Temperature measuring device of a power semiconductor apparatus

Patent metadata

Field	Value
Publication number	US-9562812-B2
Application number	US-201213607017-A
Country	US
Kind code	B2
Filing date	Sep 7, 2012
Priority date	Sep 7, 2011
Publication date	Feb 7, 2017
Grant date	Feb 7, 2017

Abstract

A temperature measuring device of a power semiconductor apparatus that accurately detects chip temperature even where a gradient of the measured characteristic line segment is different from a designed gradient, including a chip temperature detecting circuit that includes an A/D converter delivering a measurement value of a digital converted forward voltage across a temperature detecting diode and an operational processing unit for calibration and chip temperature calculation. In calibration processing, different known reference voltages are applied by a reference connected in place of the diode and a gradient of the line segment connecting the measurement values is calculated. The gradient is stored in a memory with an offset correction value that is one of the measurement values. A chip temperature is calculated based on a forward voltage across the diode calculated based on the measurement value and the stored values of the gradient and the offset correction value.

First claim

What is claimed is:

1. A temperature measuring device of a power semiconductor apparatus, the power semiconductor apparatus including a silicon chip with a power switching element and a temperature detecting diode thereon, the temperature measuring device detecting a chip temperature of the power switching element, the temperature measuring device comprising:
a constant current source that supplies constant current to the temperature detecting diode,
an A/D converter that outputs digital values representing forward voltage across the temperature detecting diode,
an operational processing unit that calculates the chip temperature based on the digital values, the operational processing unit including a calibration processing section and a chip temperature calculating section, and
a memory,
a reference voltage source that successively generates a plurality of known reference voltages,
a calibration processing section that selectively connects the reference voltage source to input terminals of the chip temperature calculating section and simultaneously disconnects the temperature detecting diode from the input terminals of the chip temperature calculating section, where the calibrating section calculates a gradient of a line segment connecting the digital values outputted from the A/D converter when the plurality of reference voltages are applied,
wherein the gradient and an offset correction value of the digital values are stored in the memory, and
wherein the chip temperature calculating section calculates the chip temperature according to a corrected value based on a measurement value of the digital values and also based on the gradient and the offset correction value.

2. The temperature measuring device according to claim 1 , wherein the calibration processing section measures plural times to obtain digital calibration values corresponding to each value of the reference voltage and calculates a mean value thereof.

3. The temperature measuring device according to claim 1 , further comprising:
a pulse width modulation circuit that generates a pulse width modulation signal dependent upon the forward voltage across the temperature detecting diode,
an electrically isolated transmission circuit that transmits the pulse width modulation signal, and
a low pass filter that smooths a signal received from the isolated transmission circuit and supplies the smoothed signal to the A/D converter.

4. The temperature measuring device according to claim 3 , wherein
the pulse width modulation circuit further comprises a triangular wave generating circuit, and
the calibration processing section conducts sampling for the digital values on application of the reference voltage in a period of an integer times of an oscillation period of the triangular wave generating circuit and calculates a mean value of the sampled measurement values.

5. The temperature measuring device according to claim 1 , wherein the memory is a non-volatile memory in the operational processing unit.

6. The temperature measuring device according to claim 1 , wherein the calibration processing section sets the different known reference voltages within a range of forward voltages across the temperature detecting diode at the maximum and the minimum temperatures in chip temperature measurement.

7. The temperature measuring device according to claim 1 , wherein the calibration processing section sets the minimum and the maximum values of the different known reference voltages to be equal to the forward voltage values across the temperature detecting diode at the highest and the lowest temperatures of a measurement range of the chip temperature.

Assignees

• Yoshimura Hiroyuki
• Fuji Electric Co Ltd

Inventors

• Yoshimura Hiroyuki

Classifications

• H03K2017/0806

  against excessive temperature · CPC title

• G01K3/14 Primary

  in respect of space · CPC title

• G01K2219/00

  Thermometers with dedicated analog to digital converters · CPC title

• G01K7/01

  using semiconducting elements having PN junctions (G01K7/02, G01K7/16, G01K7/30 take precedence) · CPC title

• G01K15/005

  Calibration · CPC title