Resin composition, resin molded article, and method of preparing resin composition

Patent metadata

Field	Value
Publication number	US-9562154-B1
Application number	US-201614996771-A
Country	US
Kind code	B1
Filing date	Jan 15, 2016
Priority date	Sep 25, 2015
Publication date	Feb 7, 2017
Grant date	Feb 7, 2017

Abstract

A resin composition including a thermoplastic resin, a glass fiber, a resin which is different from the thermoplastic resin and contains at least one of an amide bond and an imide bond, and a compatibilizer, wherein a part of the resin which is different from the thermoplastic resin and contains at least one of an amide bond and an imide bond forms a domain having a diameter of from 5 μm to 10 μm in a matrix of the thermoplastic resin.

First claim

What is claimed is:

1. A resin composition comprising:
a thermoplastic resin;
a glass fiber;
a resin which is different from the thermoplastic resin and contains at least one of an amide bond and an imide bond; and
a compatibilizer,
wherein a part of the resin which is different from the thermoplastic resin and contains at least one of an amide bond and an imide bond forms a domain having a diameter of from 5 μm to 10 μm in a matrix of the thermoplastic resin, and wherein a part of the resin which is different from the thermoplastic resin and contains at least one of an amide bond and an imide bond forms a coating layer around the glass fiber.

2. The resin composition according to claim 1 ,
wherein the thickness of the coating layer is from 50 nm to 700 nm.

3. The resin composition according to claim 1 ,
wherein the content of the resin which is different from the thermoplastic resin and contains at least one of an amide bond and an imide bond is from 1% by weight to 10% by weight with respect to the weight of the glass fiber.

4. The resin composition according to claim 1 ,
wherein the thermoplastic resin is polyolefin.

5. The resin composition according to claim 1 ,
wherein the resin which is different from the thermoplastic resin and contains at least one of an amide bond and an imide bond is polyamide.

6. The resin composition according to claim 1 ,
wherein the compatibilizer is a chemically modified polyolefin.

7. The resin composition according to claim 1 ,
wherein the content of the glass fiber is from 0.1 parts by weight to 200 parts by weight with respect to 100 parts by weight of the thermoplastic resin.

8. The resin composition according to claim 1 ,
the content of the resin which is different from the thermoplastic resin and contains at least one of an amide bond and an imide bond is from 0.1 parts by weight to 20 parts by weight with respect to 100 parts by weight of the thermoplastic resin.

9. The resin composition according to claim 1 ,
wherein the content of the compatibilizer is from 0.1 parts by weight to 20 parts by weight with respect to 100 parts by weight of the thermoplastic resin.

10. The resin composition according to claim 1 ,
wherein the content of the compatibilizer is from 1% by weight to 15% by weight with respect to the weight of the glass fiber.

11. A method of preparing the resin composition according to claim 1 , comprising:
molten-kneading the thermoplastic resin, the glass fiber, the resin which is different from the thermoplastic resin and contains at least one of an amide bond and an imide bond, and the compatibilizer.

12. The resin composition according to claim 1 ,
wherein the thermoplastic resin is polyolefin, the resin which is different from the thermoplastic resin and contains at least one of an amide bond and an imide bond is polyamide, and the compatibilizer is a chemically modified polyolefin.

13. The resin composition according to claim 1 ,
wherein the difference between the solubility parameter (SP value) of the thermoplastic resin and the solubility parameter (SP value) of the resin which is different from the thermoplastic resin and contains at least one of an amide bond and an imide bond is 3 or more.

14. A resin molded article comprising:
a thermoplastic resin;
a glass fiber;
a resin which is different from the thermoplastic resin and contains at least one of an amide bond and an imide bond; and
a compatibilizer,
wherein a part of the resin which is different from the thermoplastic resin and contains at least one of an amide bond and an imide bond forms a domain having a diameter of from 5 μm to 10 μm in a matrix of the thermoplastic resin, and wherein a part of the resin which is different from the thermoplastic resin and contains at least one of an amide bond and an imide bond forms a coating layer around the glass fiber.

15. The resin molded article according to claim 14 ,
wherein the thickness of the coating layer is from 50 nm to 700 nm.

16. The resin molded article according to claim 14 ,
wherein the content of the resin which is different from the thermoplastic resin and contains at least one of an amide bond and an imide bond is from 1% by weight to 10% by weight with respect to the weight of the glass fiber.

17. The resin molded article according to claim 14 ,
wherein the thermoplastic resin is polyolefin.

18. The resin molded article according to claim 14 ,
wherein the resin which is different from the thermoplastic resin and contains at least one of an amide bond and an imide bond is polyamide.

19. The resin molded article according to claim 14 ,
wherein the compatibilizer is a chemically modified polyolefin.

20. The resin molded article according to claim 14 ,
wherein the content of the glass fiber is from 0.1 parts by weight to 200 parts by weight with respect to 100 parts by weight of the thermoplastic resin.

Assignees

• Fuji Xerox Co Ltd

Inventors

• Okoshi Masayuki
• Nakayama Daisuke
• Miyamoto Tsuyoshi
• Moriya Hiroyuki
• Iwadate Yuko

Classifications

• C08L67/02

  Polyesters derived from dicarboxylic acids and dihydroxy compounds (C08L67/06 takes precedence) · CPC title

• C08L2205/03

  containing three or more polymers in a blend · CPC title

• C08L59/02

  Polyacetals containing polyoxymethylene sequences only · CPC title

• C08L2205/08

  containing additives to improve the compatibility between two polymers · CPC title

• C08L27/02

  not modified by chemical after-treatment · CPC title