Modular electronic prototyping platforms
US-12177969-B2 · Dec 24, 2024 · US
Printed circuit board edge connector
US9549469B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9549469-B2 |
| Application number | US-201314106120-A |
| Country | US |
| Kind code | B2 |
| Filing date | Dec 13, 2013 |
| Priority date | Apr 28, 2010 |
| Publication date | Jan 17, 2017 |
| Grant date | Jan 17, 2017 |
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- Title
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- Abstract
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- Assignees and inventors
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- First independent claim
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- CPC / IPC classifications
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- Citations and related patents
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Abstract
Official abstract text for this publication.
A printed circuit board assembly and method of assembly is provided for a printed circuit board having a top and bottom surface with at least one edge portion having a rounded surface extending from the top surface to a point below the top surface and at least one electrical contact pad located on the top surface and extending over the edge portion rounded surface to a point below the top surface.
First claim
Opening claim text (preview).
The invention claimed is: 1. A printed circuit board having at least one electrically conductive path, the printed circuit board comprising: a top surface, a bottom surface, at least one edge portion having at least a rounded surface portion extending from the top surface to the bottom surface, a first layer on top of the top surface and extending over the rounded surface and including at least one opening exposing at least one contact pad located upon the top surface within the one first layer opening and the pad electrically connecting a conductive path of the printed circuit board and wherein the first layer has a thickness substantially the same as a thickness of the contact pad. 2. A method of fabricating a printed circuit board according to claim 1 wherein the first layer includes a flexible polyimide film.
Assignees
Inventors
Classifications
cooperating directly with the edge of the rigid printed circuits · CPC title
with selective destruction of conductive paths · CPC title
- H05K1/117Primary
Pads along the edge of rigid circuit boards, e.g. for pluggable connectors · CPC title
Special local insulating pattern, e.g. as dam around component · CPC title
Adaptations of leads or holes for facilitating insertion · CPC title
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Frequently asked questions
Answers are generated from the same data shown on this page.
- What does patent US9549469B2 cover?
- A printed circuit board assembly and method of assembly is provided for a printed circuit board having a top and bottom surface with at least one edge portion having a rounded surface extending from the top surface to a point below the top surface and at least one electrical contact pad located on the top surface and extending over the edge portion rounded surface to a point below the top surface.
- Who is the assignee on this patent?
- IBM
- What technology area does this patent fall under?
- Primary CPC classification H05K1/117. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Jan 17 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).