Structural body and wiring board

Patent metadata

Field	Value
Publication number	US-9564870-B2
Application number	US-201314412311-A
Country	US
Kind code	B2
Filing date	Mar 28, 2013
Priority date	Jul 2, 2012
Publication date	Feb 7, 2017
Grant date	Feb 7, 2017

Abstract

A second conductor plane ( 102 ) is formed in a layer different from a layer in which a first conductor plane ( 101 ) is formed, and faces the first conductor plane ( 101 ). A first transmission line ( 104 ) is formed in a layer different from the layers in which the first conductor plane ( 101 ) and the second conductor plane ( 102 ) are formed, and faces the second conductor plane ( 102 ), and one end thereof is an open end. A conductor via ( 106 ) connects the other end of the first transmission line ( 104 ) and the first conductor plane ( 101 ). An insular conductor ( 112 ) is connected to a portion of the first transmission line ( 104 ) other than a portion thereof at which the transmission line ( 104 ) is attached to the conductor via ( 106 ), is located in a layer different from the layer in which the second conductor plane ( 102 ) is located, and faces the second conductor plane ( 102 ).

First claim

The invention claimed is:

1. A structural body comprising:
a first conductor;
a second conductor that is formed in a layer different from a layer in which the first conductor is formed, and that faces the first conductor;
a first transmission line that is formed in a layer different from the layers in which the first conductor and the second conductor are formed, that faces the second conductor, and that has one end being an open end,
a first conductor via connecting another end of the first transmission line and the first conductor; and
at least a capacitance imparting member that is physically connected to the first transmission line by a conductor and that forms a capacitance between the capacitance imparting member and the second conductor.

2. The structural body according to claim 1 , wherein the first conductor, the second conductor, the first transmission line, the first conductor via, and the capacitance imparting member form an electromagnetic bandgap (EBG) structure.

3. The structural body according to claim 1 , wherein the capacitance imparting member is a third conductor that is formed in a layer different from the layer in which the second conductor is formed and that faces the second conductor.

4. The structural body according to claim 1 , wherein
the capacitance imparting member is a second transmission line, and
one end of the second transmission line is connected to the first transmission line, and another end thereof is an open end.

5. The structural body according to claim 1 , wherein the capacitance imparting member is a chip capacitor.

6. The structural body according to claim 1 , wherein, when the first transmission line has a length l os , the capacitance imparting member is connected to the first transmission line at a position located between positions (2k−2)l os /2n−l os /4n away and (2k−2)l os /(2n−1)+l os /4n (for k=2, . . . , n) from the open end or between positions (2k−2)l os /2n and (2k−2)l os /(2n−1)+l os /4n (for k=1) away from the open end.

7. The structural body according to claim 1 , wherein the capacitance imparting member is connected to the first transmission line at a position the distance of which from the open end is equal to or larger than ⅜ of the length of the first transmission line and is equal to or smaller than 19/24 thereof.

8. The structural body according to claim 1 , wherein the capacitance imparting member is connected to the first transmission line at a position the distance of which from the open end is equal to or larger than 1/16 of the length of the first transmission line and is equal to or smaller than 7/12 thereof.

9. A wiring board comprising:
a first conductor;
a second conductor that is formed in a layer different from a layer in which the first conductor is formed, and that faces the first conductor;
a first transmission line that is formed in a layer different from the layers in which the first conductor and the second conductor are formed, that faces the second conductor, and that has one end being an open end,
a first conductor via that connects another end of the first transmission line and the first conductor; and
at least a capacitance imparting member that is physically connected to the first transmission line by a conductor and that forms a capacitance between the capacitance imparting member and the second conductor.

10. The wiring board according to claim 9 , wherein the first conductor, the second conductor, the first transmission line, the first conductor via, and the capacitance imparting member form an electromagnetic bandgap (EBG) structure.

Assignees

• Nec Corp

Inventors

• Kasahara Yoshiaki
• Toyao Hiroshi

Classifications

• H05K1/162

  incorporating printed capacitors · CPC title

• H03H7/0115

  comprising only inductors and capacitors (H03H7/075, H03H7/09, H03H7/12, H03H7/13 take precedence) · CPC title

• H01Q15/0066

  said selective devices being reconfigurable, tunable or controllable, e.g. using switches · CPC title

• H01P1/203

  Strip line filters · CPC title

• H05K2201/09672

  Superposed layout, i.e. in different planes · CPC title