Thermosetting resin composition, method for producing same, method for producing cured resin product, and method for causing self-polymerization of epoxy compound

Patent metadata

Field	Value
Publication number	US-9550877-B2
Application number	US-201514643799-A
Country	US
Kind code	B2
Filing date	Mar 10, 2015
Priority date	Sep 28, 2012
Publication date	Jan 24, 2017
Grant date	Jan 24, 2017

Abstract

The present invention is directed to provide at least one of a novel thermosetting resin composition using an epoxy compound, a method for producing the composition, a method for producing a novel cured resin using an epoxy compound, and a novel method for causing self-polymerization of an epoxy compound. The thermosetting resin composition includes an epoxy compound, a gallium compound, and a silanol source compound. The method for producing the thermosetting resin composition includes a step of mixing the epoxy compound with the gallium compound and the silanol source compound. The method for producing a cured resin includes a step of heating an epoxy compound in the presence of a gallium compound and silanol. The method for causing self-polymerization of an epoxy compound is characterized by using a gallium compound and silanol as catalysts.

First claim

What is claimed is:

1. A thermosetting resin composition comprising an epoxy compound, a gallium compound, and a silanol source compound, wherein
said gallium compound. is gallium triacetylacetylacetonate or gallium acetate, and
said silanol source compound comprises a monosilane compound and/or an organopolysiloxane of formula(19):
(R 21 3 SiO 1/2 ) a2 (R 22 2 SiO 2/2 ) b2 (R 23 SiO 3/2 ) c2 (SiO 4/2 ) d2 (O 1/2 H) e2   (19)

where
R 21 , R 22 , and R 23 each independently represent a C 1-10 hydrocarbon group,
a2, b2, c2, and d2are each an integer of 0 or more and satisfy the condition of a2+b2+c2+d2≧3, and
e2is a natural number of 1 or more and represents the number of a hydroxy group (s) directly bonded to a silicon atom.

2. The thermosetting resin composition according to claim 1 , wherein the epoxy compound is a cycloaliphatic epoxy compound.

3. The thermosetting resin composition according to claim 1 , wherein the silanol source compound is an organopolysiloxane of Formula (19).

4. The thermosetting resin composition according to claim 1 , wherein the silanol source compound is a monosilane compound.

5. The thermosetting resin composition according to claim 1 , wherein the gallium compound is a gallium complex that has a chelating ligand.

6. A method for producing a cured resin, the method comprising a step of heating an epoxy compound in the presence of a gallium compound and a silanol source compound, wherein
said gallium compound is gallium triacetylacetonate or gallium acetate, and
said silanol source compound comprises a monosilane compound and/or an organopolysiloxane of Formula (19 1 ):
(R 21 3 SiO 1/2 ) a2 (R 22 2 SiO 2/2 ) b2 (R 23 SiO 3/2 ) c2 (SiO 4/2 ) d2 (O 1/2 H) e2   (19)

Where
R 21 , R 22 , and R 23 each independently represent a C 1-10 hydrocarbon group, a2, b2, c2, and d2are each an integer of 0 or more and satisfy the condition of a2+b2+c2+d2≧3, and
e2 is a natural number of 1 or more and represents the number of hydroxyl group(s) directly bonded to a silicon atom.

7. The method according to claim 6 , wherein the epoxy compound is a cycloaliphatic epoxy compound.

8. The method according to claim 6 , wherein an organopolysiloxane of Formula (19) is used as a source of the silanol.

9. The method according to claim 6 , wherein a monosilane compound is used as a source of the silanol.

10. The method according to claim 6 , wherein a gallium complex that has a chelating ligand is used as the gallium compound.

11. A method for causing self-polymerization of an epoxy compound, the method comprising a step of adding a gallium compound and a silanol source compound as catalysts, wherein
said gallium compound is gallium triacetylacetonate or gallium acetate, and
said silanol source compound comprises a monosilane compound and/or an organopolysiloxane of Formula (19):
(R 21 3 SiO 1/2 ) a2 (R 22 2 SiO 2/2 ) b2 (R 23 SiO 3/2 ) c2 (SiO 4/2 ) d2 (O 1/2 H) e2   (19)

where
R 21 , R 22 , and R 23 each independently represent a C 1-10 hydrocarbon group, a2, b2, c2, and d2 are each an integer of 0 or more and satisfy the condition of a2+b2+c2+d2≧3, and
e2 is a natural number of 1 or more and represents the number of hydroxyl group(s) directly bonded to a silicon atom.

12. The method according to claim 11 , wherein the epoxy compound is a cycloaliphatic epoxy compound.

13. The method according to claim 11 , wherein an organopolysiloxane of Formula (19) is used as a source of the silanol.

14. The method according to claim 11 , wherein a monosilane compound is used as a source of the silanol.

15. The method according to claim 11 , wherein the gallium compound is a gallium complex that has a chelating ligand.

Assignees

• Mitsubishi Chem Corp

Inventors

• Watanabe Takumi
• Andou Masato
• Tanaka Toshiyuki
• Kimura Akinori
• Ueno Nobuhiko
• Saito Maki
• Dao Phuong Thi Kim
• Kasai Tetsuo

Classifications

• C08K5/5415 Primary

  containing at least one Si—O bond · CPC title

• C08K3/10

  Metal compounds · CPC title

• C08K3/24 Primary

  Acids; Salts thereof {(C08K3/16 takes precedence)} · CPC title

• C08L83/06

  containing silicon bound to oxygen-containing groups (C08L83/12 takes precedence) · CPC title

• C08L2201/02

  Flame or fire retardant/resistant · CPC title