Assembly having a substrate, an SMD component, and a lead frame part

US9564789B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9564789-B2
Application numberUS-201214004086-A
CountryUS
Kind codeB2
Filing dateMar 7, 2012
Priority dateMar 9, 2011
Publication dateFeb 7, 2017
Grant dateFeb 7, 2017

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

An assembly, having a substrate made of an electrically insulating material, an SMD component, which has lateral contact surfaces, and a lead frame part made of metal, which is fastened to the substrate and is used to establish electrical connections between the lateral contact surfaces of the SMD component and further functional elements of the assembly, wherein the lead frame part has contact tongues, which resiliently lie against the lateral contact surfaces and are connected to the lateral contact surfaces in a bonded manner.

First claim

Opening claim text (preview).

The invention claimed is: 1. An assembly comprising: a substrate embodied from an electrically insulating material having a depression formed in a face of the substrate; an SMD component arranged in the depression and having lateral contact surfaces; and a stamped lead frame part embodied from metal and fastened to the substrate, the stamped lead frame part configured to establish electrical connections between the lateral contact surfaces of the SMD component and further functional elements of the assembly, wherein the stamped lead frame part comprises contact tongues that lie in a resilient manner against the lateral contact surfaces and are connected by a positive material connection to the lateral contact surfaces, wherein the depression comprises a base and lateral wall faces that extend from the base towards the face, wherein the lateral wall faces are arranged in an inclined manner in the region of the contact tongues, so that an angle in a range from 95° to 140° is produced between a lateral wall face and an adjoining portion of the face defining free space for the contact tongues. 2. The assembly as claimed in claim 1 , wherein the contact tongues protrude into the depression. 3. The assembly as claimed in claim 2 , wherein the stamped lead frame part is fastened to the face of the substrate. 4. The assembly as claimed in claim 2 , wherein the contact tongues protrude out from the face into the depression. 5. The assembly as claimed in claim 2 , wherein the contact tongues are arranged at a distance from the lateral wall faces. 6. The assembly as claimed in claim 2 , wherein at least one respective contact tongue is arranged on each of at least two sides of the depression. 7. The assembly as claimed in claim 2 , wherein the contact tongues comprise a first portion that is curved around an edge of the depression and is arranged at a distance from each of: the edge of the depression, a lateral wall face of the depression, and the face of the substrate. 8. The assembly as claimed in claim 2 , wherein at least one respective contact tongue is arranged on each side of the depression. 9. The assembly as claimed in claim 1 , wherein the substrate is produced in an injection molding process. 10. The assembly as claimed in claim 9 , wherein the substrate is connected to the stamped lead frame part in the injection molding process. 11. The assembly as claimed in claim 1 , wherein the stamped lead frame part is adhered to the substrate. 12. The assembly as claimed in claim 1 , wherein the contact tongues are embodied in one piece with the stamped lead frame part by reshaping and cutting the stamped lead frame part. 13. The assembly as claimed in claim 1 , further comprising an encapsulation compound that encases the SMD component and the contact tongues. 14. The assembly as claimed in claim 1 , wherein SMD component is a ceramic condenser having four lateral contact surfaces, wherein each two lateral contact surfaces lie as a pair opposite one another. 15. The assembly as claimed in claim 1 , wherein the substrate is a housing part of an electric motor and the stamped lead frame part establishes electrical connections of the electric motor. 16. The assembly as claimed in claim 15 , wherein the housing part of the electric motor is a motor part end cap. 17. The assembly as claimed in claim 1 , wherein the further functional elements of the assembly are brush holders. 18. An assembly comprising: a substrate embodied from an electrically insulating material; an SMD component having lateral contact surfaces; and a stamped lead frame part embodied from metal and fastened to the substrate, the stamped lead frame part configured to establish electrical connections between the lateral contact surfaces of the SMD component and further functional elements of the assembly, wherein the stamped lead frame part comprises contact tongues that lie in a resilient manner against the lateral contact surfaces and are connected by a positive material connection to the lateral contact surfaces, wherein: the substrate comprises a depression formed in a face of the substrate, the SMD component is arranged in the depression, and the contact tongues protrude into the depression, and wherein the contact tongues comprise a material thickness (d s ) that is less than a material thickness (d L ) of the stamped lead frame part in a portion that is remote from the depression.

Assignees

Inventors

Classifications

  • Cross-Sectional Technologies · mapped topic

  • Structural association with other electrical or electronic devices · CPC title

  • Metallic part with specific elastic properties, e.g. bent piece of metal as electrical contact · CPC title

  • Non-printed filter · CPC title

  • Tab · CPC title

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Frequently asked questions

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What does patent US9564789B2 cover?
An assembly, having a substrate made of an electrically insulating material, an SMD component, which has lateral contact surfaces, and a lead frame part made of metal, which is fastened to the substrate and is used to establish electrical connections between the lateral contact surfaces of the SMD component and further functional elements of the assembly, wherein the lead frame part has contact…
Who is the assignee on this patent?
Wallrafen Werner, Continental Automotive Gmbh
What technology area does this patent fall under?
Primary CPC classification H02K11/0094. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Feb 07 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).