Method for connecting two components, and component connection

US9550259B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9550259-B2
Application numberUS-201414516057-A
CountryUS
Kind codeB2
Filing dateOct 16, 2014
Priority dateApr 26, 2012
Publication dateJan 24, 2017
Grant dateJan 24, 2017

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  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A method for connecting a first component to a second component having a through hole includes the following steps: bringing the two components against one another and positioning them relative to one another, detecting the spatial position of the hole by a position detection electronic unit, positioning a connecting element at a location within the hole as a function of the spatial position of the hole or as a function of position data determined by the position detection electronic unit, connecting the connecting element to the first component, with the result that the connecting element projects into or through the hole, and clipping onto the connecting element a clip element which holds the two components together.

First claim

Opening claim text (preview).

What is claimed is: 1. A method of connecting a first component with a second component, the second component having a through-hole, the method comprising the acts of: bringing the first and second components together and positioning the first and second components relative to one another; detecting a spatial position of the through-hole in the second component via an electronic position detection unit; positioning a connection element at a location within the through-hole as a function of the spatial position of the through-hole or as a function of position data determined via the electronic position detection unit; connecting the connection element with the first component so that the connection element projects out of the through-hole; and clipping a clip element onto the connection element, the clip element holding together the first and second components, wherein the connection element consists of at least two spherical elements. 2. The method according to claim 1 , wherein the electronic position detection unit comprises an opto-electronic system, the method further comprising the opto-electronic detection of the spatial position of the through-hole. 3. The method according to claim 2 , further comprising the acts of: detecting a spatial position of the connection element via an electronic position detection unit or by use of position data from the electronic position detection unit; and automatically clipping the clipping element onto the connection element via robotic control as a function of the spatial position of the connection element. 4. The method according to claim 1 , further comprising the act of: gluing the first and second components together prior to the connecting or clipping acts. 5. The method according to claim 4 , further comprising the acts of: detecting a spatial position of the connection element via an electronic position detection unit or by use of position data from the electronic position detection unit; and automatically clipping the clipping element onto the connection element via robotic control as a function of the spatial position of the connection element. 6. The method according to claim 1 , wherein the act of connecting the connection element further comprises the act of welding the connection element onto the first component via an electronically controlled welding device. 7. The method according to claim 6 , further comprising the acts of: detecting a spatial position of the connection element via an electronic position detection unit or by use of position data from the electronic position detection unit; and automatically clipping the clipping element onto the connection element via robotic control as a function of the spatial position of the connection element. 8. The method according to claim 1 , wherein the act of clipping the clipping element is carried out manually. 9. The method according to claim 1 , further comprising the acts of: detecting a spatial position of the connection element via an electronic position detection unit or by use of position data from the electronic position detection unit; and automatically clipping the clipping element onto the connection element via robotic control as a function of the spatial position of the connection element. 10. The method according to claim 1 , wherein the two or more spherical elements includes a first spherical element is connected to the first component a second spherical element that is connected to the first spherical element.

Assignees

Inventors

Classifications

  • for measuring existing positions of tools or workpieces · CPC title

  • F16B5/0642Primary

    the plates being arranged one on top of the other and in full close contact with each other · CPC title

  • Clips, i.e. with gripping action effected solely by the inherent resistance to deformation of the material of the fastening · CPC title

  • Using optical instrument [excludes mere human eyeballing] · CPC title

  • B23P19/04Primary

    for assembling or disassembling parts · CPC title

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Frequently asked questions

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What does patent US9550259B2 cover?
A method for connecting a first component to a second component having a through hole includes the following steps: bringing the two components against one another and positioning them relative to one another, detecting the spatial position of the hole by a position detection electronic unit, positioning a connecting element at a location within the hole as a function of the spatial position of…
Who is the assignee on this patent?
Bayerische Motoren Werke Ag
What technology area does this patent fall under?
Primary CPC classification F16B5/0642. Mapped technology areas include Mechanical Engineering.
When was this patent published?
Publication date Tue Jan 24 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).