Cooling structure, electronic device using same, and cooling method

Patent metadata

Field	Value
Publication number	US-9557117-B2
Application number	US-200913062258-A
Country	US
Kind code	B2
Filing date	Oct 7, 2009
Priority date	Oct 29, 2008
Publication date	Jan 31, 2017
Grant date	Jan 31, 2017

Abstract

A cooling structure is provided which includes: an evaporation chamber defined by a base plate having a boiling surface, a ceiling plate and a side wall; a plurality of plate-shaped fins arranged in parallel on the boiling surface, defining a plurality of coolant passages in the evaporation chamber, a liquid phase coolant flows through the coolant passages in one direction from one end portion thereof toward another end portion; a liquid return port formed in the side wall facing the one end portion of coolant passages; and a vapor port formed in the ceiling plate facing the other end portion of coolant passages, wherein space is formed between the ceiling plate and an upper end portion of the plurality of plate-shaped fins, the space expanding gradually from a liquid return port side of the side wall toward the vapor port.

First claim

What is claimed is:

1. A cooling structure comprising:
an evaporation chamber defined by a base plate, a ceiling plate having a ceiling surface in a lower portion thereof and a side wall having a cylindrical shape, said base plate having a boiling surface which receives heat from a component to be cooled and exchanges heat with a liquid phase coolant;
a plurality of plate-shaped fins, which are arranged in parallel in a standing state on said boiling surface of said base plate, defining a plurality of coolant passages in said evaporation chamber, in which the liquid phase coolant flows through said plurality of coolant passages in one direction from one end portion thereof toward another end portion thereof;
a liquid return port, which is formed in a first portion of said side wall facing, without obstruction, one end portion of said plurality of coolant passages, through which said liquid phase coolant obtained by liquefaction of a vapor phase coolant in a condensation chamber flows into said evaporation chamber, said liquid return port configured so as to be in contact with an edge of said boiling surface; and
a vapor port, which is formed in a portion of said ceiling plate adjacent to a second portion of said side wall facing, without obstruction, another end portion of said plurality of coolant passages, through which said vapor phase coolant obtained by evaporation of said liquid phase coolant in said evaporation chamber is guided into said condensation chamber, wherein a first clearance between said one end portion of said plurality of plate-shaped fins and said first portion of said side wall is set to be less than a second clearance between said other end portion of said plurality of plate-shaped fins and said second portion of said side wall, and
wherein space is formed between said ceiling surface and an upper end portion of said plurality of plate-shaped fins, the space expanding gradually from a liquid return port side of said side wall toward said vapor port.

2. The cooling structure according to claim 1 , wherein said evaporation chamber is mounted on said component to be cooled in a manner in which its boiling surface is in a horizontal posture and said condensation chamber is located upward of said evaporation chamber.

3. The cooling structure according to claim 1 , wherein space between said ceiling surface and said boiling surface expands gradually in a taper-shaped manner from said liquid return port side of said side wall toward said vapor port.

4. The cooling structure according to claim 1 , wherein a liquid return passage is formed so that a flow-in direction of said liquid phase coolant flowing into said evaporation chamber from said liquid return port is in parallel with said boiling surface.

5. The cooling structure according to claim 1 , wherein each of said plate-shaped fins has a plate thickness set to be not less than a distance between the plate-shaped fins facing one another.

6. The cooling structure according to claim 1 , wherein plural liquid return ports are formed in an extension direction of intervals among the plate-shaped fins so as to be in a one-to-one correspondence with plate-shaped fins.

7. The cooling structure according to claim 1 , wherein one or both of a liquid return passage to communicate said liquid return port with said condensation chamber and a vapor passage to communicate said vapor port with said condensation chamber are made of a tube material such as a length of hose whose passage shape is freely deformable.

8. The cooling structure according to claim 1 , further comprising an ultrasonic oscillator generating ultrasonic oscillation to propagate toward at least said boiling surface of said evaporation chamber.

9. An electronic device in which a boiling-type cooling unit employing a cooling structure stated in claim 1 is mounted on a component requiring cooling.

10. The cooling structure according to claim 1 , wherein said plurality of coolant passages each are interposed between any two plate-shaped fins adjacent to each other.

11. The cooling structure according to claim 1 , wherein the space is formed between said ceiling surface and said upper end portion of said plurality of plate-shaped fins, in order to make said vapor phase coolant in a bubble state escape rapidly from said coolant passages.

12. The cooling structure according to claim 1 , wherein the space is formed as a vapor-only escape passage between said ceiling surface and said upper end portion of said plurality of plate-shaped fins, in order to make said vapor phase coolant in a bubble state escape rapidly from said coolant passages.

13. The cooling structure according to claim 1 ,
wherein said plurality of coolant passages each are interposed between any two plate-shaped fins adjacent to each other,
wherein said liquid phase coolant obtained by liquefaction of a vapor phase coolant in a condensation chamber enters from said liquid return port into said evaporation chamber, and flows through said plurality of coolant passages in the one direction, and
wherein the space is formed between said ceiling surface and said upper end portion of said plurality of plate-shaped fins, in order to make said vapor phase coolant in a bubble state escape rapidly from said coolant passages.

Assignees

• Yoshikawa Minoru
• Sakamoto Hitoshi
• Hashiguchi Takeya
• Nec Corp

Inventors

• Yoshikawa Minoru
• Sakamoto Hitoshi
• Hashiguchi Takeya

Classifications

• H10W40/73

  for cooling by change of state · CPC title

• F28F9/026

  with static flow control means, e.g. with means for uniformly distributing heat exchange media into conduits · CPC title

• F28D15/0266 Primary

  with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers (F28D15/043 takes precedence) · CPC title

• H01L2924/00

  Electricity · mapped topic

• H01L2924/0002

  Electricity · mapped topic