Electric circuit configuration having an MID circuit carrier and a connecting interface connected to it

Patent metadata

Field	Value
Publication number	US-9560772-B2
Application number	US-67412908-A
Country	US
Kind code	B2
Filing date	Jul 18, 2008
Priority date	Sep 4, 2007
Publication date	Jan 31, 2017
Grant date	Jan 31, 2017

Abstract

An electric circuit configuration having an MID circuit carrier and a connecting interface, the connecting interface being situated on a surface of the MID circuit carrier. The electric circuit configuration further includes at least one electrical contact pair having at least one connecting interface contact element and at least one MID contact element that is provided on the surface and is situated on the connecting interface contact element. The exemplary embodiments and/or exemplary methods of the present invention further relates to a contact element group having at least one electrical contact element for the electrical contacting of an MID circuit carrier, which is developed on a surface of an MID circuit carrier, is electrically connected to it, and extends away from the surface. The at least one contact element is connected to a line element of the MID circuit carrier.

First claim

What is claimed is:

1. An electric circuit configuration, comprising:
a molded interconnect device (“MID”) circuit carrier formed of a substrate that is shaped into a shape that includes at least one projection in an entirety of which a thickness of the substrate is greater than a thickness of the substrate surrounding the respective projection, the at least one projection being an at least one electrically conductive MID contact element that extends away from a surface of the substrate surrounding the respective MID contact element;
an electrical connecting interface arranged over the carrier; and
at least one connecting interface contact element, each of which extends in a direction from the electrical connecting interface towards the carrier, and is paired with, and positioned opposite to, a respective one of the at least one MID contact element to form a respective electrical contact pair;
wherein the connecting interface contact element and the MID contact element of at least one of the electrical contact pairs are formed as strips arranged such that their longitudinal axes extend perpendicular to each other and in planes parallel to surfaces of the carrier and the connecting interface that face each other.

2. The electric circuit configuration of claim 1 , wherein the connecting interface contact element is located directly on the connecting interface, and the MID contact element is in or on the surface of the MID circuit carrier, and wherein the MID contact element extends all the way to the connecting interface contact element, the connecting interface contact element extends all the way to the MID contact element, or the connecting interface contact element and the MID contact element each extend all the way to each other.

3. The electric circuit configuration of claim 1 , wherein at least one of the electrical contact pairs also has an electrically conductive connecting element, which is situated between the connecting interface contact element and the MID contact element and electrically connects these to each other.

4. The electric circuit configuration of claim 3 , wherein the electrical contact pair includes a mechanical connecting element, which connects the connecting interface contact element and the MID contact element mechanically to each other in a force-transmitting manner, wherein the mechanical connecting element is in one part with the electrically conductive connecting element, or the mechanical connecting element is physically separate from the electrically conductive connecting element.

5. The electric circuit configuration of claim 4 , wherein the electrical connecting element includes an isotropically or an anisotropically conductive adhesive material, a conductive paste, an isotropically or an anisotropically conductive film or an isotropically or an anisotropically conductive semiconducting rubber or an elastic plastic material that is electrically conductive.

6. The electric circuit configuration of claim 1 , further comprising:
at least one mechanical force-locking, form-locking or continuous material connecting element, which is conductive or nonconductive as one of an elastic element, an adhesive joint, a clip, and a crimping element.

7. The electric circuit configuration of claim 1 , wherein the connecting interface, the connecting interface contact element and the surface of the MID circuit carrier extend essentially in a coplanar manner with respect to each other.

8. The electric circuit configuration of claim 1 , wherein the MID contact element strip runs along the surface of the MID circuit carrier and has a constant elevation height with respect to the surface of the MID circuit carrier.

9. The electric circuit configuration of claim 1 , wherein the at least one electrically conductive MID contact element is electrically connected to a line element of the MID circuit carrier and is configured for electrically connecting the MID circuit carrier to another device.

10. The electric circuit configuration of claim 9 , wherein the at least one MID contact element is connected to the line element of the MID circuit carrier in an electrically conductive manner and is (a) connected by force locking, form locking or continuous material to the line element of the MID circuit carrier, or (b) one part with the line element of the MID circuit carrier.

11. The MID of claim 9 , wherein all cross-sections of the MID contact element along an axis extending perpendicularly to the substrate surface are the same.

12. The MID of claim 9 , wherein all cross-sections of the MID contact element along an axis extending parallel to the substrate surface are the same.

13. The electric circuit configuration of claim 1 , wherein the electrical connecting interface is or is part of a printed circuit board (PCB).

14. The electric circuit configuration of claim 1 , wherein all cross-sections of the MID contact element along an axis extending perpendicularly to the substrate surface are the same.

15. The electric circuit configuration of claim 1 , wherein all cross-sections of the MID contact element along an axis extending parallel to the substrate surface are the same.

16. The electric circuit configuration of claim 1 , wherein the extension of the at least one MID contact element away from the surface of the substrate surrounding the respective MID contact element is towards the electrical connecting interface and provides a separation distance between MID circuit carrier and the electrical connecting interface, the separation distance being sufficient to avoid physical contact, and at least one of capacitive and inductive coupling, between the MID circuit carrier and the electrical connecting interface.

17. The electric circuit configuration of claim 1 , wherein the shaping of the substrate is by deformation.

18. The electric circuit configuration of claim 1 , wherein the shaping of the substrate is by stamping.

19. An electric circuit configuration, comprising:
a molded interconnect device (“MID”) circuit carrier formed of a substrate that is shaped into a shape that includes at least one projection in an entirety of which a thickness of the substrate is greater than a thickness of the substrate surrounding the respective projection, the at least one projection being an at least one electrically conductive MID contact element that extends away from a surface of the substrate surrounding the respective MID contact element;
an electrical connecting interface; and
at least one connecting interface contact element, each of which is paired with, and positioned opposite to, a respective one of the at least one MID contact element to form a respective electrical contact pair;
wherein the connecting interface contact element and the MID contact element of each of at least one of the electrical contact pairs are formed as strips whose longitudinal axes are oriented so that they extend in different directions and in different planes that are parallel to each other, so that the strips of the respective contact pair overlap each other at corresponding points of their respective planes of extension, to thereby establish a contact resistance between the contact elements of the respective pair.

20. The electric circuit configuration of claim 19 , wherein the longitudinal axes of the strips of the respective pair are oriented perpendicular to each other.

Assignees

• Kopf Stefan
• Rohde Hartmut
• Bosch Gmbh Robert

Inventors

• Kopf Stefan
• Rohde Hartmut

Classifications

• H01R13/405

  Securing in non-demountable manner, e.g. moulding, riveting · CPC title

• H05K2201/09118

  Moulded substrate · CPC title

• H05K2201/09045

  Locally raised area or protrusion of insulating substrate · CPC title

• H01R12/714

  with contacts abutting directly the printed circuit; Button contacts therefore provided on the printed circuit · CPC title

• H05K1/181

  associated with surface mounted components · CPC title