Mask frame assembly and method of manufacturing the same
US-2015368785-A1 · Dec 24, 2015 · US
US9547232B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9547232-B2 |
| Application number | US-201414560688-A |
| Country | US |
| Kind code | B2 |
| Filing date | Dec 4, 2014 |
| Priority date | Dec 4, 2014 |
| Publication date | Jan 17, 2017 |
| Grant date | Jan 17, 2017 |
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Disclosed herein are various pellicles for use during extreme ultraviolet (EUV) photolithography processes. An EUV radiation device disclosed herein includes a reticle, a substrate support stage, a pellicle positioned between the reticle and the substrate support stage, wherein the pellicle includes an aerogel grid and a membrane formed on the aerogel grid, and a radiation source that is adapted to generate radiation at a wavelength of about 20 nm or less that is to be directed through the pellicle toward the reticle.
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What is claimed: 1. An EUV radiation device, comprising: a reticle; a substrate support stage; a pellicle positioned between said reticle and said substrate support stage, wherein said pellicle comprises an aerogel grid and a membrane formed above said aerogel grid; and a radiation source that is adapted to generate radiation at a wavelength of about 20 nm or less that is to be directed through said pellicle toward said reticle. 2. The device of claim 1 , wherein said membrane comprises a low-absorption layer of material having an extinction coefficient of at most about 0.02 in the EUV spectral region of about 6-20 nm. 3. The device of claim 1 , wherein said membrane comprises silicon. 4. The device of claim 1 , wherein said aerogel grid comprises silica aerogel. 5. The device of claim 1 , wherein said aerogel grid comprises generally hexagonal openings. 6. A method, comprising: positioning a pellicle between a reticle and a semiconducting substrate, wherein said pellicle comprises an aerogel grid and a membrane formed on said aerogel grid; generating radiation at a wavelength of about 20 nm or less; and directing said generated radiation through said pellicle toward said reticle such that a portion of said generated radiation reflects off of said reticle back through said pellicle toward said semiconducting substrate. 7. The method of claim 6 , further comprising, after irradiating said semiconducting substrate, removing said semiconducting substrate and positioning another semiconducting substrate under said pellicle and performing the steps recited in claim 6 on said another semiconducting substrate. 8. The method of claim 6 , wherein said membrane comprises a low-absorption layer of material having an extinction coefficient of at most about 0.02 in the EUV spectral region of about 6-20 nm. 9. The method of claim 6 , wherein said membrane comprises silicon. 10. The method of claim 6 , wherein said aerogel grid comprises silica aerogel. 11. The method of claim 6 , wherein said aerogel grid comprises generally hexagonal openings. 12. A pellicle, comprising: an aerogel grid; and a membrane formed on said aerogel grid. 13. The pellicle of claim 12 , wherein said membrane comprises a low-absorption layer of material having an extinction coefficient of at most about 0.02 in the EUV spectral region of about 6-20 nm. 14. The pellicle of claim 12 , wherein said membrane comprises silicon. 15. The pellicle of claim 12 , wherein said aerogel grid comprises silica aerogel. 16. The pellicle of claim 12 , wherein said aerogel grid comprises generally hexagonal openings. 17. A method, comprising: forming a release layer above a substrate; forming a membrane layer above said release layer; forming an aerogel layer defining a grid structure above said membrane layer; removing said release layer to separate said membrane layer and said aerogel layer from said substrate; and mounting said membrane layer and said aerogel layer to a frame. 18. The method of claim 17 , wherein said forming said aerogel layer comprises: forming an aerogel precursor layer above said membrane; processing said aerogel precursor layer to form a aerogel layer; and patterning said aerogel layer using a lithography process to define said grid structure. 19. The method of claim 17 , wherein said forming said aerogel layer comprises: forming an aerogel precursor layer above said membrane; processing said aerogel precursor layer to form said aerogel layer and to define open pores in said aerogel layer to define said grid structure. 20. The method of claim 17 , wherein said aerogel layer comprises silica aerogel.
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