Method for manufacturing a radome

Patent metadata

Field	Value
Publication number	US-9548531-B2
Application number	US-201514748892-A
Country	US
Kind code	B2
Filing date	Jun 24, 2015
Priority date	Jun 25, 2014
Publication date	Jan 17, 2017
Grant date	Jan 17, 2017

Abstract

A method is provided for manufacturing a radome. The method has the following steps: creation of a contoured fit of at least one section of an inner surface of a wall of the radome; arrangement of a plurality of planar photosensitive semiconductor elements on an outer surface of the contoured fit; placement of the contoured fit with the plurality of planar photosensitive semiconductor elements on the at least one section of the inner surface of the wall; establishing of a connection between the plurality of planar photosensitive semiconductor elements and the wall; and removal of the contoured fit from the radome. This method enables the simple manufacture of a radome with a layer having several semiconductor elements for the electromagnetic shielding of the interior of the radome.

First claim

What is claimed is:

1. A method for manufacturing a radome, the method comprising the acts of:
creating a contoured fit of at least one section of an inner surface of a wall of the radome;
arranging a plurality of planar photosensitive semiconductor elements on an outer surface of the contoured fit;
placing the contoured fit with the plurality of planar photosensitive semiconductor elements on the at least one section of the inner surface of the wall;
establishing a connection between the plurality of planar photosensitive semiconductor elements and the wall; and
removing the contoured fit from the radome.

2. The method according to claim 1 , further comprising the acts of:
before the act of arranging the plurality of planar photosensitive semiconductor elements on the outer surface of the contoured fit, detecting an inner geometry of the wall of the radome and subdividing the detected inner geometry into flat subregions; and
making available the plurality of planar photosensitive semiconductor elements according to one or more shapes of the flat subregions.

3. The method according to claim 2 , further comprising the act of:
before the arranging of the plurality of planar photosensitive semiconductor elements on the outer surface of the contoured fit, providing the outer surface of the countoured fit with a layer that is adhesive on at least one side in order to fix the plurality of planar photosensitive semiconductor elements on an adhesive surface of the layer.

4. The method according to claim 3 , wherein the layer is reversibly coupled with the contoured fit.

5. The method according to claim 4 , wherein the layer is fixed by a low pressure relative to the contoured fit.

6. The method according to claim 5 , further comprising the act of:
for the removing of the contour fit from the radome, releasing the connection between the layer and the contoured fit.

7. The method according to claim 6 , wherein the act of releasing the connection between the layer and the contoured fit is carried out by decreasing the low pressure.

8. The method according to claim 6 , wherein the act of releasing the connection between the layer and the contoured fit is carried out by applying a solvent.

9. The method according to claim 6 , wherein the act of releasing the connection between the layer and the contoured fit is carried out by increasing a temperature of the layer.

10. The method according to claim 3 , wherein the layer is fixed by a low pressure relative to the contoured fit.

11. The method according to claim 3 , further comprising the act of:
for the removing of the contour fit from the radome, releasing the connection between the layer and the contoured fit.

12. The method according to claim 3 , wherein the act of establishing the connection between the plurality of planar photosensitive semiconductor elements and the wall of the radome comprises the act of:
introducing an adhesive mass into an interspace between the outer surface of the contoured fit and the inner surface of the wall.

13. The method according to claim 1 , further comprising the act of:
before the arranging of the plurality of planar photosensitive semiconductor elements on the outer surface of the contoured fit, providing the outer surface of the countoured fit with a layer that is adhesive on at least one side in order to fix the plurality of planar photosensitive semiconductor elements on an adhesive surface of the layer.

14. The method according to claim 1 , wherein the act of establishing the connection between the plurality of planar photosensitive semiconductor elements and the wall of the radome comprises the act of:
introducing an adhesive mass into an interspace between the outer surface of the contoured fit and the inner surface of the wall.

15. A radome, comprising:
a wall having an inner and outer surface;
a plurality of planar photosensitive semiconductor elements arranged on the inner surface of the wall, wherein
each of the plurality of planar photosensitive semiconductor elements is flat and is coupled via an adhesive mass with the inner surface of the wall.

16. The radome according to claim 15 , wherein the plurality of planar photosensitive semiconductor elements are arranged to cover an entire inner surface of the wall.

17. The radome according to claim 16 , wherein the plurality of planar photosensitive semiconductor elements are non-doped silicon elements.

18. The radome according to claim 15 , wherein the plurality of planar photosensitive semiconductor elements are non-doped silicon elements.

Assignees

• Airbus Defence & Space Gmbh

Inventors

• Schoenlinner Bernhard
• Prechtel Ulrich
• Schuster Thomas
• Sabielny Michael
• Zippold Herbert
• Dittrich Kay W
• Stadler Franz
• Rothenhaeusler Markus
• Wulbrand Wilhelm
• Koerwien Thomas

Classifications

• H01Q1/38

  formed by a conductive layer on an insulating support {(patch antennas H01Q9/0407; microstrip dipole antennas H01Q9/065; microstrip slot antennas H01Q13/106; transmission line microstrip antennas H01Q13/206; manufacturing reflecting surfaces using insulating material for supporting the reflecting surface  H01Q15/142)} · CPC title

• H01Q15/141

  Apparatus or processes specially adapted for manufacturing reflecting surfaces · CPC title

• H01Q1/42 Primary

  Housings not intimately mechanically associated with radiating elements, e.g. radome · CPC title

• H01Q1/422

  comprising two or more layers of dielectric material (H01Q1/425 takes precedence) · CPC title

• H01Q1/3275

  mounted on a horizontal surface of the vehicle, e.g. on roof, hood, trunk · CPC title