Heat spreader and method for forming

Patent metadata

Field	Value
Publication number	US-9548256-B2
Application number	US-201514628852-A
Country	US
Kind code	B2
Filing date	Feb 23, 2015
Priority date	Feb 23, 2015
Publication date	Jan 17, 2017
Grant date	Jan 17, 2017

Abstract

The present disclosure provides embodiments for a semiconductor structure including a heat spreader that includes a graphene grid having a first major surface and a second major surface opposite the first major surface. The graphene grid has a plurality of holes, each hole having a first opening in the first major surface and a second opening in the second major surface. The heat spreader also includes a first copper portion covering the first major surface of the graphene grid, a second copper portion covering the second major surface of the graphene grid, and a plurality of copper vias filling the plurality of holes.

First claim

What is claimed is:

1. A semiconductor structure comprising:
a heat spreader comprising:
a graphene grid having a first major surface and a second major surface opposite the first major surface, wherein
the graphene grid has a plurality of holes, each hole having a first opening in the first major surface and a second opening in the second major surface,

a first copper portion covering the first major surface of the graphene grid,
a second copper portion covering the second major surface of the graphene grid, and
a plurality of copper vias filling the plurality of holes.

2. The semiconductor structure of claim 1 , wherein
the heat spreader further comprises a third copper portion covering one or more minor surfaces of the graphene sheet that are perpendicular to the first and second major surfaces of the graphene sheet.

3. The semiconductor structure of claim 1 , wherein
the graphene grid has a thickness of at most 10 atomic layers of graphene.

4. The semiconductor structure of claim 1 , wherein
a thickness of the graphene grid is within an inclusive range of 0.035 microns to 10 microns.

5. The semiconductor structure of claim 1 , wherein
a thickness of the heat spreader is within an inclusive range of 0.1 mm to 5 mm.

6. The semiconductor structure of claim 1 , wherein
a width of each first opening is within an inclusive range of 0.05 mm to 2 mm.

7. The semiconductor structure of claim 1 , wherein
each of the first openings have a width, and
the width is up to twenty times larger than a minimum distance measured between a pair of first openings.

8. A packaged semiconductor device comprising:
a heat spreader comprising:
a grid of a first conductive material having a plurality of holes,
a plurality of vias of a second conductive material, wherein the plurality of vias fill the plurality of holes of the grid, and
a layer of the second conductive material that surrounds the grid.

9. The packaged semiconductor device of claim 8 , wherein
the first conductive material has in-plane thermal conductivity within an inclusive range of 2000 to 4000 W/m-K.

10. The packaged semiconductor device of claim 8 , wherein
the second conductive material has out-of-plane thermal conductivity within an inclusive range of 500 to 400 W/m-K.

11. The packaged semiconductor device of claim 8 , wherein
a portion of a bottom surface of the heat spreader is attached to a semiconductor die with a thermal interface material.

12. The packaged semiconductor device of claim 8 , wherein
a portion of a bottom surface of the heat spreader is attached to a package substrate with an adhesive material.

13. The packaged semiconductor device of claim 8 , wherein
the first conductive material comprises graphene.

14. The packaged semiconductor device of claim 8 , wherein
the second conductive material comprises at least one of copper, nickel, or aluminum.

15. The packaged semiconductor device of claim 8 , wherein
a heat sink is attached to a portion of a top surface of the heat spreader with a thermal interface material.

Assignees

• Freescale Semiconductor Inc
• Nxp Usa Inc

Inventors

• Uehling Trent S

Classifications

• F28F3/04

  the means being integral with the element · CPC title

• C23C14/34

  Sputtering · CPC title

• C23C14/165

  by cathodic sputtering · CPC title

• H10W90/754

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/736

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title