Cooling electronic devices in a data center

Patent metadata

Field	Value
Publication number	US-9552025-B2
Application number	US-201414494216-A
Country	US
Kind code	B2
Filing date	Sep 23, 2014
Priority date	Sep 23, 2014
Publication date	Jan 24, 2017
Grant date	Jan 24, 2017

Abstract

A data center cooling system includes a thermosiphon, an actuator coupled to the thermosiphon, and a controller. The thermosiphon includes an evaporator; a condenser; and at least one conduit coupled between the evaporator and the condenser to transport a working fluid between the evaporator and the condenser. The controller is coupled to the actuator and configured to operate the actuator to adjust a liquid level of the working fluid in the evaporator based, at least in part, on a parameter associated with a heat load of one or more data center heat generating computing devices.

First claim

What is claimed is:

1. A data center cooling system, comprising:
a thermosiphon, comprising:
an evaporator;
a condenser; and
at least one conduit coupled between the evaporator and the condenser to transport a working fluid between the evaporator and the condenser;

an actuator coupled to the thermosiphon; and
a controller coupled to the actuator and configured to operate the actuator to adjust a liquid level of the working fluid in the evaporator based, at least in part, on a parameter associated with a heat load of one or more data center heat generating computing devices.

2. The data center cooling system of claim 1 , wherein the actuator comprises a height adjustment assembly coupled to the condenser.

3. The data center cooling system of claim 2 , wherein the height adjustment assembly is mounted to the condenser and arranged to adjust a position of the condenser to adjust a vertical distance between the condenser and the evaporator based, at least in part, on the parameter.

4. The data center cooling system of claim 2 , wherein the height adjustment assembly is mounted to the condenser and arranged to vibrate the condenser based, at least in part, on the parameter.

5. The data center cooling system of claim 2 , wherein a combination of the controller and the height adjustment assembly is arranged as a bimetallic member in contact with at least one of the condenser or the conduit, the bimetallic member arranged to adjust a position of the condenser to adjust a vertical distance between the condenser and the evaporator based, at least in part, on the parameter, the parameter comprising a temperature difference between a temperature of the condenser or the conduit and a reference temperature.

6. The data center cooling system of claim 2 , wherein a combination of the controller and the height adjustment assembly is arranged as a phase change motor in contact with the condenser, the phase change motor arranged to adjust a position of the condenser to adjust a vertical distance between the condenser and the evaporator based, at least in part, on the parameter, the parameter comprising a temperature of the condenser relative to a temperature of a phase change material of the phase change motor.

7. The data center cooling system of claim 1 , wherein the actuator comprises a piston mounted in a working volume of the condenser.

8. The data center cooling system of claim 7 , wherein the piston is arranged to oscillate in the condenser to adjust the working volume based, at least in part, on the parameter.

9. The data center cooling system of claim 7 , wherein the piston is arranged to vibrate the condenser based, at least in part, on the parameter.

10. The data center cooling system of claim 1 , wherein the actuator comprises an angular adjustment assembly coupled to the condenser.

11. The data center cooling system of claim 10 , wherein the angular adjustment assembly is mounted to the condenser and arranged to rotate or pivot the condenser based, at least in part, on the parameter.

12. The data center cooling system of claim 10 , wherein the angular adjustment assembly is arranged to vibrate the condenser based, at least in part, on the parameter.

13. The data center cooling system of claim 1 , wherein the conduit comprises a liquid line and a vapor line, and the actuator comprises a valve positioned in the liquid line.

14. The data center cooling system of claim 13 , wherein the valve is arranged to modulate toward a closed position or an open position based, at least in part, on the parameter.

15. The data center cooling system of claim 1 , wherein the actuator comprises a vibration assembly coupled to the condenser and arranged to vibrate the condenser based, at least in part, on the parameter.

16. The data center cooling system of claim 1 , wherein the conduit couples the evaporator and the condenser at a downward angle relative to gravity from the condenser to the evaporator.

17. The data center cooling system of claim 1 , wherein the conduit is flexible.

18. The data center cooling system of claim 1 , wherein the parameter comprises at least one of: a temperature of air adjacent the rack-mounted device, a temperature of air adjacent the condenser, a temperature of the one or more data center heat generating computing devices, a temperature of a motherboard that supports the one or more data center heat generating computing devices, the liquid level of the working fluid in the evaporator, a pressure of the working fluid, a temperature of the working fluid, a power usage of the one or more data center heat generating computing devices, a frequency of the one or more data center heat generating computing devices, or a utilization of the one or more data center heat generating computing devices.

19. The data center cooling system of claim 1 , further comprising a wicking material mounted in the conduit between the condenser and the evaporator.

20. The data center cooling system of claim 1 , wherein the evaporator comprises:
a base and a case that define a chamber for the working fluid; and
a plurality of fins integrally formed with the base that extend into the chamber from the base.

21. A method for cooling heat generating devices in a data center, comprising: circulating a working fluid between an evaporator of a thermosiphon and a condenser of the thermosiphon in a downwardly angled conduit that fluidly couples the evaporator and the condenser, the working fluid comprising a gas when circulated from the evaporator to the condenser and a liquid when circulated from the condenser to the evaporator; cooling, based on the circulating, one or more heat generating devices in thermal communication with the evaporator; determining with a controller a parameter associated with a heat load of at least one of the heat generating devices, wherein the parameter comprises at least one of: a temperature of air adjacent rack-mounted device, a temperature of air adjacent the condenser, a temperature of the heat generating, a temperature of a surface that support supports the heat generating device, a liquid level of the working fluid in the evaporator, a pressure of the working fluid, a temperature of the working fluid, a power usage of the heat generating device, a frequency of the heat generating device, or a utilization of the heat generating device; and based at least in part on the determined parameter, operating an actuator coupled to the thermosiphon to adjust a liquid level of the working fluid in the evaporator.

22. The method of claim 21 , wherein operating the actuator comprises operating a height adjustment assembly coupled to the condenser to adjust a position of the condenser to adjust a vertical distance between the condenser and the evaporator based, at least in part, on the determined parameter.

23. The method of claim 22 , wherein operating the actuator further comprises operating the height adjustment assembly to vibrate the condenser based, at least in part, on the determined parameter.

24. The method of claim 21 , wherein operating the actuator comprises adjusting a position of the condenser with a bimetallic member in contact with at least one of the condenser or the conduit to adjust a vertical distance between the condenser and the evaporator based, at least in part, on the determined parameter, the determined parameter comprising a temperature difference between a temperature of the condenser or the conduit and a reference temperature

Assignees

• Google Inc

Inventors

• Samadiani Emad
• Wong Eehern J
• Imwalle Gregory P
• Farshchian Soheil

Classifications

• H05K7/20809 Primary

  within server blades for removing heat from heat source · CPC title

• H05K7/20836

  Thermal management, e.g. server temperature control · CPC title

• H05K7/20318

  Condensers · CPC title

• H05K7/20336

  Heat pipes, e.g. wicks or capillary pumps · CPC title

• G06F2200/201

  Cooling arrangements using cooling fluid · CPC title