Systems and methods using external heater systems in microfluidic devices

Patent metadata

Field	Value
Publication number	US-9554422-B2
Application number	US-201213474523-A
Country	US
Kind code	B2
Filing date	May 17, 2012
Priority date	May 17, 2011
Publication date	Jan 24, 2017
Grant date	Jan 24, 2017

Abstract

The present invention relates to methods and systems that result in high quality, reproducible, thermal melt analysis on a microfluidic platform. The present invention relates to methods and systems using thermal systems including heat spreading devices, including interconnection methods and materials developed to connect heat spreaders to microfluidic devices. The present invention also relates to methods and systems for controlling, measuring, and calibrating the thermal systems of the present invention.

First claim

The invention claimed is:

1. A heating system for microfluidic devices comprising:
a) a microfluidic device having two or more reservoirs or channels;
b) a heat spreader, wherein the heat spreader is affixed to the microfluidic device such that the reservoirs or channels disposed on said microfluidic device are in thermal communication with the heat spreader, wherein the heat spreader is made of anisotropic material and is aligned with the microfluidic device to provide uniformity of temperature between the two or more channels, wherein a high conductance orientation of the heat spreader is aligned parallel to the plane having the two or more reservoirs or channels;
c) a heating means for heating the heat spreader;
d) a measuring means for measuring one or more temperatures of the channels or reservoirs, wherein the measuring means comprises one or more temperature sensors; and,
wherein (i) an external resistive heater and an external temperature sensor are attached to the heat spreader and (ii) the microfluidic device comprises at least one embedded temperature sensor.

2. The system of claim 1 , wherein the measuring means comprises one or more temperature sensors selected from the group comprising temperature sensors embedded within the microfluidic device and temperature sensors external to the microfluidic device.

3. The system of claim 2 , wherein the one or more external sensors have a thermal capacitance that is matched to that of the temperature zone on the microfluidic device.

4. The system of claim 2 , wherein the embedded sensors are passivated to prevent direct contact with samples in the two or more reservoirs or fluidic channels.

5. The system of claim 4 , wherein the passivation materials comprise one or more of the following: glass, silicon dioxide, silicon nitride, silicon, polysilicon, parylene, polyimide, Kapton, or benzocyclobutene (BCB).

6. The system of claim 1 , further comprising an external resistive heater.

7. The system of claim 1 , wherein the embedded temperature sensor is a resistance temperature detector (RTD).

8. The system of claim 7 , wherein the at least one embedded RTI) acts as both a temperature sensor and a heater.

9. The system of claim 1 , wherein the at least one embedded temperature sensor and the heat spreader are located spatially apart on the microfluidic device.

10. The system of claim 1 wherein the at least one embedded temperature sensor is at least partially beneath the heat spreader.

11. The system of claim 1 , wherein the heat spreader is symmetric in at least one direction.

12. The system of claim 1 wherein the heat spreader is made from an anisotropic thermally conductive material or from a composite including an anisotropic thermally conductive material.

13. The system of claim 1 wherein an anisotropic thermally conductive thermal interface material connects the heat spreader to the microfluidic device.

14. The system of claim 12 , wherein the anisotropic thermally conductive materials are chosen from the group consisting of: graphite, graphene, diamonds of natural or synthetic origin, or carbon nanotubes (CNTs).

15. The system of claim 13 , wherein the anisotropic thermally conductive materials are chosen from the group consisting of: graphite, graphene, diamonds of natural or synthetic origin, or carbon nanotubes (CNTs).

16. The system of claim 12 , wherein the anisotropic thermally conductive material is configured such that its orientation exhibiting the highest thermal conductance is aligned with the orientation in which of the two or more reservoirs or channels are disposed on the microfluidic device.

17. The system of claim 13 , wherein the anisotropic thermally conductive material is configured such that its orientation exhibiting the highest thermal conductance is aligned with the orientation in which of the two or more reservoirs or channels are disposed on the microfluidic device.

18. The system of claim 1 wherein the heat spreader includes one or more recesses for attachment of one or more sensors.

19. The system of claim 1 further comprising insulation over at least one temperature sensor located on the heat spreader.

20. The system of claim 1 wherein the heat spreader is affixed to the microfluidic device by applying high pressure.

21. The system of claim 20 , wherein the high pressure is generated by pneumatics, spring assemblies, drive screws, or dead weight.

22. The system of claim 20 wherein the heat spreader is permanently affixed to the microfluidic device.

23. The system of claim 22 wherein the permanent bond is made with cyanoacrylate adhesive.

24. The system of claim 1 wherein the heat spreader is affixed to the microfluidic device using a material that includes nano or microparticles to increase the thermal conductance of the interconnection.

25. The system of claim 24 where the nano or microparticles are selected from the group comprising: silver, gold, aluminum and alloys thereof, copper and alloys thereof, zinc, tin, iron, CNTs, graphite, natural diamond, synthetic diamond, alumina, silica, titania, zinc oxide, tin oxide, iron oxide, and beryllium oxide.

26. The system of claim 1 , further comprising a cooling means to adjust the temperature of the heat spreader or the two or more fluidic channels or reservoirs.

27. The system of claim 26 , wherein the cooling means is configured to limit heat losses from samples present in the two or more fluidic channels OF reservoirs.

28. The system of claim 26 , wherein the cooling means improves uniformity of temperature in the temperature zone by limiting heat losses.

29. The system of claim 26 , wherein the cooling means is a PWM fan or blower.

30. The system of claim 1 wherein nucleic acid melt analysis occurs independently in each of the two or more channels of the microfluidic device.

31. The system of claim 30 , wherein amplification of DNA occurs on the microfluidic device prior to nucleic acid melt analysis.

32. The system of claim 30 wherein the nucleic acid melt analysis determines the genotype of biological samples provided on the microfluidic device based on a melt temperature of the nucleic acid.

Assignees

• Coursey Johnathan S
• Hasson Kenton C
• Canon Us Life Sciences Inc

Inventors

• Coursey Johnathan S
• Hasson Kenton C

Classifications

• B01L2300/0816

  Cards, e.g. flat sample carriers usually with flow in two horizontal directions · CPC title

• B01L2300/1894

  Cooling means; Cryo cooling · CPC title

• B01L3/5027 Primary

  by integrated microfluidic structures, i.e. dimensions of channels and chambers are such that surface tension forces are important, e.g. lab-on-a-chip · CPC title

• B01L2200/148

  Specific details about calibrations · CPC title

• B01L2300/1844

  using fans · CPC title