Resin composition and bonded composite

Patent metadata

Field	Value
Publication number	US-9555604-B2
Application number	US-201113979011-A
Country	US
Kind code	B2
Filing date	Dec 28, 2011
Priority date	Jan 11, 2011
Publication date	Jan 31, 2017
Grant date	Jan 31, 2017

Abstract

A resin composition, preferably an adhesive composition, comprising a polyether polyamide elastomer capable of being strongly bended with a polyimide resin, preferably strongly bended through an easy process to form an interface between the polyimide resin and the composition, and a bonded composite having the resin composition and a polyimide resin which together form an interface to be bonded with each other. A resin composition for forming an interface together with a polyimide resin for bonding, wherein the resin composition comprises a polyether polyamide elastomer (component R) obtained by subjecting a specific aminocarboxylic acid compound A1 and/or lactam compound A2, polyether compound B, and dicarboxylic acid compound C to polymerization, wherein the content of the component R in the resin composition is 80 to 100% by weight.

First claim

The invention claimed is:

1. A bonded composite having a polyimide resin and a resin composition P which together form an interface to be bonded with each other, wherein
a polyimide compound in the polyimide resin is a polyimide compound obtained by subjecting 3,3′,4,4′-biphenyltetracarboxylic dianhydride and p-phenylenediamine to polymerization and/or a polyimide compound obtained by subjecting pyromellitic dianhydride and 4,4′-diaminodiphenyl ether to polymerization, and
the resin composition P comprises a polyether polyamide elastomer (component R) obtained by subjecting an aminocarboxylic acid compound (compound A1) and/or a lactam compound (compound A2), a polyether compound (compound B), and a dicarboxylic acid compound (compound C) to polymerization,
the compound A1 being represented by the following formula (1):
H 2 N—R 1 —COOH  (1)

wherein R 1 represents a linking group comprising a hydrocarbon chain,

the compound A2 being represented by the following formula (2):

wherein R 2 represents a linking group comprising a hydrocarbon chain,

the compound B being a triblock polyether amine compound (compound B1) represented by the following formula (3):

wherein x represents an integer of 1 to 20, y represents an integer of 4 to 50, and z represents an integer of 1 to 20

and/or a polyether compound (compound B2) represented by the following formula (4):

wherein p represents an integer of 1 to 50,
the compound C being represented by the following formula (5):
HOOC R 3 m —COOH  (5)

wherein R 3 represents a linking group comprising a hydrocarbon chain, and m is 0 or 1,

wherein the content of the component R in the resin composition is 80 to 100% by weight, and
the interface is included in a planar, tubular, or spherical surface.

2. A bonded composite which comprises a laminated structure formed by laminating a layer a comprised of a polyimide resin, a layer b comprised of a resin composition P, and a layer c comprised of a resin composition Q different from the resin composition P,
wherein the layer a and the layer b together form an interface to be bonded with each other, and the layer b and the layer c together form an interface to be bonded with each other, and
wherein the resin composition P comprises a polyether polyamide elastomer (component R) obtained by subjecting an aminocarboxylic acid compound (compound A1) and/or a lactam compound (compound A2), a polyether compound (compound B), and a dicarboxylic acid compound (compound C) to polymerization,
the compound A1 being represented by the following formula (1):
H 2 N—R 1 —COOH  (1)

wherein R 1 represents a linking group comprising a hydrocarbon chain,

the compound A2 being represented by the following formula (2):

wherein R 2 represents a linking group comprising a hydrocarbon chain,

the compound B being a triblock polyether amine compound (compound B1) represented by the following formula (3):

wherein x represents an integer of 1 to 20, y represents an integer of 4 to 50, and z represents an integer of 1 to 20

and/or a polyether compound (compound B2) represented by the following formula (4):

wherein p represents an integer of 1 to 50,
the compound C being represented by the following formula (5):
HOOC R 3 m COOH  (5)

wherein R 3 represents a linking group comprising a hydrocarbon chain, and m is 0 or 1,

wherein the content of the component R in the resin composition is 80 to 100% by weight, and
wherein the interface is included in a planar, tubular, or spherical surface.

3. The bonded composite according to claim 2 , wherein the resin composition Q is a polyimide resin.

4. The bonded composite according to claim 2 , wherein the resin composition Q is different from both the polyimide resin and the resin composition P.

5. The bonded composite according to claim 2 , which is in a planar, tubular, or spherical form.

6. The bonded composite according to claim 1 , wherein the ratio of the total amounts of the compounds A1 and A2 to the total amounts of the compounds A1, A2, B, and C {(A1+A2)/(A1+A2+B+C)} is 20 to 60% by weight.

7. The bonded composite according to claim 1 , wherein the ratio of the total amounts of the compounds A1 and A2 to the total amounts of the compounds A1, A2, B, and C {(A1+A2)/(A1+A2+B+C)} is 30 to 55% by weight.

8. The bonded composite according to claim 2 , wherein the ratio of the total amounts of the compounds A1 and A2 to the total amounts of the compounds A1, A2, B, and C {(A1+A2)/(A1+A2+B+C)} is 20 to 80% by weight.

9. The bonded composite according to claim 2 , wherein the ratio of the total amounts of the compounds A1 and A2 to the total amounts of the compounds A1, A2, B, and C {(A1+A2)/(A1+A2+B+C)} is 20 to 60% by weight.

10. The bonded composite according to claim 2 , wherein the ratio of the total amounts of the compounds A1 and A2 to the total amounts of the compounds A1, A2, B, and C {(A1+A2)/(A1+A2+B+C)} is 30 to 55% by weight.

11. The bonded composite according to claim 2 , wherein a polyimide compound in the polyimide resin is a polyimide compound obtained by subjecting 3,3′,4,4′-biphenyltetracarboxylic dianhydride and p-phenylenediamine to polymerization and/or a polyimide compound obtained by subjecting pyromellitic dianhydride and 4,4′-diaminodiphenyl ether to polymerization.

12. A method comprising:
applying a resin composition comprising a polyether polyamide elastomer (component R) obtained by subjecting an aminocarboxylic acid compound (compound A1) and/or a lactam compound (compound A2), a polyether compound (compound B), and a dicarboxylic acid compound (compound C) to polymerization, wherein
the compound A1 is represented by the following formula (1):
H 2 N—R 1 —COOH  (1)

wherein R 1 represents a linking group comprising a hydrocarbon chain,

the compound A2 is represented by the following formula (2):

wherein R 2 represents a linking group comprising a hydrocarbon chain,

the compound B is a triblock polyether amine compound (compound B1) represented by the following formula (3):

wherein x represents an integer of 1 to 20, y represents an integer of 4 to 50, and z represents an integer of 1 to 20

and/or a polyether compound (compound B2) represented by the following formula (4):

wherein p represents an integer of 1 to 50,
the compound C is represented by the following formula (5):
HOOC R 3 m COOH  (5)

wherein R 3 represents a linking group comprising a hydrocarbon chai

Assignees

• Irisa Yuma
• Maeda Shuichi
• Ube Industries

Inventors

• Irisa Yuma
• Maeda Shuichi

Classifications

• C08G69/40

  Polyamides containing oxygen in the form of ether groups (C08G69/12, C08G69/32 take precedence) · CPC title

• B32B2605/18

  Aircraft · CPC title

• B32B27/281 Primary

  comprising polyimides · CPC title

• Y10T428/1393

  Multilayer [continuous layer] · CPC title

• B32B2605/08

  Cars · CPC title