OLED package method and OLED package structure

Patent metadata

Field	Value
Publication number	US-9559331-B2
Application number	US-201414426374-A
Country	US
Kind code	B2
Filing date	Oct 28, 2014
Priority date	Sep 22, 2014
Publication date	Jan 31, 2017
Grant date	Jan 31, 2017

Abstract

The present invention provides an OLED package method and an OLED package structure. The method comprises steps of: step 1, providing a package cover plate ( 1 ), and a substrate ( 5 ), and the package cover plate ( 1 ) is formed with a spreading location ( 8 ) for spreading sealant ( 2 ); step 2, manufacturing a seal ring ( 7 or 7 ′) on the package cover plate ( 1 ) outside the spreading location ( 8 ); step 3, spreading the sealant ( 1 ) in a round on the spreading location ( 8 ) of the package cover plate ( 1 ); step 4, oppositely attaching the package cover plate ( 1 ) and the substrate ( 5 ); step 5, employing an UV light source to irradiate and curing the sealant ( 2 ) to accomplish the package to the substrate ( 5 ) with the package cover plate ( 1 ).

First claim

What is claimed is:

1. An organic light emitting diode (OLED) package method, comprising steps of:
step 1, providing a package cover plate and a substrate, wherein the package cover plate is formed with a spreading location for spreading sealant;
step 2, manufacturing a seal ring on the package cover plate outside the spreading location, wherein the seal ring is formed of an inorganic material or a combination of an inorganic material and a metal material;
step 3, spreading the sealant in a round on the spreading location of the package cover plate such that the sealant is located inboard of the seal ring;
step 4, oppositely attaching the package cover plate and the substrate;
step 5, employing ultraviolet (UV) light source to irradiate and cure the sealant to accomplish the package to the substrate with the package cover plate.

2. The OLED package method according to claim 1 , wherein the package cover plate is a glass plate and the substrate is a TFT substrate with an LED element.

3. The OLED package method according to claim 1 , wherein in the second step, a distance between an outer edge of the seal ring close to the spreading location and a central line of the spreading location is 0.5 mm-2.5 mm.

4. The OLED package method according to claim 1 , wherein a width of the seal ring is 20 μm-2000 μm, and a height thereof is 3 μm-50 μm, and the seal ring on the same package cover plate has consistent width and height at different locations.

5. The OLED package method according to claim 1 , wherein the seal ring is an inorganic isolation thin film; material of the inorganic isolation thin film is SiO 2 or SiNx, and the inorganic isolation thin film is acquired by implementing chemical vapor deposition for film formation, and then etching.

6. The OLED package method according to claim 1 , wherein the seal ring is a structure of arranging an inorganic isolation thin film on a metal layer; the manufacture method of the structure is: first, forming a metal layer in a round on the package cover plate outside the spreading location, and then forming the inorganic isolation thin film in a round on the metal layer and corresponding to the metal layer; the metal layer is molybdenum, and material of the inorganic isolation thin film is SiO 2 or SiNx, and the inorganic isolation thin film is acquired by implementing chemical vapor deposition for film formation, and then etching.

7. The OLED package method according to claim 1 , wherein in the third step, the sealant is UV glue, and a height of the sealant is larger than a height of the seal ring.

8. The package method of the OLED panel according to claim 1 , wherein in the fourth step, a width of the sealant is 1 mm-5 mm after the package cover plate and the substrate are oppositely attached.

9. An organic light emitting diode (OLED) package structure, comprising a package cover plate, a substrate tightly attached to the package cover plate, sealant located between the package cover plate and the substrate and a seal ring outside the sealant, wherein the seal ring is formed of an inorganic material or a combination of an inorganic material and a metal material and the sealant is located inboard of the seal ring.

10. The OLED package structure according to claim 9 , wherein the seal ring is an inorganic isolation thin film in a round, or a structure of arranging an inorganic isolation thin film on a metal layer.

11. An organic light emitting diode (OLED) package structure, comprising a package cover plate, a substrate tightly attached to the package cover plate, sealant located between the package cover plate and the substrate and a seal ring outside the sealant, wherein the seal ring is formed of an inorganic material or a combination of an inorganic material and a metal material and the sealant is located inboard of the seal ring;
wherein the seal ring is an inorganic isolation thin film in a round, or a structure of arranging an inorganic isolation thin film on a metal layer.

Assignees

• Shenzhen China Star Optoelect
• Shenzhen China Star Optoelect

Inventors

• Zeng Weijing
• Liu Yawei

Classifications

• H10K71/40

  Thermal treatment, e.g. annealing in the presence of a solvent vapour · CPC title

• H10K59/12

  Active-matrix OLED [AMOLED] displays · CPC title

• H10K50/8426

  Peripheral sealing arrangements, e.g. adhesives, sealants · CPC title

• H10K59/8722 Primary

  Peripheral sealing arrangements, e.g. adhesives, sealants · CPC title

• H01L27/3244

  Electricity · mapped topic