Solid-state electrolytic capacitor manufacturing method and solid-state electrolytic capacitor

Patent metadata

Field	Value
Publication number	US-9552928-B2
Application number	US-201314049320-A
Country	US
Kind code	B2
Filing date	Oct 9, 2013
Priority date	Apr 20, 2011
Publication date	Jan 24, 2017
Grant date	Jan 24, 2017

Abstract

A solid electrolytic capacitor having grooves provided in a valve-acting metal substrate that includes a porous surface part and a non-porous body part, the bottoms of the grooves being non-porous. The valve-acting metal substrate is divided into a plurality of unit regions by the grooves, and define cathode layer formation parts in the porous surface parts for each unit region. A dielectric layer covers the surfaces of the cathode layer formation parts of the valve-acting metal substrate and the grooves between the cathode layer formation parts. A solid electrolyte layer and a cathode extraction layer cover the surface of the dielectric layer, thereby providing a sheet in which a plurality of solid electrolytic capacitor elements are prepared integrally with the grooves interposed therebetween. The sheet is cut at the grooves, and a dielectric layer is formed on the cut surfaces located around the cathode layer formation parts.

First claim

The invention claimed is:

1. A method for manufacturing a solid electrolytic capacitor, the method comprising:
(a) forming grooves in opposed principal surfaces of a valve-acting metal substrate that includes a porous surface part and a non-porous body part such that bottoms of the grooves are non-porous, partitioning the opposed principal surfaces of the valve-acting metal substrate into a plurality of unit regions at the grooves, and defining a cathode layer formation part in the porous surface part for each unit region;
(b) forming a first dielectric layer on surfaces of the cathode layer formation parts of the valve-acting metal substrate and on the grooves between the cathode layer formation parts;
(c) sequentially forming a solid electrolyte layer and a cathode extraction layer on a surface of the first dielectric layer formed on the cathode layer formation parts of the valve-acting metal substrate so as to provide a sheet having a plurality of solid electrolytic capacitor elements corresponding to the plurality of unit regions integral with the grooves interposed therebetween;
(d) cutting the sheet at the grooves of the valve-acting metal substrate; and
(e) forming a second dielectric layer on cut surfaces located around the cathode layer formation parts of the valve-acting metal substrate.

2. The method for manufacturing a solid electrolytic capacitor according to claim 1 , wherein steps (a) to (c) are applied to each of a plurality of the valve-acting metal substrates to form a plurality of sheets, stacking the plurality of sheets, and cutting at the grooves of the valve-acting metal substrates of the plurality of sheets.

3. The method for manufacturing a solid electrolytic capacitor according to claim 1 , wherein the grooves of the valve-acting metal substrate are formed by pressing the valve-acting metal substrate in a thickness direction.

4. The method for manufacturing a solid electrolytic capacitor according to claim 1 , wherein the grooves of the valve-acting metal substrate are formed by removing the porous surface part from the valve-acting metal substrate.

5. A method for manufacturing a solid electrolytic capacitor, the method comprising:
(a) forming grooves in opposed principal surfaces of a valve-acting metal substrate that includes a porous surface part and a non-porous body part such that bottoms of the grooves are non-porous, partitioning the opposed principal surfaces of the valve-acting metal substrate into a plurality of unit regions at the grooves, and defining a cathode layer formation part in the porous surface part for each unit region;
(b) forming a resist layer on the bottoms of the grooves, and forming a dielectric layer on the surfaces of the cathode layer formation parts of the valve-acting metal substrate is carried out;
(c) sequentially forming a solid electrolyte layer and a cathode extraction layer on a surface of the first dielectric layer formed on the cathode layer formation parts of the valve-acting metal substrate so as to provide a sheet having a plurality of solid electrolytic capacitor elements corresponding to the plurality of unit regions integral with the grooves interposed therebetween;
(d) cutting the sheet at the grooves of the valve-acting metal substrate; and
(e) forming a second dielectric layer on cut surfaces located around the cathode layer formation parts of the valve-acting metal substrate.

