Labels and methods of producing the same

Patent metadata

Field	Value
Publication number	US-9558681-B2
Application number	US-201314024295-A
Country	US
Kind code	B2
Filing date	Sep 11, 2013
Priority date	Sep 11, 2013
Publication date	Jan 31, 2017
Grant date	Jan 31, 2017

Abstract

Labels having identification tags and tamper evident pattern release layers and methods of producing such labels are disclosed. An example method includes moving a first substrate in a direction. The first substrate has a first side opposite a second side. The first side has a first adhesive and a pattern release layer. The method also includes coupling a third side of a tag to the first side of the first substrate. The tag includes the third side and a fourth side opposite the third side. The method also includes mating transfer tape of a second substrate over the first side and the fourth side. The second substrate includes a liner layer and the transfer tape. The transfer tape is to be positioned immediately adjacent the tag.

First claim

What is claimed is:

1. A method, comprising:
applying a first pattern of a first adhesive including a tamper evident pattern release layer on a first side of a first substrate, the first substrate further including a second side opposite the first side;
applying a second pattern of a second adhesive disposed on the first side, the second pattern of the second adhesive being surrounded by the first pattern of the first adhesive;
forming a removable portion and a remaining portion on a third side of a tag, the tag further including a fourth side opposite the third side;
coupling the third side of the tag to the first substrate, with the remaining portion positioned adjacent the first pattern of the first adhesive and the removable portion positioned adjacent the second pattern of the second adhesive; and
mating transfer tape of a second substrate over the first pattern of the first adhesive and the tag, the second substrate further including a liner, the transfer tape including a third pattern of the second adhesive to be positioned adjacent the remaining portion of the tag and the first pattern of the first adhesive.

2. The method of claim 1 , further including forming a line of weakness to define the removable portion on the tag to enable the removable portion to be torn from the tag along the line of weakness and enable the tag to be disabled upon an associated label being tampered with.

3. The method of claim 2 , wherein applying the second pattern of the second adhesives includes spot coating the first side with second adhesive adjacent to where the line of weakness is to be positioned.

4. The method of claim 1 , wherein the removable portion includes a bridge formed on an antenna of the tag, the bridge to be removable from the antenna to disable the tag upon an associated label being tampered with.

5. The method of claim 4 , wherein the bridge is printed on the tag.

6. The method of claim 4 , further including printing a release layer between the tag and the bridge.

7. The method of claim 4 , further including spot coating the first side with the second adhesive adjacent to where the bridge is to be positioned.

8. The method of claim 1 , wherein the tag includes a radio-frequency identifier tag or a near field communication tag.

9. The method of claim 1 , further including printing an antenna for the tag on the first side of the substrate.

10. The method of claim 1 , further including cutting the first substrate and the transfer tape to form a label, wherein the tag is positioned between the first substrate and the transfer tape.

11. The method of claim 10 , further including removing a waste matrix formed from the cutting, the waste matrix including a portion of the first substrate and of the transfer tape.

12. The method of claim 11 , further including forming a line of weakness in the liner to separate the label from a second label positioned adjacent thereto.

13. The method of claim 1 , wherein the transfer tape further includes a film and a fourth pattern of the second adhesive, the film being between the third and fourth patterns of the second adhesive, the fourth pattern of the second adhesive being between the film and the liner.

14. The method of claim 13 , wherein the second adhesive is stronger than the first adhesive.

15. The method of claim 14 , wherein the tamper evident pattern release layer is disposed on a first portion of the first substrate, the tamper evident pattern release layer is to overlay the second adhesive to enable the first portion of the first substrate to decouple from the second substrate upon the first substrate being separated from the second substrate to enable a visual indication of tampering.

16. The method of claim 15 , wherein a second portion of the first substrate spaced from the tamper evident pattern release layer is to remain coupled to the second substrate upon the first substrate being separated from the second substrate to enable the visual indication of tampering.

17. The method of claim 1 , wherein, prior to coupling the third side of the tag to the first substrate, cutting the tag from a third substrate including a second tag to separate the tag from the second tag.

18. The method of claim 1 , further including removing the liner from the transfer tape.

19. The method of claim 18 , further including coupling the transfer tape to a third substrate.

20. The method of claim 19 , wherein the third substrate includes a container, a product, or a pallet.

21. The method of claim 1 , further including establishing disablement of the tag via a tear along a line of weakness formed in the tag to define the removable portion upon an associated label being tampered with.

22. The method of claim 1 wherein the removable portion includes a bridge and further including establishing disablement of the tag via the bridge to provide a break in an antenna of the tag upon an associated label being tampered with.

23. The method of claim 1 , wherein the tag includes a first tag, further including coupling a second tag to the first side of the first substrate; and
coupling the second substrate to the second tag, a first label being associated with a first portion of the first substrate, the first tag, and a first portion of the transfer tape, a second label being associated with a second portion of the second substrate, the second tag, and a second portion of the transfer tape.

24. The method of claim 23 , further including printing first indicia on the second side of the first substrate associated with the first label and second indicia on the second side of the first substrate associated with the second label.

25. The method of claim 24 , wherein the first indicia includes a quick response code.

26. The method of claim 1 , wherein the second pattern of the second adhesive causes the removable portion to be torn from the tag during a subsequent tampering of the first substrate, the remaining portion left intact.

Assignees

• Donnelley & Sons Co
• R R Donnelley & Sons

Inventors

• Tobol Gretchen M
• Warmus James

Classifications

• Y10T428/14

  Layer or component removable to expose adhesive · CPC title

• G09F2003/0269

  perforated · CPC title

• G09F2003/0225

  Carrier web · CPC title

• G09F3/0297 Primary

  including a machine-readable marking, e.g. a bar code (digitally marked record carriers in general G06K19/00) · CPC title

• G09F3/0292 Primary

  tamper indicating labels · CPC title