Optoelectronic component and method for the production thereof

Patent metadata

Field	Value
Publication number	US-9564566-B2
Application number	US-201414909850-A
Country	US
Kind code	B2
Filing date	Aug 5, 2014
Priority date	Aug 8, 2013
Publication date	Feb 7, 2017
Grant date	Feb 7, 2017

Abstract

An optoelectronic component includes a housing having an electrically conductive first contact section, and an optoelectronic semiconductor chip arranged on the first contact section, wherein the optoelectronic semiconductor chip and the first contact section are at least partly covered by a first layer including a silicone, a second layer including SiO 2 is arranged at a surface of the first layer, the second layer has a thickness of 10 nm to 1 μm, and a third layer is arranged above the second layer.

First claim

The invention claimed is:

1. An optoelectronic component comprising:
a housing having an electrically conductive first contact section; and
an optoelectronic semiconductor chip arranged on the first contact section,
wherein the optoelectronic semiconductor chip and the first contact section are at least partly covered by a first layer comprising a silicone,
a second layer comprising SiO 2 is arranged at a surface of the first layer,
the second layer has a thickness of 10 nm to 1 μm, and
a third layer is arranged above the second layer.

2. The optoelectronic component as claimed in claim 1 , wherein the first contact section comprises copper.

3. The optoelectronic component as claimed in claim 1 ,
wherein the housing has a housing frame, and
the first contact section is embedded into the housing frame.

4. The optoelectronic component as claimed in claim 1 ,
wherein the housing has a cavity, and
the first contact section is arranged in a base region of the cavity.

5. The optoelectronic component as claimed in claim 1 , wherein the first layer has a thickness of 1 μm to 100 μm.

6. The optoelectronic component as claimed in claim 1 , wherein the second layer has a thickness of 50 nm to 200 nm.

7. The optoelectronic component as claimed in claim 1 , further comprising:
an electrically conductive connection between the optoelectronic semiconductor chip and the second contact section,
wherein the housing has an electrically conductive second contact section electrically insulated from the first contact section.

8. A method of producing an optoelectronic component comprising:
providing a housing having an electrically conductive first contact section;
arranging an optoelectronic semiconductor chip on the first contact section;
arranging a first layer comprising a silicone on at least parts of the optoelectronic semiconductor chip and the first contact section;
forming a second layer comprising SiO 2 at a surface of the first layer, wherein forming the second layer is carried out by converting a part of the first layer; and
arranging a third layer above the second layer.

9. The method as claimed in claim 8 , wherein converting the part of the first layer is carried out by oxidation.

10. The method as claimed in claim 8 , wherein converting the part of the first layer is carried out by a plasma treatment.

11. The method as claimed in claim 8 , wherein arranging the first layer is carried out by potting or jetting.

Assignees

• Osram Opto Semiconductors Gmbh

Inventors

• Kromotis Patrick
• Hofmann Emanuel
• Peyker Ludwig
• Baade Torsten
• Kiener Simone
• Grosse Kristin

Classifications

• H10W90/756

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W90/736

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W76/47

  Solid or gel fillings · CPC title

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title

• H10W72/5363

  the connected ends being wedge-shaped · CPC title