Amorphous alloy space for perpendicular MTJs

US9548445B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9548445-B2
Application numberUS-201514940996-A
CountryUS
Kind codeB2
Filing dateNov 13, 2015
Priority dateJul 27, 2012
Publication dateJan 17, 2017
Grant dateJan 17, 2017

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Abstract

Official abstract text for this publication.

A perpendicular magnetic tunnel junction (MTJ) apparatus includes a tunnel magnetoresistance (TMR) enhancement buffer layer deposited between the tunnel barrier layer and the reference layers. An amorphous alloy spacer is deposited between the TMR enhancement buffer layer and the reference layers to enhance TMR. The amorphous alloy spacer blocks template effects of face centered cubic (fcc) oriented pinned layers and provides strong coupling between the pinned layers and the TMR enhancement buffer layer to ensure full perpendicular magnetization.

First claim

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What is claimed is: 1. A perpendicular magnetic tunnel junction (MTJ) apparatus comprising: a tunnel barrier layer interposed between a first free layer and a reference layer; a first amorphous alloy perpendicular magnetic anisotropy (PMA) enhancement spacer on the first free layer; a second free layer deposited on the PMA enhancement spacer; and the reference layer, comprising: a synthetic antiferromagnetic (SAF) layer; a second amorphous alloy PMA enhancement spacer on the SAF layer; and a tunnel magnetoresistance (TMR) enhancement buffer layer interposed between the tunnel barrier layer and the second amorphous alloy PMA enhancement spacer, in which a center layer of the TMR enhancement spacer is thicker than outer layers of the TMR enhancement spacer. 2. The apparatus of claim 1 , further comprising: an insulating capping layer directly on the second free layer. 3. The apparatus of claim 1 in which the first amorphous alloy PMA enhancement spacer comprises: a superlattice of Fe/Ta, Co/Ta, FeB/Ta, Fe/Tan and/or FeB/Tan. 4. The apparatus of claim 1 in which the first amorphous alloy PMA enhancement spacer is between about 4 Å and about 15 Å thick. 5. The apparatus of claim 1 integrated into a mobile phone, a set top box, a music player, a video player, an entertainment unit, a navigation device, a computer, a hand-held personal communication systems (PCS) unit, a portable data unit, and/or a fixed location data unit. 6. A method for constructing a perpendicular magnetic tunnel junction (MTJ) apparatus, comprising: depositing a tunnel barrier layer between a first free layer and a reference layer; depositing a first amorphous alloy perpendicular magnetic anisotropy (PMA) enhancement spacer on the first free layer; depositing a second free layer on the first amorphous alloy PMA enhancement spacer; depositing a synthetic antiferromagnetic (SAF) layer on the reference layer; depositing a second amorphous alloy PMA enhancement spacer on the SAF layer; and depositing a tunnel magnetoresistance (TMR) enhancement buffer layer interposed between the tunnel barrier layer and the second amorphous alloy PMA enhancement spacer, in which a center layer of the TMR enhancement spacer is thicker than outer layers of the TMR enhancement spacer. 7. The method of claim 6 , further comprising: depositing an insulating capping layer directly on the second free layer. 8. The method of claim 6 , further comprising: depositing a superlattice of Fe/Ta, Co/Ta, FeB/Ta, Fe/Tan and/or FeB/Tan between the bottom free layer and the top free layer to form the first amorphous alloy PMA enhancement spacer. 9. The method of claim 6 , further comprising: depositing the first amorphous alloy PMA enhancement spacer with a thickness of 4 Å and about 20 Å. 10. The method of claim 6 , further comprising integrating the perpendicular MTJ apparatus into a mobile phone, a set top box, a music player, a video player, an entertainment unit, a navigation device, a computer, a hand-held personal communication systems (PCS) unit, a portable data unit, and/or a fixed location data unit. 11. A perpendicular magnetic tunnel junction (MTJ) apparatus comprising: a tunnel barrier layer interposed between a first free layer and a reference layer; means for increasing surface anisotropy between a second free layer and the first free layer; and the reference layer, comprising: a synthetic antiferromagnetic (SAF) layer; an amorphous alloy perpendicular magnetic anisotropy (PMA) enhancement spacer on the SAF layer; and a tunnel magnetoresistance (TMR) enhancement buffer layer interposed between the tunnel barrier layer and the second amorphous PMA enhancement spacer, in which a center layer of the TMR enhancement spacer is thicker than outer layers of the TMR enhancement spacer. 12. The apparatus of claim 11 integrated into a mobile phone, a set top box, a music player, a video player, an entertainment unit, a navigation device, a computer, a hand-held personal communication systems (PCS) unit, a portable data unit, and/or a fixed location data unit.

Assignees

Inventors

Classifications

  • using elements in which the storage effect is based on magnetic spin effect · CPC title

  • Electricity · mapped topic

  • H01L43/10Primary

    Electricity · mapped topic

  • Electricity · mapped topic

  • using multiple magnetic layers (G11C11/155 takes precedence) · CPC title

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What does patent US9548445B2 cover?
A perpendicular magnetic tunnel junction (MTJ) apparatus includes a tunnel magnetoresistance (TMR) enhancement buffer layer deposited between the tunnel barrier layer and the reference layers. An amorphous alloy spacer is deposited between the TMR enhancement buffer layer and the reference layers to enhance TMR. The amorphous alloy spacer blocks template effects of face centered cubic (fcc) ori…
Who is the assignee on this patent?
Qualcomm Inc
What technology area does this patent fall under?
Primary CPC classification H01L43/10. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Jan 17 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).