Device for conducting a cooling fluid, and cooling system for cooling an electrical component

US9546827B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9546827-B2
Application numberUS-201113990225-A
CountryUS
Kind codeB2
Filing dateOct 26, 2011
Priority dateNov 30, 2010
Publication dateJan 17, 2017
Grant dateJan 17, 2017

How to read this patent

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  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

    Who owns or filed the patent and who is credited as inventor.

  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

    Prior art links and similar publications in this corpus.

Abstract

Official abstract text for this publication.

The invention relates to a device for conducting a cooling fluid for cooling an electrical component. The device comprises a fluid conducting chamber for conducting the cooling fluid, and an at least partially flexible cover, which seals the fluid conducting chamber in a fluid-tight manner and which forms a heat transmission zone for conducting heat between the cooling fluid and the electrical component.

First claim

Opening claim text (preview).

The invention claimed is: 1. A device for conducting a cooling fluid for cooling an electrical component, wherein the device has the following features: a fluid-conducting chamber for conducting the cooling fluid; side walls; and an at least partially flexible cover, wherein the cover closes off the fluid-conducting chamber in a fluid-tight manner, wherein the cover comprises an edge region corresponding to the side walls, a heat-transfer region for conducting heat between the cooling fluid and the electrical component corresponding to a geometry of the electrical component, and a boundary region between the edge region and the heat-transfer region that is not covered by the electrical component, wherein the cover is inflexible in the boundary region, and is flexible in the heat-transfer region, wherein flexibility allows fluid pressure to cause deformation of the cover. 2. The device as claimed in claim 1 , in which the cover is a film or foil. 3. The device as claimed in claim 1 , in which the cover is formed from an electrically insulating material. 4. The device as claimed in claim 1 , in which a side of the cover which faces the electrical component is structured to increase the surface area of the heat-transfer region in comparison to a smooth cover. 5. The device as claimed in claim 1 , in which a side of the cover which faces the electrical component has an adhesive coating. 6. The device as claimed in claim 1 , in which the fluid-conducting chamber is connected to the cover in an interlocking manner and/or in a force-fitting manner and/or in a materially cohesive manner. 7. The device as claimed in claim 1 , in which the fluid-conducting chamber has an interior space having at least one partition wall for conducting the cooling fluid. 8. The device as claimed in claim 1 , in which the fluid-conducting chamber is also at least partially flexible. 9. A cooling system for cooling an electrical component, which cooling system has the following features: the electrical component; and a device as claimed in claim 1 , wherein the electrical component is arranged in the heat-transfer region of the cover of the device. 10. The device as claimed in claim 1 , wherein the heat-transfer region is a central region of the cover. 11. The device as claimed in claim 1 , wherein the edge region is inflexible. 12. A device for conducting a cooling fluid for cooling an electrical component, wherein the device has the following features: a fluid-conducting chamber for conducting the cooling fluid; side walls; and an at least partially flexible cover, wherein the cover closes off the fluid-conducting chamber in a fluid-tight manner, wherein the cover comprises an edge region corresponding to the side walls, a heat-transfer region for conducting heat between the cooling fluid and the electrical component corresponding to a geometry of the electrical component, and a boundary region between the edge region and the heat-transfer region that is not covered by the electrical component, wherein the cover is inflexible in the boundary region and edge region, and is flexible in the heat-transfer region, wherein flexibility allows fluid pressure to cause deformation of the cover, wherein the heat-transfer region is a central region of the cover, wherein the cover is a film or foil, wherein the cover is formed from an electrically insulating material, wherein a side of the cover which faces the electrical component is structured to increase the surface area of the heat-transfer region in comparison to a smooth cover, wherein a side of the cover which faces the electrical component has an adhesive coating.

Assignees

Inventors

Classifications

  • Modifications to facilitate cooling, ventilating, or heating · CPC title

  • F28F1/00Primary

    Tubular elements; Assemblies of tubular elements (specially adapted for movement F28F5/00) · CPC title

  • with recirculation or U-turn in the flow path, i.e. back and forth · CPC title

  • Cooling or keeping cold · CPC title

  • Liquids · CPC title

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Frequently asked questions

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What does patent US9546827B2 cover?
The invention relates to a device for conducting a cooling fluid for cooling an electrical component. The device comprises a fluid conducting chamber for conducting the cooling fluid, and an at least partially flexible cover, which seals the fluid conducting chamber in a fluid-tight manner and which forms a heat transmission zone for conducting heat between the cooling fluid and the electrical …
Who is the assignee on this patent?
Ludwig Lars, Moser Michael, Stripf Matthias, and 2 more
What technology area does this patent fall under?
Primary CPC classification F28F1/00. Mapped technology areas include Mechanical Engineering.
When was this patent published?
Publication date Tue Jan 17 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).