Proper installation determination based on RFID
US-9519813-B2 · Dec 13, 2016 · US
US9552541B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9552541-B2 |
| Application number | US-201414581576-A |
| Country | US |
| Kind code | B2 |
| Filing date | Dec 23, 2014 |
| Priority date | Oct 3, 2008 |
| Publication date | Jan 24, 2017 |
| Grant date | Jan 24, 2017 |
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A Non-transferable Radio Frequency Identification (RFID) assembly for attachment to an article comprises a RFID module; and a antenna module coupled with the RFID module, the antenna module comprising a conductive layer, a substrate, and an adhesive modification layer between the conductive layer and the substrate, the adhesive modification layer configured such that when the assembly is attached to the article and attempt to remove the assembly will cause the substrate to release and leave the conductive layer intact.
Opening claim text (preview).
What is claimed is: 1. An assembly for tracking articles, comprising: a radio frequency identification (RFID) module; and an antenna module coupled with the RFID module, the antenna module comprising: a first conductive layer, a first substrate, and an adhesive modification layer between the first conductive layer and the first substrate, wherein the adhesive modification layer is configured such that when the assembly is attached to an article, an attempt to remove the assembly from the article will cause a disturbance to at least a portion of the first conductive layer, wherein the first conductive layer is positioned between the RFID module and the first substrate. 2. The assembly as recited in claim 1 , wherein the attempt to remove the assembly from the article leaves the RFID module intact. 3. The assembly as recited in claim 1 , wherein the disturbance to at least the portion of the first conductive layer changes a range of performance gain provided by the antenna module. 4. The assembly as recited in claim 1 , wherein the disturbance to at least the portion of the first conductive layer disables the antenna module and returns the RFID module to a native performance characteristic. 5. The assembly as recited in claim 1 , wherein the RFID module comprises a second substrate, a second conductive layer on the second substrate, and a chip attached to the second conductive layer. 6. The assembly as recited in claim 5 , wherein the second conductive layer comprises a conductive loop. 7. The assembly as recited in claim 6 , wherein the first conductive layer comprises an antenna pattern. 8. The assembly as recited in claim 7 , wherein the chip is impendence matched with a combination of the conductive loop and the antenna pattern. 9. The assembly as recited in claim 7 , wherein the disturbance includes a disturbance to at least a portion of the antenna pattern. 10. The assembly as recited in claim 1 , further comprising an adhesive layer, wherein the adhesive layer couples the RFID module to the antenna module and attaches the assembly to the article. 11. The assembly as recited in claim 1 , wherein the RFID module is capacitively coupled to the antenna module. 12. A radio frequency identification (RFID) module, comprising: a substrate; a conductive layer on the substrate; an RFID chip attached to the conductive layer; and an adhesive modification layer between the conductive layer and the substrate, wherein the adhesive modification layer is configured such that when the RFID module is attached to an article, an attempt to remove the RFID module from the article will cause the substrate to release from the conductive layer, while the conductive layer and the RFID chip remain attached to the article. 13. The RFID module as recited in claim 12 , wherein the conductive layer comprises a conductive loop. 14. The RFID module as recited in claim 12 , further comprising an adhesive layer over the RFID chip and the conductive layer, wherein the adhesive layer attaches the RFID module to the article. 15. The RFID module as recited in claim 12 , wherein the conductive layer comprises an antenna pattern.
part of the antenna or the integrated circuit being adapted for rupturing or breaking, e.g. record carriers functioning as sealing devices for detecting not-authenticated opening of containers (electronic seals G09F3/03) · CPC title
having a radio frequency identification chip · CPC title
the record carrier comprising an arrangement for non-contact communication, e.g. wireless communication circuits on transponder cards, non-contact smart cards or RFIDs · CPC title
the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card · CPC title
the record carrier being multilayered, e.g. laminated sheets (flat articles in general, see B32B37/00) · CPC title
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