Integrated circuit including sensor having injection molded magnetic material

Patent metadata

Field	Value
Publication number	US-9559293-B2
Application number	US-201213594974-A
Country	US
Kind code	B2
Filing date	Aug 27, 2012
Priority date	Dec 4, 2007
Publication date	Jan 31, 2017
Grant date	Jan 31, 2017

Abstract

An integrated circuit includes a magnetic field sensor and an injection molded magnetic material enclosing at least a portion of the magnetic field sensor.

First claim

What is claimed is:

1. An integrated circuit comprising:
a magnetic field sensor comprising a die including a magnetic field sensitive element;
an injection molded magnetic material on a first side of the magnetic field sensor; and
an injection molded plastic material on a second side of the magnetic field sensor opposite the first side, the injection molded plastic material directly contacting the second side of the magnetic field sensor,
wherein the injection molded magnetic material includes a recessed portion centered with the die, the recessed portion including a first portion and a second portion, the second portion being wider than the first portion, and the first portion closer to the die than the second portion,
wherein the width of the first portion is defined by first parallel sidewalls of the first portion, the first parallel sidewalls of the first portion perpendicular to a surface of the die that includes the magnetic field sensitive element,
wherein the width of the second portion is defined by second parallel sidewalls of the second portion, the second parallel sidewalls of the second portion perpendicular to said surface of the die and separate from the first parallel sidewalls, and
wherein the injection molded magnetic material includes third sidewalls extending between the first parallel sidewalls and the second parallel sidewalls, the third sidewalls only parallel to said surface of the die.

2. The integrated circuit of claim 1 , wherein the magnetic field sensor further comprises:
a leadframe,
wherein the die is coupled to the leadframe via a bond wire.

3. The integrated circuit of claim 1 , wherein the injection molded plastic material is on the first side of the magnetic field sensor, and
wherein the injection molded plastic material directly contacts the injection molded magnetic material.

4. The integrated circuit of claim 1 , wherein the injection molded plastic material encloses the magnetic field sensor, and
wherein the injection molded magnetic material is coupled to at least a portion of the injection molded plastic material.

5. The integrated circuit of claim 4 , wherein the injection molded magnetic material is one of mechanically coupled and chemically coupled to the injection molded plastic material.

6. The integrated circuit of claim 1 , wherein a coefficient of thermal expansion of the injection molded magnetic material is within a range of a coefficient of thermal expansion of the injection molded plastic material.

7. The integrated circuit of claim 1 , wherein a coefficient of thermal expansion of the injection molded plastic material is between 10 ppm/° C. and 17 ppm/° C.

8. The integrated circuit of claim 1 , wherein the injection molded magnetic material is surface fused to the injection molded plastic material through a chemical bond.

9. The integrated circuit of claim 1 , wherein the injection molded plastic material comprises quartz flour and an epoxy binder.

10. The integrated circuit of claim 9 , wherein the quartz flour provides between 70% and 90% by weight of the injection molded plastic material.

11. The integrated circuit of claim 1 , wherein the injection molded magnetic material completely overlaps the die.

12. The integrated circuit of claim 1 ,
wherein the injection molded plastic material includes an extended portion centered with the die, the extended portion within the recess.

13. An integrated circuit comprising:
a magnetic field sensor comprising a die including a magnetic field sensitive element;
an injection molded magnetic material on a first side of the magnetic field sensor, the injection molded magnetic material comprising a mixture of a magnetic powder and an epoxy binder; and
an injection molded plastic material on a second side of the magnetic field sensor opposite the first side, the injection molded plastic material directly contacting the second side of the magnetic field sensor,
wherein the injection molded magnetic material includes a recessed portion centered with the die, the recessed portion including a first portion and a second portion, the second portion being wider than the first portion, and the first portion closer to the die than the second portion,
wherein the width of the first portion is defined by first parallel sidewalls of the first portion, the first parallel sidewalls of the first portion perpendicular to a surface of the die that includes the magnetic field sensitive element,
wherein the width of the second portion is defined by second parallel sidewalls of the second portion, the second parallel sidewalls of the second portion perpendicular to said surface of the die and separate from the first parallel sidewalls,
wherein the injection molded magnetic material includes third sidewalls extending between the first parallel sidewalls and the second parallel sidewalls, the third sidewalls only parallel to said surface of the die, and
wherein the mixture includes 60% by volume of the magnetic powder.

14. The integrated circuit of claim 13 , wherein the magnetic powder has a grain size within a range of 1 μm to 10 μm.

Assignees

• Ausserlechner Udo
• Infineon Technologies Ag

Inventors

• Ausserlechner Udo

Classifications

• H10W90/756

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W90/736

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W72/5449

  not being orthogonal to a side surface of the chip, e.g. fan-out arrangements · CPC title

• H10W72/5363

  the connected ends being wedge-shaped · CPC title

• H10W72/884

  Die-attach connectors and bond wires · CPC title