Resin composition, display device manufactured using the same, and manufacturing method of the display device
US-2024247152-A1 · Jul 25, 2024 · US
US9562122B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9562122-B2 |
| Application number | US-201514835054-A |
| Country | US |
| Kind code | B2 |
| Filing date | Aug 25, 2015 |
| Priority date | Aug 25, 2014 |
| Publication date | Feb 7, 2017 |
| Grant date | Feb 7, 2017 |
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A resist composition has a resin (A1) including a structural unit having an acid-labile group, a resin (A2) including a structural unit having a group represented by formula (Ia), and an acid generator. wherein R 1 in each occurrence independently represents a fluorine atom or a C 1 to C 6 fluorinated alkyl group, ring W represents a C 5 to C 18 alicyclic hydrocarbon group, n represents an integer of 1 to 6, and * represents a binding site.
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What is claimed is: 1. A resist composition comprising a resin (A1) which comprises a structural unit having an acid-labile group, a resin (A2) which comprises a structural unit having a group represented by formula (Ia) and having no acid-labile group, and an acid generator: wherein R 1 in each occurrence independently represents a fluorine atom or a C 1 to C 6 fluorinated alkyl group, ring W represents a C 5 to C 18 alicyclic hydrocarbon group, n represents an integer of 1 to 6, and * represents a binding site. 2. The resist composition according to claim 1 , wherein the structural unit having the group represented by the formula (Ia) is a structural unit derived from a compound represented by formula (Ia1): wherein R 1 , ring W and n are as defined in claim 1 , R 2 represents a hydrogen atom, a halogen atom or a C 1 to C 6 alkyl group that may have a halogen atom, R 3 represents a single bond or a C 1 to C 6 alkanediyl group where a methylene group may be replaced by an oxygen atom or a carbonyl group, and A 3 represents an oxygen atom or an NH group. 3. The resist composition according to claim 1 , wherein the ring W is a cyclohexane ring, a cyclopentane ring or a norbornane group. 4. The resist composition according to claim 1 , wherein the structural unit having the group represented by the formula (Ia) is a structural unit derived from a compound represented by formula (I0): wherein R 1 and n are as defined in claim 1 , R 2 represents a hydrogen atom, a halogen atom or a C 1 to C 6 alkyl group that may have a halogen atom, A 3 represents an oxygen atom or an NH group, and s represents an integer of 1 to 4. 5. The resist composition according to claim 1 , wherein the structural unit having the group represented by the formula (Ia) is a structural unit derived from a monomer represented by formula (I): wherein R 1 and n are as defined in claim 1 , R 2 represents a hydrogen atom, a halogen atom or a C 1 to C 6 alkyl group that may have a halogen atom, and s represents an integer of 1 to 4. 6. The resist composition according to claim 1 , wherein the resin (A2) comprises 50% by mole or more of the structural unit having the group represented by the formula (Ia). 7. The resist composition according to claim 1 , wherein the resin (A2) consists of the structural units having the group represented by the formula (Ia). 8. A method for producing a resist pattern comprising steps (1) to (5); (1) applying the resist composition according to claim 1 onto a substrate; (2) drying the applied composition to form a composition layer; (3) exposing the composition layer; (4) heating the exposed composition layer, and (5) developing the heated composition layer. 9. A compound represented by formula (Ia1): wherein R 1 in each occurrence independently represents a fluorine atom or a C 1 to C 6 fluorinated alkyl group, ring W represents a C 5 to C 18 alicyclic hydrocarbon group, n represents an integer of 1 to 6, R 2 represents a hydrogen atom, a halogen atom, or a C 1 to C 6 alkyl group that may have a halogen atom, R 3 represents a single bond or a C 1 to C 6 alkanediyl group where a methylene group may be replaced by an oxygen atom or a carbonyl group, and A 3 represents an oxygen atom or an NH group, and the compound represented by formula (Ia1) has no acid-labile group. 10. The compound according to claim 9 , which is a compound represented by formula (I0): wherein R 1 , A 3 , R 2 and n are as defined in claim 9 , and s represents an integer of 1 to 4. 11. The compound according to claim 9 , which is a compound represented by formula (I): wherein R 1 , R 2 and n are as defined in claim 9 , and s represents an integer of 1 to 4. 12. The compound according to claim 9 , which is a compound represented by formula (I-1): wherein R 2 is as defined in claim 9 . 13. A resin having a structural unit derived from the compound of claim 9 .
Treatment before imagewise removal, e.g. prebaking {(G03F7/265 takes precedence)} · CPC title
the ring being saturated · CPC title
the macromolecular compound having an alicyclic moiety in a side chain · CPC title
with perfluoro compounds, e.g. for dry lithography (G03F7/0048 takes precedence) · CPC title
Esters of carboxylic acids having an esterified carboxyl group bound to a carbon atom of a ring other than a six-membered aromatic ring · CPC title
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