Apparatus for treating surfaces of wafer-shaped articles

Patent metadata

Field	Value
Publication number	US-9548223-B2
Application number	US-201113336685-A
Country	US
Kind code	B2
Filing date	Dec 23, 2011
Priority date	Dec 23, 2011
Publication date	Jan 17, 2017
Grant date	Jan 17, 2017

Abstract

A device and method for processing wafer-shaped articles comprises a process chamber and a rotary chuck located within the process chamber. The rotary chuck is adapted to be driven without physical contact through a magnetic bearing. The rotary chuck comprises a series of gripping pins adapted to hold a wafer shaped article in a position depending downwardly from the rotary chuck. The rotary chuck further comprises a plate that rotates together with the rotary chuck. The plate is positioned above an area occupied by the wafer-shaped article, and shields upper surfaces of the process chamber from liquids flung off of a wafer-shaped article during use of the rotary chuck.

First claim

What is claimed is:

1. Device for processing wafer-shaped articles, comprising a process chamber and a rotary chuck located within said process chamber, wherein said rotary chuck is adapted to be driven without physical contact through a magnetic bearing, said rotary chuck comprising a series of gripping pins adapted to hold a wafer shaped article in a position depending downwardly from said rotary chuck, said rotary chuck further comprising a plate that rotates together with said rotary chuck, said plate being positioned above an area occupied by a wafer-shaped article when said rotary chuck is in use, and said plate shielding upper surfaces of said process chamber from liquids flung off of a wafer-shaped article during use of said rotary chuck;
wherein said magnetic bearing comprises a stator located entirely outside the process chamber, and a rotor located entirely inside the process chamber.

2. The device according to claim 1 , wherein said plate is positioned parallel to a plane in which a major surface of a wafer shaped article will be present during use of said rotary chuck, thereby to define a gap of a predetermined width between said plate and said plane.

3. The device according to claim 2 , wherein said predetermined width is from about 0.1 to 5 mm.

4. The device according to claim 1 , wherein said plate is positioned parallel to an overlying lid of said process chamber, thereby to define a gap of a predetermined width between said plate and said lid.

5. The device according to claim 4 , wherein said predetermined width is from about 0.1 to 10 mm.

6. The device according to claim 1 , wherein said process chamber comprises a lid overlying said plate, and a nozzle assembly mounted on said lid, said nozzle assembly having a discharge end traversing said lid and a central region of said plate, whereby process fluids can be supplied via said nozzle assembly to an upwardly-facing surface of a wafer-shaped article during use of said device.

7. The device according to claim 1 , further comprising at least one infra-red (IR) lamp positioned outside said process chamber and overlying said plate.

8. The device according to claim 7 , wherein said at least one IR lamp is positioned adjacent a lid of said process chamber, and wherein at least a portion of said lid and said plate are formed from materials transparent to IR radiation emitted by said at least one IR lamp.

9. The device according to claim 1 , wherein said process chamber comprises an interior cover disposed within said process chamber, said interior cover being movable between a first position in which said rotary chuck communicates with an outer wall of said process chamber, and a second position in which said interior cover seals against an inner surface of said process chamber adjacent said rotary chuck to define a gas-tight inner process chamber.

10. The device according to claim 9 , wherein said interior cover forms a lower portion of said inner process chamber when in said second position.

11. Device for processing wafer-shaped articles, comprising a process chamber and a rotary chuck located within said process chamber, wherein said rotary chuck is adapted to be driven without physical contact through a magnetic bearing, said rotary chuck comprising a series of gripping pins adapted to hold a wafer shaped article in a position depending downwardly from said rotary chuck, said rotary chuck further comprising a plate that rotates together with said rotary chuck, said plate being positioned above an area occupied by a wafer-shaped article when said rotary chuck is in use, and said plate shielding upper surfaces of said process chamber from liquids flung off of a wafer-shaped article during use of said rotary chuck;
wherein said process chamber comprises an interior cover disposed within said process chamber, said interior cover being movable between a first position in which said rotary chuck communicates with an outer wall of said process chamber, and a second position in which said interior cover seals against an inner surface of said process chamber adjacent said rotary chuck to define a gas-tight inner process chamber.

12. Device for processing wafer-shaped articles, comprising a process chamber and a rotary chuck located within said process chamber, wherein said rotary chuck is adapted to be driven without physical contact through a magnetic bearing, said rotary chuck comprising a series of gripping pins adapted to hold a wafer shaped article in a position depending downwardly from said rotary chuck, said rotary chuck further comprising a plate that rotates together with said rotary chuck, said plate being positioned above an area occupied by a wafer-shaped article when said rotary chuck is in use, and said plate shielding upper surfaces of said process chamber from liquids flung off of a wafer-shaped article during use of said rotary chuck;
wherein said process chamber comprises an interior cover disposed within said process chamber, said interior cover being movable between a first position in which said rotary chuck communicates with an outer wall of said process chamber, and a second position in which said interior cover seals against an inner surface of said process chamber adjacent said rotary chuck to define a gas-tight inner process chamber; and
wherein said interior cover forms a lower portion of said inner process chamber when in said second position.

Assignees

• Frank Dieter
• Rogatschnig Robert
• Gleissner Andreas
• Lam Res Ag

Inventors

• Frank Dieter
• Rogatschnig Robert
• Gleissner Andreas

Classifications

• H10P72/7608

  characterised by a plurality of separate clamping members, e.g. clamping fingers · CPC title

• H10P72/0462

  characterised by the construction of the processing chambers, e.g. modular processing chambers · CPC title

• H10P72/0441

  Apparatus for sealing, encapsulating, glassing, decapsulating or the like · CPC title

• H10P72/0436

  mainly by radiation · CPC title

• H10P72/0424

  using mainly spraying means, e.g. nozzles · CPC title