Apparatuses and methods for die seal crack detection

Patent metadata

Field	Value
Publication number	US-9557376-B2
Application number	US-201615069316-A
Country	US
Kind code	B2
Filing date	Mar 14, 2016
Priority date	Dec 13, 2013
Publication date	Jan 31, 2017
Grant date	Jan 31, 2017

Abstract

Apparatuses and methods can include a die seal between an integrated circuit region of a die and a periphery of the die. A via chain(s) may be arranged around an inner circumference of the die seal between the die seal and the integrated circuit region and/or around an outer circumference of the die seal between the die seal and the periphery of the die. The via chain may include a plurality of contacts comprised of conductive material and extending through portions of the die. Circuitry may be coupled to an end of the via chain to detect an electrical signal. Additional apparatuses and methods are described.

First claim

What is claimed is:

1. A method for detecting a crack in a die having a die seal, the method comprising:
detecting an electrical signal at an end of a via chain, the via chain being arranged around a circumference of the die seal between a periphery of the die and the die seal, wherein a pad is arranged to be surrounded by the die seal and coupled to an end of the via chain, and wherein the die seal comprises a gap to route a lead for coupling the pad to the end of the via chain, the via chain including a plurality of contacts extending through portions of the die; and
comparing the detected electrical signal to a criterion to determine whether a crack exists in the die.

2. The method of claim 1 , wherein the comparing comprises:
determining that a crack exists in the die seal if the electrical signal has a value above or below a threshold range.

3. The method of claim 1 , wherein an additional via chain is arranged around an inner circumference of the die seal between the die seal and an integrated circuit region of the die to detect an additional electrical signal at an end of the additional via chain.

4. The method of claim 1 , wherein detecting an electrical signal at an end of a via chain comprises:
detecting an additional electrical signal at an end of the additional via chain arranged around the inner circumference of the die seal between the die seal and an integrated circuit region of the die.

5. The method of claim 1 , wherein the pad comprises a first pad coupled to the end of the via chain, and a second pad coupled to another end of the via chain, and a third pad coupled to the die seal.

Assignees

• Micron Technology Inc

Inventors

• Dennison Charles H
• Marr Kenneth W
• Thimmegowda Deepak
• Ireland Philip J

Classifications

• H10P74/277

  Circuits for electrically characterising or monitoring manufacturing processes, e.g. circuits in tested chips or circuits in testing wafers · CPC title

• H10P74/207 Primary

  Electrical properties, e.g. testing or measuring of resistance, deep levels or capacitance-voltage characteristics · CPC title

• H10W72/00

  Interconnections or connectors in packages · CPC title

• H10W20/40

  Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes · CPC title

• H10W20/20

  Interconnections within wafers or substrates, e.g. through-silicon vias [TSV] · CPC title