Panel with paint ready surface
US-2016361910-A1 · Dec 15, 2016 · US
US9550347B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9550347-B2 |
| Application number | US-201313955105-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jul 31, 2013 |
| Priority date | Jul 31, 2013 |
| Publication date | Jan 24, 2017 |
| Grant date | Jan 24, 2017 |
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A method of manufacturing a core stiffened structure includes orienting the plurality of core wafers in a non-uniform pattern onto a first face sheet, the non-uniform pattern producing non-uniform spacing between adjacent core wafers; assembling a second face sheet onto the plurality of wafers; and curing an adhesive to create a bond between the plurality of wafers, the first face sheet, and the second face sheet.
Opening claim text (preview).
The invention claimed is: 1. A method of manufacturing a core stiffened structure, the core stiffened structure having a first face sheet, a second face sheet, and a plurality of wafers of composite core, the method comprising: orienting the plurality of wafers in a non-uniform pattern onto the first face sheet, the non-uniform pattern producing non-uniform spacing between adjacent wafers, each wafer having a plurality of hexagonal cell members, each hexagonal cell member having a cell wall that terminates at a first surface network and a second surface network, the plurality of hexagonal cell members assembled together such that a perimetrical shape of the wafer is hexagonal with the plurality of hexagonal cell members being oriented with adiacent cell walls in a pattern that results in the perimetrical shape of the wafer being hexagonal in that outerwardly exposed cell walls of the plurality of cell members create the perimetrical shape; assembling a second face sheet onto the plurality of wafers; and curing an adhesive to create a bond between the plurality of wafers, the first face sheet, and the second face sheet. 2. The method according to claim 1 , further comprising: reticulating the adhesive onto the first or second surface network of the plurality of wafers. 3. The method according to claim 1 , further comprising: filling voids between the non-uniform spaced wafers with an adhesive foam. 4. The method according to claim 1 , further comprising: placing a tapered core member at an edge portion of the first face sheet. 5. The method according to claim 1 , wherein the step of curing the adhesive also includes curing the first face sheet and the second face sheet.
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