Substrate treatment method and substrate treatment apparatus
US-2024162032-A1 · May 16, 2024 · US
US9550217B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9550217-B2 |
| Application number | US-201314010371-A |
| Country | US |
| Kind code | B2 |
| Filing date | Aug 26, 2013 |
| Priority date | Aug 24, 2012 |
| Publication date | Jan 24, 2017 |
| Grant date | Jan 24, 2017 |
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According to one embodiment, a method for cleaning and requalifying a component of an exhaust aftertreatment system includes inspecting the component using an x-ray processing technique. The method further includes associating the plurality of cleaning techniques with a plurality of compositions of material, and cleaning the component according to at least one of the plurality of cleaning techniques associated with the composition of material.
Opening claim text (preview).
What is claimed is: 1. A method for cleaning and requalifying a component of an exhaust aftertreatment system, comprising: inspecting the component using an x-ray processing technique, wherein the inspecting the component comprises determining a number of plug layers along the component and an associated plug absorption value for each of the plug layers; selecting one or more cleaning techniques based at least in part on the determined plug absorption values; and cleaning the component using the selected one or more cleaning techniques. 2. The method of claim 1 , further comprising: determining an accumulation condition of the component using the x-ray processing technique, the accumulation condition indicating an amount of matter accumulated along the component. 3. The method of claim 1 , wherein the one or more cleaning techniques comprise a dry clean technique and a wet wash technique. 4. The method of claim 1 , further comprising: performing a first comparison, the first comparison including comparing the plug absorption values with one or more plug absorption thresholds; and performing a second comparison, the second comparison including comparing an accumulation condition with one or more accumulation thresholds. 5. The method of claim 1 , further comprising determining an accumulation condition of the component at a depth threshold of the component using the x-ray processing technique, the accumulation condition of the component at the depth threshold indicating an amount of particulate accumulated at an outlet end portion of the component. 6. The method of claim 1 , wherein the x-ray processing technique is configured to generate data representing accumulated matter along a side wall of the component along an axial length of the component. 7. The method of claim 1 , further comprising determining at least one exclusion zone along the component, and wherein inspecting the component using the x-ray processing technique comprises inspecting only those portions of the component outside of the at least one exclusion zone. 8. The method of claim 2 , wherein the accumulated matter includes ash and soot. 9. The method of claim 3 , further comprising visually inspecting the component before cleaning the component using the dry clean technique. 10. The method of claim 3 , wherein the wet wash technique comprises depositing the component into a bath comprising an organic acid, and ultrasonically agitating the bath. 11. The method of claim 3 , further comprising inspecting the component using the x-ray processing technique after cleaning the component using the wet wash technique. 12. The method of claim 3 , further comprising determining an ash plug absorption of the component, and wherein the step of cleaning the component using the wet wash technique occurs only when the ash plug absorption exceeds a threshold. 13. The method of claim 4 , wherein the selecting one or more cleaning techniques comprises selecting based on the first comparison and the second comparison. 14. The method of claim 4 , wherein the selecting one or more cleaning techniques comprises: selecting a first cleaning technique in response to determining that the accumulation condition exceeds a first of the one or more accumulation thresholds; and selecting a second cleaning technique in response to determining that the accumulation condition does not exceed the first of the one or more accumulation thresholds, wherein the first cleaning technique is different than the second cleaning technique. 15. The method of claim 5 , further comprising determining cleanliness of the component based at least in part on the accumulation condition at the depth threshold. 16. The method of claim 9 , further comprising baking the component before cleaning the component using the dry clean technique if visual inspection of the component reveals visible oil deposits on the component.
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Accessories or details of general applicability for machines or apparatus for cleaning · CPC title
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