Printed circuit board module and electronic device
US-2024260184-A1 · Aug 1, 2024 · US
US9554459B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9554459-B2 |
| Application number | US-201514950214-A |
| Country | US |
| Kind code | B2 |
| Filing date | Nov 24, 2015 |
| Priority date | Jun 20, 2014 |
| Publication date | Jan 24, 2017 |
| Grant date | Jan 24, 2017 |
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Official abstract text for this publication.
A microfluidic refill includes a reservoir having a hollow body and an opening; a transport member in fluid communication with the reservoir; and a lid enclosing the opening of the reservoir. The lid is in fluid communication with the transport member. The lid comprises a rigid microfluidic delivery member. The rigid microfluidic delivery member includes a die and electrical traces that are in electrical communication with the die, wherein the electrical traces terminate at electrical contacts, wherein the electrical traces are disposed on only one plane. The die has a fluid chamber in fluid communication with the transport member at an inlet of the fluid chamber and with an orifice at an outlet of the fluid chamber and.
Opening claim text (preview).
What is claimed is: 1. A method of connecting a microfluidic delivery refill with a housing, wherein the microfluidic delivery refill comprises a rigid microfluidic delivery member having a die and electrical leads that are in electrical communication with the die, wherein the electrical leads terminate at electrical contacts, wherein the electrical contacts are disposed on a first plane, wherein the microfluidic delivery refill comprises a reservoir that contains a perfume composition, wherein the die comprises a silicon support substrate and a conductive layer that is disposed on the silicon support substrate, wherein the conductive layer comprises at least one heater, wherein the housing comprises electrical contacts, the method comprising the steps of: electrically connecting the electrical contacts of the microfluidic delivery refill with the electrical contacts of the housing by sliding the microfluidic delivery refill toward an interior of the housing in only one direction that is parallel with the first plane. 2. The method according to claim 1 , wherein the housing comprises a fan. 3. The method according to claim 1 , wherein the microfluidic delivery refill includes a piezoelectric material or a heater. 4. The method according to claim 1 , wherein the microfluidic delivery system is powered by battery. 5. The method according to claim 1 , wherein the transfer member is configured to wick the fluid composition upward from the reservoir and toward the microfluidic delivery member, in opposition to the force of gravity. 6. The method according to claim 1 , wherein the microfluidic delivery system comprises at least one sensor. 7. The method according to claim 1 , wherein the microfluidic delivery system is powered by an AC outlet. 8. The method according to claim 1 further comprising the step of removing the microfluidic delivery refill from the housing by moving the microfluidic delivery refill in a direction parallel with the first plane.
by attaching repair preform, e.g., remaking, restoring, or patching · CPC title
Structure of nozzle plates · CPC title
Removable lids or covers (with means for piercing, cutting, or tearing a frangible inner closure B65D51/22) · CPC title
Adaptations for fluid transport, e.g. channels, holes · CPC title
Containers or packages with special means for dispensing contents (dispensing means incorporated in closures B65D47/00) · CPC title
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