6. The method for manufacturing a solid electrolytic capacitor according to claim 5 , wherein steps (a) to (c) are applied to each of a plurality of the valve-acting metal substrates to form a plurality of sheets, stacking the plurality of sheets, and cutting at the grooves of the valve-acting metal substrates of the plurality of sheets.

7. A method for manufacturing a solid electrolytic capacitor, the method comprising:
(a) forming grooves in opposed principal surfaces of a plurality of valve-acting metal substrate that includes a porous surface part and a non-porous body part such that bottoms of the grooves are non-porous, partitioning the opposed principal surfaces of the plurality of valve-acting metal substrate into a plurality of unit regions at the grooves, and defining a cathode layer formation part in the porous surface part for each unit region;
(b) forming a first dielectric layer on surfaces of the cathode layer formation parts of the plurality of valve-acting metal substrates and on the grooves between the cathode layer formation parts;
(c) stacking the plurality of valve-acting metal substrates with to form a laminate;
(d) joining adjacent valve-acting metal substrates in the laminate to each other to obtain a joined laminate;
(e) forming a continuous solid electrolyte layer so as to fill gaps between the first dielectric layers formed on surfaces of cathode layer formation parts of adjacent valve-acting metal substrates in the joined laminate, and coating an outer surface of the joined laminate in the cathode layer formation parts;
(f) cutting the joined laminate at the grooves of the plurality of valve-acting metal substrates; and
(g) forming a second dielectric layer on cut surfaces located around the cathode layer formation parts of the plurality of valve-acting metal substrates.

8. The method for manufacturing a solid electrolytic capacitor according to claim 7 , wherein the grooves of the plurality of valve-acting metal substrate are formed by pressing the plurality of valve-acting metal substrates in a thickness direction.

9. The method for manufacturing a solid electrolytic capacitor according to claim 7 , wherein the grooves of the valve-acting metal substrate are formed by removing the porous surface part from the plurality of valve-acting metal substrates.

10. A method for manufacturing a solid electrolytic capacitor, the method comprising:
(a) forming grooves in opposed principal surfaces of a plurality of valve-acting metal substrate that includes a porous surface part and a non-porous body part such that bottoms of the grooves are non-porous, partitioning the opposed principal surfaces of the plurality of valve-acting metal substrate into a plurality of unit regions at the grooves, and defining a cathode layer formation part in the porous surface part for each unit region;
(b) forming a resist layer on the bottoms of the grooves, and forming a dielectric layer on the surfaces of the cathode layer formation parts of the valve-acting metal substrate is carried out;
(c) stacking the plurality of valve-acting metal substrates with to form a laminate;
(d) joining adjacent valve-acting metal substrates in the laminate to each other to obtain a joined laminate;
(e) forming a continuous solid electrolyte layer so as to fill gaps between the first dielectric layers formed on surfaces of cathode layer formation parts of adjacent valve-acting metal substrates in the joined laminate, and coating an outer surface of the joined laminate in the cathode layer formation parts;
(f) cutting the joined laminate at the grooves of the plurality of valve-acting metal substrates; and
(g) forming a second dielectric layer on cut surfaces located around the cathode layer formation parts of the plurality of valve-acting metal substrates.

Assignees

• Murata Manufacturing Co

Inventors

• Fujimoto Koji
• Matsushita Emi
• Kuromi Hitoshi
• Ueno Taro
• Koshido Yoshihiro

Classifications

• H01G9/0032 Primary

  formation of the dielectric layer · CPC title

• H01G9/025

  Solid electrolytes (H01G11/54 takes precedence) · CPC title

• H01G9/15 Primary

  Solid electrolytic capacitors (H01G11/00 takes precedence) · CPC title

• H01G13/00

  Apparatus specially adapted for manufacturing capacitors; Processes specially adapted for manufacturing capacitors not provided for in groups H01G4/00 - H01G11/00 · CPC title

• H01G9/055

  Etched foil electrodes · CPC title