Molding, production method therefor, part for electronic devices and electronic device

US9556513B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9556513-B2
Application numberUS-201113818050-A
CountryUS
Kind codeB2
Filing dateJul 27, 2011
Priority dateAug 20, 2010
Publication dateJan 31, 2017
Grant dateJan 31, 2017

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

The invention is a formed article including a gas barrier layer, the gas barrier layer including a surface layer part that is formed of a material that includes at least a carbon atom, an oxygen atom, and a silicon atom, the surface layer part having a carbon atom content rate of more than 0 and not more than 70%, an oxygen atom content rate of 10 to 70%, a nitrogen atom content rate of 0 to 35%, and a silicon atom content rate of 20 to 55%, based on a total content rate of carbon atoms, oxygen atoms, nitrogen atoms, and silicon atoms; a method for producing the formed article; an electronic device member including the formed article; and an electronic device comprising the electronic device member. The formed article of the invention exhibits an excellent gas barrier capability, excellent transparency, and excellent bending resistance. The method for producing a formed article of the invention can efficiently, safely, and conveniently produce the formed article of the invention. The electronic device member of the invention may suitably be used for electronic devices such as displays and solar cells.

First claim

Opening claim text (preview).

The invention claimed is: 1. A formed article comprising a base layer and a gas barrier layer, wherein the formed article has a thickness of 5 to 300 μm, and has a water vapor transmission rate at a temperature of 40° C. and a relative humidity of 90% of 0.1 g/m 2 /day or less; wherein the gas barrier layer: includes a surface layer part in the area of 0-10 nm in depth from the surface that is formed of a material that includes at least a carbon atom, an oxygen atom, and a silicon atom, the surface layer part having a carbon atom content rate of more than 0 and not more than to 70%, an oxygen atom content rate of 10 to 70%, a nitrogen atom content rate of 1.16 to 35%, and a silicon atom content rate of 20 to 55%, based on a total content rate of carbon atoms, oxygen atoms, nitrogen atoms, and silicon atoms, includes a polysilazane compound and an acrylic resin, wherein the weight average molecular weight of the acrylic resin is 100,000-1,000,000; wherein the acrylic resin is selected from the group consisting of (i) a homopolymer of a (meth)acrylic acid-based compound, (ii) a copolymer of two or more (meth)acrylic acid-based compounds, and (iii) a copolymer of a (meth)acrylic acid-based compound and an additional functional monomer; wherein when the acrylic resin is the copolymer (iii) the content of a repeating unit derived from a (meth)acrylic acid-based compound in the acrylic resin is 50 mol % or more based on the total repeating units in the acrylic resin; wherein a total content of the polysilazane compound and the acrylic resin in the gas barrier layer is 70 mass % or more; has an acrylic resin content of 50 to 60 mass % based on a total content of the polysilazane compound and the acrylic resin, and includes a layer that is obtained by implanting ions into a layer that includes the polysilazane compound and the acrylic resin, the ions being obtained by ionizing at least one gas selected from the group consisting of argon, helium, neon, xenon, krypton in the absence of oxygen ion or nitrogen ion, and implanted into the layer that includes the polysilazane compound and the acrylic resin having a thickness of 30-500 nm by a plasma ion implantation method, the material for forming the base layer being at least one polymer selected from the group consisting of polyimides, polyamides, polyamideimides, polyphenylene ethers, polyether ketones, polyether ether ketones, polyolefins, polyesters, polycarbonates, polysulfones, polyether sulfones, polyphenylene sulfides, polyallylates, acrylic resins, cycloolefin polymers, and aromatic resin polymers. 2. The formed article according to claim 1 , wherein the surface layer part has the carbon atom content rate of 9.45 to 10.56%, oxygen atom content rate of 61.23 to 63.42%, nitrogen atom content rate of 1.16 to 2.97%, and silicon atom content rate of 24.29 to 25.97%, based on a total content rate of carbon atoms, oxygen atoms, nitrogen atoms, and silicon atoms. 3. An electronic device member comprising the formed article according to claim 1 . 4. An electronic device comprising the electronic device member according to claim 3 . 5. A method for producing the formed article according to claim 1 , the method comprising a step of implanting ions into a surface area of a layer that is included in a formed body and includes a polysilazane compound and an acrylic resin, the formed body including the layer that includes the polysilazane compound and the acrylic resin in its surface area, the ions being at least one gas selected from the group consisting of argon, helium, xenon, neon, and krypton in the absence of oxygen ion or nitrogen ion. 6. A method for producing the formed article according to claim 5 , the method comprising implanting ions into a layer that is included in a long formed body and includes a polysilazane compound and an acrylic resin while feeding the formed body in a given direction, the formed body including the layer that includes the polysilazane compound and the acrylic resin in its surface area.

Assignees

Inventors

Classifications

  • with at least one layer of inorganic material and at least one layer of a composition containing a polymer binder · CPC title

  • with only one layer of a composition containing a polymer binder (with more layers C08J7/042) · CPC title

  • Plasma-deposition of organic layers (plasma deposition in general C23C14/00, C23C16/00) · CPC title

  • to surfaces of films or sheets (producing layered products by applying coatings of pasty or pulverulent plastics B29C41/00) · CPC title

  • Layered products comprising {a layer of} synthetic resin {(fibrous or filamentary layer made of a synthetic resin B32B5/02; particulate layer made of a synthetic resin B32B5/16; foamed layer made of a synthetic resin B32B5/18)} · CPC title

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What does patent US9556513B2 cover?
The invention is a formed article including a gas barrier layer, the gas barrier layer including a surface layer part that is formed of a material that includes at least a carbon atom, an oxygen atom, and a silicon atom, the surface layer part having a carbon atom content rate of more than 0 and not more than 70%, an oxygen atom content rate of 10 to 70%, a nitrogen atom content rate of 0 to 35…
Who is the assignee on this patent?
Iwaya Wataru, Kondo Takeshi, Lintec Corp
What technology area does this patent fall under?
Primary CPC classification C23C14/48. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Jan 31 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).