Absolute pressure sensor with improved cap bonding boundary

Patent metadata

Field	Value
Publication number	US-9546922-B2
Application number	US-201414289874-A
Country	US
Kind code	B2
Filing date	May 29, 2014
Priority date	Aug 9, 2013
Publication date	Jan 17, 2017
Grant date	Jan 17, 2017

Abstract

A pressure sensor includes a top cap with a recess formed in an end of the top cap and a cavity formed in the end of the top cap to communicate with the recess. The cavity extends further axially into the top cap than the recess thereby having depth greater than a depth of the recess. Outer edges of the recess extend laterally outward beyond outer edges of the cavity thereby defining a bonding boundary. A silicon substrate has a sensing circuit on a top side thereof. The top cap is bonded to the top side of the silicon substrate in a range from the outer edges of the top cap to the bonding boundary. The recess and the cavity of the top cap face the top side of the silicon substrate and form a reference vacuum cavity. When pressure is exerted on a backside of the substrate, a portion of the substrate is constructed and arranged to deflect.

First claim

What is claimed is:

1. A pressure sensor comprising:
a top cap;
a recess formed in an end of the top cap;
a cavity formed in the end of the top cap and communicating with the recess such that the cavity extends further axially into the top cap than the recess thereby having depth greater than a depth of the recess, outer edges of the recess extend laterally outward beyond outer edges of the cavity thereby defining a bonding boundary; and
a silicon substrate having a sensing circuit associated with a top side thereof, the top cap being bonded to the top side of the silicon substrate in a range from the outer edges of the top cap to the bonding boundary;
wherein the recess and the cavity of the top cap face the top side of the silicon substrate and form a reference vacuum cavity and wherein, when pressure is exerted on a backside of the substrate, a portion of the silicon substrate is constructed and arranged to deflect,
wherein the portion of the silicon substrate comprises a diaphragm and at least a portion of the sensing circuit is associated with the top side of the diaphragm and in opposing relation with respect to the cavity, and
wherein the to cap includes a portion within the cavity that is axially aligned with a center of the diaphragm and which defines a surface of the recess so as to constrain deformation of the diaphragm.

2. The sensor of claim 1 , wherein the recess is generally rectangular having rounded corners.

3. The sensor of claim 1 , wherein the depth of the recess is less than about 10 μm and the depth of the cavity is greater than about 100 μm.

4. The sensor of claim 1 , further comprising a pedestal, wherein the pedestal is bonded to the bottom of the silicon substrate.

5. The sensor of claim 4 , wherein the pedestal further comprises an aperture, the aperture being in communication with a backside of the diaphragm.

6. A method of making a top cap for a pressure sensor, comprising the steps of:
providing a cap substrate;
etching a recess into an end of the cap substrate; and
etching a cavity into a portion of the recess such that the cavity extends axially further into the cap substrate than the recess, and such that outer edges of the recess extend laterally outward beyond outer edges of the cavity to define a bonding boundary,
bonding a top side of a silicon substrate to the cap substrate in a range from the outer edges of the top cap to the bonding boundary, the silicon substrate having a sensing circuit associated with the top side thereof,
wherein a portion of the silicon substrate comprises a diaphragm and at least a portion of the sensing circuit is associated with the top side of the diaphragm, and
wherein the cap substrate is provided with a portion within the cavity that is axially aligned with a center of the diaphragm and which defines a surface of the recess so as to constrain deformation of the diaphragm.

7. The method of claim 6 , wherein the recess is provided as a generally rectangular recess having rounded corners.

8. The method of claim 6 , wherein the depth of the recess is less than about 10 μm and the depth of the cavity is greater than about 100 μm.

9. The method of claim 6 , further comprising bonding a pedestal to a bottom of the silicon substrate.

10. The method of claim 9 , wherein the pedestal further comprising an aperture, the aperture being in communication with a backside of the diaphragm.

11. A top cap for a pressure sensor comprising:
a cap substrate;
a recess formed in an end of the cap substrate; and
a cavity formed in a portion of the recess such that the cavity extends axially further into the cap substrate than the recess, and such that outer edges of the recess extend laterally outward beyond outer edges of the cavity to define a bonding boundary,
wherein a depth of the recess is less than about 10 μm and a depth of the cavity is greater than about 100 μm, and
wherein the cap substrate is provided with a central portion extending within the cavity and which defines a surface of the recess.

12. The top cap of claim 11 wherein the recess is a generally rectangular recess having rounded corners.

Assignees

• Continental automotive systems inc

Inventors

• Ding Xiaoyi

Classifications

• G01L9/0055 Primary

  bonded on a diaphragm · CPC title

• G01L19/06

  Means for preventing overload or deleterious influence of the measured medium on the measuring device or vice versa · CPC title

• G01L19/04

  Means for compensating for effects of changes of temperature {, i.e. other than electric compensation} · CPC title