Forging method

US9555505B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9555505-B2
Application numberUS-201214002376-A
CountryUS
Kind codeB2
Filing dateFeb 28, 2012
Priority dateMar 3, 2011
Publication dateJan 31, 2017
Grant dateJan 31, 2017

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

The present invention is directed to a forging method for forming a heat sink 9 including a base board 91 and a plurality of pin fins 92 integrally formed on an upper surface of the base board 91 . A back pressure applying pin 75 of a forging die for forming pin fins 92 are slidably arranged in a fin-forming hole 52 . At the time of plastically deforming a forging blank W, a back pressure is applied by the back pressure applying pin to a metal material of the forging blank W flowed into the fin-forming hole 52 . A concave portion 76 is formed on the restraining tip end face of the back pressure applying pin 75 for restraining the metal material, and a joining convex portion 93 is integrally formed on a tip end of the pin fin 92 by the metal material filled in the concave portion 76.

First claim

Opening claim text (preview).

The invention claimed is: 1. A forging method for forming a heat sink including a base board and a plurality of pin fins integrally formed on at least one surface of the base board by plastically deforming a forging blank by die forging processing, the method comprising: arranging a back pressure applying pin in a fin-forming hole for forming the pin fin in a slidable manner, the fin-forming hole being formed in a forging die, wherein the back pressure applying in includes a concave portion on a restraining tip end face of the back pressure applying pin; applying a back pressure to a metal material of the forging blank flowing into the fin-forming hole with the back pressure applying pin at a time of plastically deforming the forging blank; restraining the metal material with the concave portion on the restraining tip end face of the back pressure applying pin; and integrally forming a joining convex portion on a tip end of the pin fin by the metal material filled in the concave portion. 2. The forging method as recited in claim 1 , wherein the joining convex portion of the pin fin protrudes higher than a thin protruded portion formed at a tip end outer peripheral edge of the pin fin. 3. The forging method as recited in claim 2 , wherein the thin protruded portion is formed by burrs. 4. The forging method as recited in claim 1 , wherein a tip end of the joining convex portion of the pin fin is formed into a flat surface. 5. The forging method as recited in claim 1 , wherein the forging die includes a punch and a die, and wherein the fin-forming hole is provided in the punch. 6. The forging method as recited in claim 1 , wherein the forging die includes a punch and a die, and wherein the fin-forming hole is provided in the die. 7. A production method of a heat sink including a heat transfer plate, the method comprising: a step of obtaining a heat sink by a forging method as recited in claim 1 ; and a step of fixedly joining a heat transfer plate to tip ends of a plurality of pin fins without removing thin protruded portions formed at tip end outer peripheral edges of the plurality of pin fins of the heat sink. 8. A production method of a heat sink including a heat transfer plate, the method comprising: a step of obtaining a heat sink by a forging method as recited in claim 1 ; a correction step of adjusting protruding amounts of joining convex portions of a plurality of pin fins of the heat sink by pressing a corrective punch having a flat pressing surface against tip ends of the plurality of pin fins; and a joining step of fixedly joining a heat transfer plate to the tip ends of the plurality of pin fins after performing the correction step. 9. A correction method of a heat sink, comprising: a step of obtaining a heat sink by a forging method as recited in claim 1 ; and a correction step of adjusting protruding amounts of joining convex portions of a plurality of pin fins of the heat sink by pressing a corrective punch having a flat pressing surface against tip ends of the plurality of pin fins. 10. A forging device for forming a heat sink including a base board and a plurality of pin fins integrally formed on at least one surface of the base board by plastically deforming a forging blank by die forging processing, the forging device comprising: a forging die; a back pressure applying pin arranged in a fin-forming hole of the forging die, wherein a restraining tip end face of the back pressure applying in includes a concave portion that restrains a metal material of the forging blank so that a joining convex portion is integrally formed on a tip end of a pin fin by the metal material filled in the concave portion.

Assignees

Inventors

Classifications

  • Mechanical treatments, e.g. deforming, punching or cutting · CPC title

  • the projecting parts being wire-shaped or pin-shaped · CPC title

  • Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations (F28F3/08 takes precedence) · CPC title

  • B21C23/186Primary

    by backward extrusion · CPC title

  • Making other articles · CPC title

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Frequently asked questions

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What does patent US9555505B2 cover?
The present invention is directed to a forging method for forming a heat sink 9 including a base board 91 and a plurality of pin fins 92 integrally formed on an upper surface of the base board 91 . A back pressure applying pin 75 of a forging die for forming pin fins 92 are slidably arranged in a fin-forming hole 52 . At the time of plastically deforming a forging blank W, a back pr…
Who is the assignee on this patent?
Kokubo Sadao, Igarashi Kazuo, Showa Denko Kk
What technology area does this patent fall under?
Primary CPC classification B21C23/186. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Jan 31 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).