Pressure-sensitive adhesive composition for touch panel

US9556365B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9556365-B2
Application numberUS-201113880597-A
CountryUS
Kind codeB2
Filing dateOct 20, 2011
Priority dateOct 20, 2010
Publication dateJan 31, 2017
Grant dateJan 31, 2017

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

Provided are a pressure-sensitive adhesive composition for a touch panel, a conductive film, a touch panel and a pressure-sensitive adhesive film. The exemplary pressure-sensitive adhesive composition for a touch panel, the conductive film or the pressure-sensitive adhesive film has excellent durability and optical properties such as transparency. In addition, such physical properties are stably maintained under severe conditions. Particularly, a pressure-sensitive adhesive layer is attached to a conductor thin film, and thus resistance change of the conductor thin film is effectively inhibited even when the conductor thin film is exposed to the severe conditions. Therefore, the pressure-sensitive adhesive composition may be effectively used to manufacture a touch panel.

First claim

Opening claim text (preview).

What is claimed is: 1. A pressure-sensitive adhesive composition for a touch panel, consisting of: an acryl polymer; a thiol compound; and a multifunctional crosslinking agent crosslinking the acryl polymer, wherein the thiol compound represented by Formula 1 is included in an amount of 0.001 to 5 parts by weight with respect to 100 parts by weight of the acryl polymer, and wherein the composition meets the condition expressed by Equation 1: Δ R =[( R−R i )/ R i ]×100≦15%  Equation 1 wherein ΔR is a resistance change ratio, R i is an initial resistance of an indium tin oxide (ITO) electrode measured after the pressure-sensitive adhesive layer which is a cured product of the pressure-sensitive adhesive composition is attached to the ITO electrode, R is a resistance of the ITO electrode measured after the ITO electrode to which the pressure-sensitive adhesive layer is attached is maintained at 60° C. and a relative humidity of 90% for 240 hours, HS—R 2   Formula 1 wherein R 2 is an alkyl group or -A—C(═O)—O—R 3 , A is an alkylene group or alkylidene group, R 3 is hydrogen, an alkyl group or -D-C(-E-O—C(═O)-Q-SH) n (R 4 ) (3-n) , D, E and Q are each independantly an alkylene group or alkylidene group, R 4 is an alkyl group, and n is an integer between 1 and 3. 2. The pressure-sensitive composition according to claim 1 , wherein the acryl polymer includes a (meth)acrylic acid ester monomer, and a monomer having a crosslinkable functional group as a polymerization unit. 3. The pressure-sensitive composition according to claim 2 , wherein the (meth)acrylic acid ester monomer is an alkyl (meth)acrylate including an alkyl group having 1 to 20 carbon atoms. 4. The pressure-sensitive composition according to claim 2 , wherein the crosslinkable functional group is a hydroxyl, carboxyl, nitrogen-containing, epoxy or isocyanate group. 5. The pressure-sensitive composition according to claim 1 , wherein the acryl polymer has a weight average molecular weight of 350,000 to 2,500,000. 6. The pressure-sensitive composition according to claim 1 , wherein R 2 is an alkyl group having 4 to 20 carbon atoms. 7. The pressure-sensitive composition according to claim 1 , wherein the multifunctional crosslinking agent is an isocyanate crosslinking agent, an epoxy crosslinking agent, an aziridine crosslinking agent, or a metal chelate crosslinking agent. 8. A pressure-sensitive adhesive film for a touch panel comprising a pressure-sensitive adhesive layer including a pressure-sensitive adhesive composition according to claim 1 in a cured state. 9. A conductive film, comprising: a substrate; and a pressure-sensitive adhesive layer formed on one or both surfaces of the substrate, and including a pressure-sensitive adhesive composition according to claim 1 in a cured state. 10. The conductive film according to claim 9 , wherein the substrate is a plastic substrate. 11. The conductive film according to claim 9 , further comprising a conductive layer on at least one surface of the substrate, wherein the pressure-sensitive adhesive layer is attached to the conductive layer. 12. The conducive film according to claim 9 , further comprising a plate having a conductive layer formed on one surface thereof, wherein the pressure-sensitive adhesive layer is attached to the conductive layer of the plate. 13. The conductive film according to claim 12 , further comprising a conductive layer formed on the substrate, where the conductive layer formed on the substrate is attached to the conductive layer formed on the plate by the pressure-sensitive adhesive layer. 14. A touch panel comprising a conductive film according to claim 9 .

Assignees

Inventors

Classifications

  • C09J7/22Primary

    Plastics; Metallised plastics · CPC title

  • Laminated material (metallised plastics C09J7/22) · CPC title

  • Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond {; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16} · CPC title

  • Control or interface arrangements specially adapted for digitisers · CPC title

  • Touch screens · CPC title

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Frequently asked questions

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What does patent US9556365B2 cover?
Provided are a pressure-sensitive adhesive composition for a touch panel, a conductive film, a touch panel and a pressure-sensitive adhesive film. The exemplary pressure-sensitive adhesive composition for a touch panel, the conductive film or the pressure-sensitive adhesive film has excellent durability and optical properties such as transparency. In addition, such physical properties are stabl…
Who is the assignee on this patent?
Park Min Soo, Yang Se Woo, Chang Suk Ky, and 3 more
What technology area does this patent fall under?
Primary CPC classification C09J7/22. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Jan 31 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).