Substrate for suspension, process for producing the same, suspension for magnetic head, and hard disk drive

Patent metadata

Field	Value
Publication number	US-9564153-B2
Application number	US-201414551663-A
Country	US
Kind code	B2
Filing date	Nov 24, 2014
Priority date	Apr 18, 2007
Publication date	Feb 7, 2017
Grant date	Feb 7, 2017

Abstract

A substrate for suspension comprises a metallic substrate, an insulating layer formed on the metallic substrate, a conductor layer formed on the insulating layer, and a cover layer covering the conductor layer. The insulating layer and the cover layer are formed from different materials, whose coefficients of hygroscopic expansion are in the range between 3×10 −6 /% RH and 30×10 −6 /% RH. The difference between the coefficients of hygroscopic expansion of the two materials is 5×10 −6 /% RH or less.

First claim

The invention claimed is:

1. A substrate for suspension, comprising:
a metallic substrate,
an insulating layer formed from an insulating-layer-forming material on the metallic substrate,
a conductor layer formed on the insulating layer, and
a cover layer formed from a cover-layer-forming material on the insulating layer, covering at least a part of the conductor layer,
wherein the insulating-layer-forming material and the cover-layer-forming material are different materials,
wherein the insulating-layer-forming material and the cover-layer-forming material are formed of a polyimide precursor solution including an acid anhydride and a diamine,
wherein the insulating-layer-forming material and the cover-layer-forming material are subjected to a heat treatment so that the insulating-layer-forming material and the cover-layer-forming material have coefficients of hygroscopic expansion of 0/% RH to 30×10 −6 /% RH, the difference between the coefficients of hygroscopic expansion of the two materials being in the range between 0/% RH and 5×10 −6 /% RH,
wherein the insulating-layer-forming material and the cover-layer-forming material have a repeating unit represented by the following formula:

wherein R 1 is a tetravalent organic group, R 2 is a divalent organic group, R 1 and R 2 being either a single structure or a combination of two or more structures, and n is a natural number of 1 or more,
wherein the insulating-layer-forming material and the cover-layer-forming material have coefficients of thermal expansion of 15×10 −6 /° C. to 30×10 −6 /° C., and the difference between the coefficients of thermal expansion of the two materials is 10×10 −6 /° C. or less, and
wherein the metallic substrate has an open area formed by etching in the metallic substrate so as to expose the insulating layer outside through the open area and to decrease a rigidity of the substrate for suspension, and a warpage of a 50 mm×10 mm strip of the metallic substrate is 0.5 mm or less when placed in a thermo-hygrostat at 85° C. and 85% RH for one hour.

2. The substrate for suspension according to claim 1 , wherein both of the insulating-layer-forming material and the cover-layer-forming material, or either of the two, is non-photosensitive.

3. A magnetic head suspension comprising a substrate for suspension,
the substrate for suspension comprising:
a metallic substrate,
an insulating layer formed from an insulating-layer-forming material on the metallic substrate,
a conductor layer formed on the insulating layer, and
a cover layer formed from a cover-layer-forming material on the insulating layer, covering at least a part of the conductor layer,
wherein the insulating-layer-forming material and the cover-layer-forming material are different materials,
wherein the insulating-layer-forming material and the cover-layer-forming material are formed of a polyimide precursor solution including an acid anhydride and a diamine,
wherein the insulating-layer-forming material and the cover-layer-forming material are subjected to a heat treatment so that the insulating-layer-forming material and the cover-layer-forming material have coefficients of hygroscopic expansion of 0/% RH to 30×10 −6 /% RH, the difference between the coefficients of hygroscopic expansion of the two materials being in the range between 0/% RH and 5×10 −6 /% RH,
wherein the insulating-layer-forming material and the cover-layer-forming material have a repeating unit represented by the following formula:

wherein R 1 is a tetravalent organic group, R 2 is a divalent organic group, R 1 and R 2 being either a single structure or a combination of two or more structures, and n is a natural number of 1 or more,
wherein the insulating-layer-forming material and the cover-layer-forming material have coefficients of thermal expansion of 15×10 −6 /° C. to 30×10 −6 /° C., and the difference between the coefficients of thermal expansion of the two materials is 10×10 −6 /° C. or less, and
wherein the metallic substrate has an open area formed by etching in the metallic substrate so as to expose the insulating layer outside through the open area and to decrease a rigidity of the substrate for suspension, and a warpage of a 50 mm×10 mm strip of the metallic substrate is 0.5 mm or less when placed in a thermo-hygrostat at 85° C. and 85% RH for one hour.

4. A hard disk drive comprising a substrate for suspension,
the substrate for suspension comprising:
a metallic substrate,
an insulating layer formed from an insulating-layer-forming material on the metallic substrate,
a conductor layer formed on the insulating layer, and
a cover layer formed from a cover-layer-forming material on the insulating layer, covering at least a part of the conductor layer,
wherein the insulating-layer-forming material and the cover-layer-forming material are different materials,
wherein the insulating-layer-forming material and the cover-layer-forming material are formed of a polyimide precursor solution including an acid anhydride and a diamine,
wherein the insulating-layer-forming material and the cover-layer-forming material are subjected to a heat treatment so that the insulating-layer-forming material and the cover-layer-forming material have coefficients of hygroscopic expansion of 0/% RH to 30×10 −6 /% RH, the difference between the coefficients of hygroscopic expansion of the two materials being in the range between 0/% RH and 5×10 −6 /% RH,
wherein the insulating-layer-forming material and the cover-layer-forming material have a repeating unit represented by the following formula:

wherein R 1 is a tetravalent organic group, R 2 is a divalent organic group, R 1 and R 2 being either a single structure or a combination of two or more structures, and n is a natural number of 1 or more,
wherein the insulating-layer-forming material and the cover-layer-forming material have coefficients of thermal expansion of 15×10 −6 /° C. to 30×10 −6 /° C., and the difference between the coefficients of thermal expansion of the two materials is 10×10 −6 /° C. or less, and
wherein the metallic substrate has an open area formed by etching in the metallic substrate so as to expose the insulating layer outside through the open area and to decrease a rigidity of the substrate for suspension, and a warpage of a 50 mm×10 mm strip of the metallic substrate is 0.5 mm or less when placed in a thermo-hygrostat at 85° C. and 85% RH for one hour.

Assignees

• Dainippon Printing Co Ltd

Inventors

• Hitomi Yoichi
• Kumon Shinji
• Momose Terutoshi
• Sakayori Katsuya
• Takachi Kiyohiro
• Miura Yoichi
• Yamazaki Tsuyoshi

Classifications

• Y10T428/1157

  Substrate composition · CPC title

• Y10T428/1179

  Head with slider structure · CPC title

• H05K1/056

  the metal substrate being covered by an organic insulating layer · CPC title

• G11B5/3103

  Structure or manufacture of integrated heads or heads mechanically assembled and electrically connected to a support or housing · CPC title

• H05K3/28

  Applying non-metallic protective coatings {(H05K3/0091 takes precedence; methods for intermediate insulating layers for build-up multilayer circuits H05K3/4673)} · CPC title