Photoelectrochemically driven self-assembly method

Patent metadata

Field	Value
Publication number	US-9548411-B2
Application number	US-201314061576-A
Country	US
Kind code	B2
Filing date	Oct 23, 2013
Priority date	Mar 15, 2013
Publication date	Jan 17, 2017
Grant date	Jan 17, 2017

Abstract

Various technologies described herein pertain to assembling electronic devices into a microsystem. The electronic devices are disposed in a solution. Light can be applied to the electronic devices in the solution. The electronic devices can generate currents responsive to the light applied to the electronic devices in the solution, and the currents can cause electrochemical reactions that functionalize regions on surfaces of the electronic devices. Additionally or alternatively, the light applied to the electronic devices in the solution can cause the electronic devices to generate electric fields, which can orient the electronic devices and/or induce movement of the electronic devices with respect to a receiving substrate. Further, electrodes on a receiving substrate can be biased to attract and form connections with the electronic devices having the functionalized regions on the surfaces. The microsystem can include the receiving substrate and the electronic devices connected to the receiving substrate.

First claim

What is claimed is:

1. A method of assembling electronic devices into a microsystem, comprising:
disposing the electronic devices in a solution;
applying light to the electronic devices in the solution, wherein the electronic devices generate currents responsive to the light applied to the electronic devices in the solution, and wherein the currents cause electrochemical reactions that functionalize regions on surfaces of the electronic devices; and
biasing electrodes on a receiving substrate to attract and form connections with the electronic devices having the functionalized regions on the surfaces, wherein the microsystem comprises the receiving substrate and the electronic devices connected to the receiving substrate;
wherein an electronic device from the electronic devices comprises a plurality of electrically coupled photovoltaic cells separated by trenches, wherein the plurality of electrically coupled photovoltaic cells are electrically coupled to two electrodes, and wherein the two electrodes are on a common face of the electronic device.

2. A method of assembling electronic devices into a microsystem, comprising:
disposing the electronic devices in a solution;
applying light to the electronic devices in the solution, wherein:
the electronic devices generate electric fields responsive to the light applied to the electronic devices, and
the electric fields at least one of orient the electronic devices with respect to a receiving substrate or induce movement of the electronic devices with respect to the receiving substrate; and

biasing electrodes on a receiving substrate to attract and form connections with the electronic devices, wherein the microsystem comprises the receiving substrate and the electronic devices connected to the receiving substrate;
wherein applying the light to the electronic devices in the solution further comprises:
applying a first wavelength of the light to the electronic devices in the solution, wherein the first wavelength of the light selectively causes a first subset of the electronic devices to generate the electric fields; and
applying a second wavelength of the light to the electronic devices in the solution, wherein the second wavelength of the light selectively causes a second subset of the electronic devices to generate the electric fields.

3. A method of assembling electronic devices into a microsystem that comprises a receiving substrate to which the electronic devices are connected, comprising:
disposing the electronic devices in a first solution;
applying field-generating light to the electronic devices in the first solution and thereby causing the electronic devices to generate electric fields responsive to the field-generating light applied to the electronic devices; and
biasing electrodes on a receiving substrate to attract and form connections with the electronic devices, wherein:
the electric fields responsive to the applied field-generating light orient the electronic devices with respect to a receiving substrate, or the said electric fields induce movement of the electronic devices with respect to the receiving substrate, or the said electric fields both orient the electronic devices with respect to a receiving substrate and induce movement of the electronic devices with respect to the receiving substrate;
the electronic devices are disposed in the first solution or in a differing solution prior to generation of the electric fields; and
the method further comprises applying functionalizing light to the electronic devices in the first solution or in the differing solution prior to generation of the electric fields, wherein the electronic devices generate currents responsive to the functionalizing light applied to the electronic devices in the first solution or in the differing solution, and wherein the currents cause electrochemical reactions that functionalize regions on surfaces of the electronic devices.

4. The method of claim 3 , further comprising applying light to the electronic devices when connected to the receiving substrate to strengthen the connections between the electronic devices and the receiving substrate.

5. The method of claim 3 , further comprising supplying electrical currents between the electrodes on the receiving substrate through the electronic devices connected to the receiving substrate to strengthen the connections between the electronic devices and the receiving substrate.

6. The method of claim 3 , further comprising:
fabricating the electronic devices on a fabrication surface; and
releasing the electronic devices from the fabrication surface, wherein the electronic devices released from the fabrication surface are disposed in the first solution or in the differing solution , and wherein the functionalizing light is applied to the electronic devices in the first solution or in the differing solution subsequent to the electronic devices being released from the fabrication surface to at least partially functionalize regions on the surfaces of the electronic devices.

7. The method of claim 3 , further comprising:
fabricating the electronic devices on a fabrication surface;
disposing the electronic devices in the first solution while the electronic devices are attached to the fabrication surface;
applying the functionalizing light to the electronic devices in the first solution while the electronic devices are attached to the fabrication surface to at least partially functionalize the regions on the surfaces of the electronic devices; and
subsequent to application of the functionalizing light to the electronic devices in the first solution while the electronic devices are attached to the fabrication surface, releasing the electronic devices from the fabrication surface.

8. The method of claim 3 , wherein the electronic devices and the receiving substrate are disposed in the first solution or in the differing solution subsequent to the regions on the surfaces of the electronic devices being functionalized, the method further comprising:
supplying an electric field to the first solution or to the differing solution in which the electronic devices and the receiving substrate are disposed;
wherein the electric field orients the electronic devices with respect to the receiving substrate, or the electric field induces movement of the electronic devices with respect to the receiving substrate, or the electric field both orients the electronic devices with respect to the receiving substrate and induces movement of the electronic devices with respect to the receiving substrate.

9. The method of claim 3 , wherein:
the electronic devices and the receiving substrate are disposed in the first solution or in the differing solution subsequent to the regions on the surfaces of the electronic devices being functionalized; and
interactions between the electronic devices, as functionalized, and the first solution or the differing solution cause at least one of:
orientation of the electronic devices with respect to the receiving substrate; or
inducement of movement of the electronic devices with respect to the receiving substrate.

10. The method of claim 3 , further comprising mechanically guiding the electronic devices to the electrodes on the receiving substrate.

11. The method of claim 3 , further comprising mechanically orienting the electronic devices with respect to the receiving substrate.

12. The method of claim 3 , wherein the first solution is an ionic, conductive solution.

13. The method of claim 3 , wherein applying the functionalizing light to the electronic devices in the first solution or in the differing solution further comprises:
applying a first w

Assignees

• Sandia Corp

Inventors

• Nielson Gregory N
• Okandan Murat

Classifications

• H10W72/0198

  batch processes · CPC title

• Y02E10/50

  Photovoltaic [PV] energy · CPC title

• H01L31/0475

  Electricity · mapped topic

• H01L31/0504 Primary

  Electricity · mapped topic

• Y02P70/521

  Cross-Sectional Technologies · mapped topic