Structure with several cavities provided with access channels of different heights

Patent metadata

Field	Value
Publication number	US-9554471-B2
Application number	US-201514725028-A
Country	US
Kind code	B2
Filing date	May 29, 2015
Priority date	Jun 3, 2014
Publication date	Jan 24, 2017
Grant date	Jan 24, 2017

Abstract

A packaging structure including:
a cover secured to a first substrate and forming first and second distinct cavities between the cover and the first substrate, first and second channels formed in the first substrate and/or in the cover and/or between the first substrate and the cover, the first channel including a first end leading into the first cavity and a second end leading off the first cavity via a first hole passing through the cover, the second channel including a first end leading into the second cavity and a second end leading off the second cavity via a second hole passing through the cover, a height H A of the first channel at its second end is lower than a height H B of the second channel at its second end.

First claim

The invention claimed is:

1. A packaging structure including:
at least one cover secured to at least one first substrate and forming at least first and second distinct cavities between the cover and the first substrate,
at least first and second channels formed in the first substrate and/or in the cover and/or between the first substrate and the cover, such that the first channel includes a first end leading into the first cavity and a second end leading off the first cavity via at least one first hole formed through the cover, and in that the second channel includes a first end leading into the second cavity and a second end leading off the second cavity via at least one second hole formed through the cover,
wherein a height H A of the first channel at its second end is lower than a height H B of the second channel at its second end,
wherein the second end of the first channel is plugged by at least one first portion of a first closing layer with a thickness E 1 higher than the height H A and lower than the height H B , and wherein the second end of the second channel is plugged by at least:
one second portion of the first closing layer and a portion of a second closing layer with a thickness E 2 such that H B <(E 1 +E 2 ), or
the second portion of the first closing layer and a portion of a material soldered to the second portion of the first closing layer and with a thickness E 2 such that H B <(E 1 +E 2 ), or
the second portion of the first closing layer and a portion of a plugging layer plugging the second hole on the cover.

2. The packaging structure according to claim 1 , wherein the difference between the heights H A and H B is such that it is possible to close the first channel via depositing a closing layer at the second ends of the first and second channels without closing the second channel.

3. The packaging structure according to claim 1 , wherein at least one first micro-device is provided in the first cavity and/or wherein at least one second micro-device is provided in the second cavity.

4. The packaging structure according to claim 1 , wherein:
at least one first micro-device is provided in the first cavity and/or wherein at least one second micro-device is provided in the second cavity, and
when the first micro-device is provided in the first cavity, the first closing layer includes at least one electrically conductive material, the packaging structure including at least one first electrical connection element connected to the first micro-device and to the first portion of the first closing layer, and at least one first electrical contact provided at least partly in the first hole and connected to the first portion of the first closing layer, and/or
when the second micro-device is provided in the second cavity, the materials plugging the second end of the second channel are electrically conductive, the packaging structure including at least one second electrical connection element connected to the second micro-device and to the second portion of the first closing layer, and at least one second electrical contact provided at least partly in the second hole and connected to the portion of the second closing layer or to the portion of the material soldered to the second portion of the first closing layer.

5. The packaging structure according to claim 1 , wherein the first channel passes through at least one side wall of the first cavity and/or wherein the second channel passes at least through a side wall of the second cavity.

6. The packaging structure according to claim 1 , wherein the cover includes at least one substrate called a second substrate secured to the first substrate and such that the first and second cavities are formed at least partly in the second substrate.

7. The packaging structure according to claim 6 , wherein the second substrate is secured to the first substrate via a bonding interface provided between the first substrate and the second substrate and such that the first and second channels are formed at least partly in the bonding interface.

8. The packaging structure according to claim 1 , wherein the cover includes at least one thin layer provided on the first substrate, and wherein the first and second channels are formed at least in the first substrate.

9. The packaging structure according to claim 1 , wherein the cover includes at least two thin layers superimposed above each other and provided on the first substrate, and wherein the first and second channels are formed at least by spaces between both thin layers.

10. A method for making a packaging structure, including making at least one cover secured to at least one first substrate forming at least first and second distinct cavities between the cover and the first substrate, and making at least first and second channels in the first substrate and/or in the cover and/or between the first substrate and the cover, such that the first channel includes a first end leading into the first cavity and a second end leading off the first cavity via at least one first hole formed through the cover, and in that the second channel includes a first end leading into the second cavity and a second end leading off the second cavity via at least one second hole formed through the cover, wherein a height H A of the first channel at its second end is lower than a height H B of the second channel at its second end, further including, after making the cover and the first and second channels, depositing at least one first closing layer with a thickness E 1 higher than the height H A and lower than the height H B such that at least one first portion of the first closing layer plugs the second end of the first channel, and then:
depositing at least one second closing layer with a thickness E 2 such that H B <(E 1 +E 2 ) and in that at least one second portion of the first closing layer and a portion of the second closing layer plugs the second end of the second channel, or
depositing at least one portion of soldering material with a thickness E 2 such that H B <(E 1 +E 2 ) onto the second portion of the first closing layer, and then soldering the portion of soldering material, or
making at least one portion of plugging layer plugging the second hole on the cover.

11. The method according to claim 10 , wherein making the cover and the first and second channels includes at least the implementation of the following steps of:
making first and second channels at a face of a second substrate intended to be secured to the first substrate;
making first and second cavities at said face of the second substrate;
securing said face of the second substrate to the first substrate;
making first and second holes through the second substrate,
wherein the first channel passes at least through a side wall of the first cavity and/or wherein the second channel passes at least through a side wall of the second cavity.

12. The method according to claim 10 , wherein making the cover and the first and second channels includes at least the implementation of the following steps of:
making first and second cavities at one face of a second substrate intended to be secured to the first substrate;
making a bonding interface on said face of the second substrate and/or a face of the first substrate to which the second substrate is intended to be secured, the first and second channels being formed at least partly in the bonding interface;
securing said face of the second substrate to the first substrate via the bonding interface;
making the first and second holes through the second substrate.

13. The method according to claim 10 , wherein making the cover and the first and second channels

Assignees

• Commissariat Energie Atomique

Inventors

• Baillin Xavier

Classifications

• B32B38/0008

  Electrical discharge treatment, e.g. corona, plasma treatment; wave energy or particle radiation (heat treatment B32B38/0036) · CPC title

• B32B2457/00

  Electrical equipment · CPC title

• B81C2203/0136

  Growing or depositing of a covering layer · CPC title

• B32B3/30

  characterised by a layer formed with recesses or projections, e.g. {hollows, grooves, protuberances, ribs (apertured layer B32B3/266; layer with cavities or internal voids B32B3/26)} · CPC title

• H05K2201/09036

  Recesses or grooves in insulating substrate · CPC title