Lightweight cavity filter structure

Patent metadata

Field	Value
Publication number	US-9564672-B2
Application number	US-201213426257-A
Country	US
Kind code	B2
Filing date	Mar 21, 2012
Priority date	Mar 22, 2011
Publication date	Feb 7, 2017
Grant date	Feb 7, 2017

Abstract

Embodiments provide a novel fabrication method and structure for reducing structural weight in radio frequency cavity filters and novel filter structure. The novel filter structure is fabricated by electroplating the required structure over a mold. The electrodeposited composite layer may be formed by several layers of metal or metal alloys with compensating thermal expansion coefficients. The first or the top layer is a high conductivity material or compound such as silver having a thickness of several times the skin-depth at the intended frequency of operation. The top layer provides the vital low loss performance and high Q-factor required for such filter structures while the subsequent compound layers provide the mechanical strength.

First claim

What is claimed is:

1. A lightweight radio frequency electrical structure, comprising:
a conductor structure having an exposed contoured surface shaped to a surface of a circuit structure that is associated with an operating radio frequency; and
a rigid conformal mechanical support structure attached to the conductor structure,
wherein the conductor structure comprises at least one conductor layer, with a first conductor layer comprising conductive paint, and wherein the conductor structure further comprises at least one of electro-less deposited material and electroplated material, with the electro-less deposited material and the electroplated material each comprising one of a metal and a metal alloy.

2. The electrical structure of claim 1 wherein a total thickness of the conductor structure is one to several times a skin depth associated with the operating radio frequency.

3. The electrical structure of claim 1 where a total thickness of the conductor structure is approximately ten micrometers.

4. The electrical structure of claim 1 wherein each conductor layer has a thickness in the range of less than one micrometer to several micrometers.

5. The electrical structure of claim 1 wherein the conductor structure comprises a copper layer covered by a silver layer.

6. The electrical structure of claim 1 wherein the circuit structure comprises one of an antenna, an antenna array, an active antenna array, an antenna array combined with a filter/duplexer, and a cavity resonator filter.

7. The electrical structure of claim 1 wherein the support structure further comprises one of braces, walls, and plates.

8. The electrical structure of claim 1 wherein the support structure comprises a reinforcing foam filling the conductor structure.

9. The electrical structure of claim 1 wherein the support structure comprises a laminate structure comprising multiple adjacent layers each comprising at least one of a metal, a metal alloy, an insulator, and a metal alloy interspersed with insulators, and wherein each layer of the laminate structure has a thermal expansion coefficient with an opposite sign than that of an adjacent layer of the laminate structure.

10. The electrical structure of claim 1 wherein the support structure comprises an insulated housing comprising one of a light plastic and polystyrene.

11. The electrical structure of claim 1 wherein the support structure has a total thickness in the range of one to several millimeters.

12. A lightweight radio frequency electrical structure produced by a process comprising the steps of:
providing a mold having a contoured surface inversely shaped to a surface of a circuit structure that is associated with an operating radio frequency,
depositing a conformal first conductor layer onto the mold, the first conductor layer comprising conductive paint;
depositing at least a second conductor layer onto the first conductor layer employing an electroplating process;
depositing one or more layers of laminate onto the conductor layers, wherein the one or more layers of laminate is adapted for providing conformal mechanical support to the conductor layers; and
separating the conductor layers from the mold to provide the electrical structure.

13. The electrical structure produced by the process set out in claim 12 wherein the circuit structure comprises one of an antenna, an antenna array, an active antenna array, an antenna array combined with a filter/duplexer, and a cavity resonator filter.

14. The electrical structure produced by the process set out in claim 12 whereby a total conductor layer thickness of one to several times a skin depth associated with the operating radio frequency provides a reduced total conductor layer thickness compared with machined or cast structures without affecting electrical characteristics of resonator Q-factors or transmission coefficients.

15. The electrical structure produced by the process set out in claim 12 , wherein the process further comprises one of welding and brazing at least one of plates and laminates to the electrical structure.

16. A lightweight radio frequency electrical structure produced by a process comprising the steps of:
providing a rigid insulated housing having a contoured surface shaped to a surface of a circuit structure that is associated with an operating radio frequency;
depositing a conformal first conductor layer onto the housing, the first conductor layer comprising conductive paint; and
depositing at least a second conductor layer onto the first conductor layer employing an electroplating process.

17. The electrical structure of claim 16 wherein the circuit structure comprises one of an antenna, an antenna array, an active antenna array, an antenna array combined with a filter/duplexer, and a cavity resonator filter.

18. The electrical structure produced by the process set out in claim 16 , whereby a total conductor thickness of one to several times a skin depth associated with the operating radio frequency provides a reduced total conductor thickness compared with machined or cast structures without affecting electrical characteristics of resonator Q-factors or transmission coefficients.

19. The electrical structure produced by the process set out in claim 16 , wherein the process further comprises one of welding and brazing at least one of plates and laminates to the electrical structure.

Assignees

• Burke Ian
• Cook Jason
• Khanifar Ahmad
• Intel Corp

Inventors

• Burke Ian
• Cook Jason
• Khanifar Ahmad

Classifications

• C23C28/023

  only coatings of metal elements only · CPC title

• C23C18/1653

  Two or more layers with at least one layer obtained by electroless plating and one layer obtained by electroplating · CPC title

• H01P11/007 Primary

  Manufacturing frequency-selective devices (resonators H01P11/008) · CPC title

• C23C18/1657

  Electroless forming, i.e. substrate removed or destroyed at the end of the process · CPC title

• H01P1/2138

  using hollow waveguide filters (H01P1/2131 takes precedence) · CPC title