Polishing apparatus

Patent metadata

Field	Value
Publication number	US-9561573-B2
Application number	US-201414167129-A
Country	US
Kind code	B2
Filing date	Jan 29, 2014
Priority date	Jan 31, 2013
Publication date	Feb 7, 2017
Grant date	Feb 7, 2017

Abstract

A polishing apparatus is used for polishing a substrate such as a semiconductor wafer. The polishing apparatus includes a substrate holder to hold a substrate and to rotate the substrate, a pressing member configured to press a polishing tool against the substrate and to polish the substrate, a pressing force control mechanism configured to control a pressing force of the pressing member, and a polishing position limiting mechanism configured to limit a polishing position of the pressing member. A polishing tape or a fixed abrasive is used as the polishing tool.

First claim

What is claimed is:

1. A polishing apparatus for polishing a substrate, comprising:
a substrate holder configured to hold a substrate and to rotate the substrate;
a pressing member configured to press a polishing tool against the substrate and to form a polished portion in a surface of the substrate;
a pressing force control mechanism configured to control a pressing force of the pressing member; and
a polishing position limiting mechanism configured to limit a depth of the polished portion to less than a thickness of the substrate when the pressing member is pressing the polishing tool against the substrate.

2. The polishing apparatus according to claim 1 , further comprising:
a positioning member coupled to the pressing member, the positioning member and the pressing member being integrally movable;
wherein the polishing position limiting mechanism comprises a stopper configured to limit a movement of the positioning member and a stopper moving mechanism configured to move the stopper.

3. The polishing apparatus according to claim 2 , wherein an alarm signal is generated when the positioning member is not brought into contact with the stopper within a predetermined polishing time.

4. The polishing apparatus according to claim 1 , wherein the pressing force control mechanism comprises an air cylinder configured to apply the pressing force to the pressing member.

5. The polishing apparatus according to claim 1 , wherein the polishing position limiting mechanism is configured to limit a distance of a movement of the pressing member from a polishing start point.

6. A polishing apparatus for polishing a substrate, comprising:
a substrate holder configured to hold a substrate and to rotate the substrate;
a pressing member configured to press a polishing tool against the substrate and to polish the substrate;
a pressing force control mechanism configured to control a pressing force of the pressing member;
a polishing position limiting mechanism configured to limit a polishing position of the pressing member; and
a positioning member coupled to the pressing member, the positioning member and the pressing member being integrally movable,
wherein the polishing position limiting mechanism comprises a stopper configured to limit a movement of the positioning member and a stopper moving mechanism configured to move the stopper, and
wherein the stopper moving mechanism comprises a ball screw mechanism and a servomotor configured to operate the ball screw mechanism.

7. A polishing apparatus for polishing a substrate, comprising:
a substrate holder to hold a substrate and to rotate the substrate;
a pressing member to press a polishing tool against the substrate and to form a polished portion in a surface of the substrate;
an actuator to control a pressing force of the pressing member; and
a position limiter to limit a depth of the polished portion to less than a thickness of the substrate when the pressing member is pressing the polishing tool against the substrate.

8. The polishing apparatus according to claim 7 , further comprising:
a positioning member coupled to the pressing member, the positioning member and the pressing member being integrally movable;
wherein the position limiter comprises a stopper to limit a movement of the positioning member and an actuator to move the stopper.

9. The polishing apparatus according to claim 8 , wherein an alarm signal is generated when the positioning member is not brought into contact with the stopper within a predetermined polishing time.

10. The polishing apparatus according to claim 7 , wherein the actuator to control the pressing force of the pressing member comprises an air cylinder to apply the pressing force to the pressing member.

11. The polishing apparatus according to claim 7 , wherein the position limiter is configured to limit a distance of a movement of the pressing member from a polishing start point.

12. A polishing apparatus for polishing a substrate, comprising:
a substrate holder to hold a substrate and to rotate the substrate;
a pressing member to press a polishing tool against the substrate and to polish the substrate;
an actuator to control a pressing force of the pressing member;
a position limiter to limit a polishing position of the pressing member; and
a positioning member coupled to the pressing member, the positioning member and the pressing member being integrally movable,
wherein the position limiter comprises a stopper to limit a movement of the positioning member and an actuator to move the stopper, and
wherein the actuator to move the stopper comprises a ball screw mechanism and a servomotor to operate the ball screw mechanism.

Assignees

• Ebara Corp

Inventors

• Seki Masaya
• Togawa Tetsuji

Classifications

• B24B9/065

  of thin, brittle parts, e.g. semiconductors, wafers · CPC title

• B24B21/18

  Accessories · CPC title

• B24B21/004

  using abrasive rolled strips · CPC title

• B24B21/002 Primary

  for grinding edges or bevels · CPC title

• H10P72/0606

  Position monitoring, e.g. misposition detection or presence detection · CPC title