Electronic and optical co-packaging of coherent transceiver

Patent metadata

Field	Value
Publication number	US-9557478-B2
Application number	US-201314012876-A
Country	US
Kind code	B2
Filing date	Aug 28, 2013
Priority date	Aug 28, 2012
Publication date	Jan 31, 2017
Grant date	Jan 31, 2017

Abstract

Disclosed herein are co-packaging structures, devices, and methods for integrating a photonic integrated circuit (PIC), an electronic integrated circuit including drivers and transimpedance amplifiers (TIAs) and an ASIC having analog-to-digital converters and a digital signal processor positioned on a common (the same) carrier thereby resulting in a compact coherent transceiver while lowering its cost.

First claim

The invention claimed is:

1. A co-packaged electronic and optical apparatus comprising:
a package substrate body;
a chip comprising a driver and/or transimpedance amplifier (TIA), the chip being attached to the package substrate body;
an application specific integrated circuit (ASIC) attached to and in electrical communication with the chip;
a photonic integrated circuit (PIC) adjacent to and in electrical communication with the chip, the PIC having a surface;
a single-piece mast positioned adjacent to the PIC; and
an optical fiber coiled around the single-piece mast and having an end terminating substantially perpendicularly on the surface of the PIC.

2. The co-packaged electronic and optical apparatus of claim 1 , wherein the PIC and the ASIC are mechanically and electrically connected to the chip and a top surface of the package substrate body through the effect of ball grid array (BGA) structures.

3. The co-packaged electronic and optical apparatus of claim 2 , wherein a bottom surface of the package substrate body includes BGA structures.

4. The co-packaged electronic and optical apparatus of claim 2 , wherein the PIC includes a number of through silicon vias (TSVs) formed therein.

5. An apparatus comprising the co-packaged electronic and optical apparatus of claim 2 in combination with a laser source, wherein the PIC is optically connected to the laser source via the optical fiber.

6. A co-packaged apparatus comprising:
a package substrate body;
an interposer adjacent to and in electrical communication with the package substrate body through the effect of a ball grid array (BGA);
a chip comprising a driver and/or transimpedance amplifier (TIA), the chip being adjacent to and in electrical communication with the interposer through the effect of a BGA;
an application specific integrated circuit chip (ASIC) adjacent to and in electrical communication with the interposer through the effect of a BGA;
a photonic integrated circuit (PIC) adjacent to and in electrical communication with the interposer through the effect of a BGA, wherein said interposer electrically interconnects the PIC to the chip and electrically interconnects the ASIC to the chip;
a mast positioned adjacent to the PIC; and
an optical fiber secured to the mast so that an end of the optical fiber is approximately normal to a surface of the PIC.

7. The co-packaged apparatus of claim 6 wherein a bottom surface of the package substrate body includes BGA structures.

8. The co-packaged apparatus of claim 7 , wherein the PIC includes a number of through silicon vias (TSVs) formed therein.

9. An apparatus comprising the co-packaged apparatus of claim 6 optically connected to a laser source via the optical fiber.

10. The apparatus of claim 5 , wherein the apparatus comprises an optical coherent transceiver of which the laser source and the co-packaged electronic and optical apparatus form a part.

11. The co-packaged electronic and optical apparatus of claim 1 , wherein the surface is a surface of a recess in the PIC, and wherein an optical fiber assembly is mounted in the recess.

12. The co-packaged electronic and optical apparatus of claim 11 , wherein the PIC is flip-chip mounted on the package substrate body.

13. The co-packaged electronic and optical apparatus of claim 12 , wherein the PIC further includes a mirror.

14. The co-packaged electronic and optical apparatus of claim 1 , wherein the chip is mounted in a recess of the package substrate body.

15. The co-packaged electronic and optical apparatus of claim 1 , wherein the surface is a backside surface of the PIC.

16. The apparatus of claim 9 , wherein the apparatus comprises an optical coherent transceiver of which the laser source and the co-packaged apparatus form a part.

17. The co-packaged apparatus of claim 6 , wherein the PIC includes an etched recess in which an optical fiber assembly is mounted to optically couple the optical fiber to the PIC.

18. The co-packaged apparatus of claim 6 , wherein the mast is mounted on the interposer.

Assignees

• Acacia Communications Inc
• Acacia Communications Inc

Inventors

• Doerr Christopher
• Swanson Eric
• Stahl Jon
• Vermeulen Diedrik

Classifications

• G02B6/428 Primary

  containing printed circuit boards [PCB] · CPC title

• G02B6/12 Primary

  of the integrated circuit kind (electric integrated circuits H10B, H10D84/00 - H10D89/00, H10F19/00, H10F39/00, H10H29/00, H10K19/00, H10K39/00, H10K59/00, H10N19/00, H10N39/00, H10N59/00, H10N69/00, H10N79/00, H10N89/00) · CPC title

• G02B6/423

  using guiding surfaces for the alignment · CPC title

• G02B6/43

  Arrangements comprising a plurality of opto-electronic elements and associated optical interconnections · CPC title

• G02B6/12004

  Combinations of two or more optical elements · CPC title