Methods of forming borided downhole tools, and related downhole tools
US-2015060051-A1 · Mar 5, 2015 · US
Method for ultra-fast boriding
US9556531B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9556531-B2 |
| Application number | US-201414158181-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jan 17, 2014 |
| Priority date | Jan 17, 2014 |
| Publication date | Jan 31, 2017 |
| Grant date | Jan 31, 2017 |
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Abstract
Official abstract text for this publication.
An article of manufacture and method of forming a borided material. An electrochemical cell is used to process a substrate to deposit a plurality of borided layers on the substrate. The plurality of layers are co-deposited such that a refractory metal boride layer is disposed on a substrate and a rare earth metal boride conforming layer is disposed on the refractory metal boride layer.
First claim
Opening claim text (preview).
The invention claimed is: 1. A method of forming a boride material on a substrate, comprising the steps of, providing a boriding component; providing a substrate having a metal alloy having a first metal constituent comprising tungsten (W) and a second metal constituent comprising rhenium (Re); disposing the substrate and the boriding component in an electrochemical bath; establishing the electrochemical bath at a temperature of about 900°-1050° C.; and forming a first metal constituent conforming boride layer comprising WB 4 on the substrate and a second metal constituent conforming boride layer comprising ReB 2 on the first metal constituent conforming boride layer. 2. The method of forming a boride material on a substrate of claim 1 , wherein the metal alloy consists essentially of W—Re 25% alloy. 3. A method of forming a boride material on a substrate, comprising the steps of, providing a boriding component; providing a substrate having a metal alloy having a first metal constituent comprising tungsten (W) and a second metal constituent comprising rhenium (Re), the metal alloy consisting essentially of W—Re 25% alloy; disposing the substrate and the boriding component in an electrochemical bath; establishing the electrochemical bath at a temperature of about 900°-1050° C.; and forming a first metal constituent conforming boride layer on the substrate and a second metal constituent conforming boride layer on the first metal constituent conforming boride layer. 4. The method of claim 3 , wherein the first metal constituent conforming boride layer comprises WB 4 and the second metal constituent conforming boride layer comprises ReB 2 .
Assignees
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Classifications
- C25D11/028Primary
Borodising,, i.e. borides formed electrochemically · CPC title
from melts · CPC title
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- What does patent US9556531B2 cover?
- An article of manufacture and method of forming a borided material. An electrochemical cell is used to process a substrate to deposit a plurality of borided layers on the substrate. The plurality of layers are co-deposited such that a refractory metal boride layer is disposed on a substrate and a rare earth metal boride conforming layer is disposed on the refractory metal boride layer.
- Who is the assignee on this patent?
- Uchicago Argonne Llc, Uchicago Argonne Llc
- What technology area does this patent fall under?
- Primary CPC classification C25D11/028. Mapped technology areas include Chemistry & Metallurgy.
- When was this patent published?
- Publication date Tue Jan 31 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).