US9566768B2 cover?
The invention has for its object to provide a heat-shrinkable laminated film for deep drawing, which has an increased carbon dioxide transmission rate (CO 2 TR) and an enhanced ratio (CO 2 TR/O 2 TR) of carbon dioxide transmission rate-to-oxygen transmission rate (O 2 TR), and is less susceptible to pinholes. In the inventive heat-shrinkable laminated film for deep drawing, a polyamide resin co…
Who is the assignee on this patent?
Ibe Seiichi, Itoh Tadayoshi, Ishii Hitoshi, and 1 more
What technology area does this patent fall under?
Primary CPC classification B32B27/08. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Feb 14 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).