Method for connecting two objects electrically

Patent metadata

Field	Value
Publication number	US-9545015-B2
Application number	US-201213433166-A
Country	US
Kind code	B2
Filing date	Mar 28, 2012
Priority date	Mar 28, 2007
Publication date	Jan 10, 2017
Grant date	Jan 10, 2017

Abstract

A method for connecting two objects electrically by an electroconductive liquid is described. The method includes providing a substrate having a first surface and a second surface opposite to the first surface. Thereafter, the method includes forming a channel of the liquid on the first surface of the substrate to extend along the first surface of the substrate. Further, the method includes forming a through hole in the substrate. Moreover, the method includes arranging the two objects to interpose the substrate, wherein the two objects overlap with the openings of the through hole. Next, the method further includes filling the liquid to the through hole via the channel, bringing the liquid in contact with the two objects, and hardening the liquid. Further still, the method further includes wherein a surface of the liquid hole bulges to form a projection which makes contact with one of the two objects.

First claim

What is claimed is:

1. A method for connecting two objects electrically by an electroconductive liquid, comprising:
providing a substrate having a first surface and a second surface which is opposite to the first surface with respect to a thickness direction of the substrate;
forming a channel of the liquid on the first surface of the substrate to extend along the first surface of the substrate;
forming a through hole in the substrate which communicates with the channel and defines openings on the first and second surfaces, respectively;
forming, as one of the two objects, a wiring proximate to the first surface, wherein the wiring extends into an opening of the through hole;
arranging the two objects such that the substrate interposes the two objects, wherein the two objects overlap with the openings of the through hole, respectively, as viewed in the thickness direction of the substrate;
filling the liquid to the through hole via the channel, by a capillary force or a surface tension between the liquid and a channel-defining surface;
bringing the liquid filled in the through hole in contact with the two objects; and
hardening the liquid filled in the through hole,
wherein, when bringing the liquid filled in the through hole in contact with the two objects, the liquid is supplied into the through hole, via the channel, until a surface of the liquid at an end opening of the through hole bulges to form a projection due to surface tension, and the projection of the surface of the liquid makes contact with one of the two objects.

2. The method for connecting two objects electrically according to claim 1 , further comprising removing a region of the substrate, which includes a part of the channel, after filling the liquid in the through hole and bringing the liquid droplet into contact with the two objects.

3. The method for connecting two objects electrically according to claim 1 , wherein upon forming the through hole in the substrate, a substrate projection which projects inwardly from an inner wall of the through hole is also formed together with the through hole; and
the wiring is formed such that the wiring covers a surface of the substrate projection upon arranging the objects.

4. The method for connecting two objects electrically according to claim 1 , wherein a liquid repellent property of a surface of the wiring is lower than a liquid repellent property of a surface of the substrate, at an area of the substrate different from another area at which the wiring is formed.

5. The method for connecting two objects electrically according to claim 1 , wherein the channel is formed inside the substrate.

6. The method for connecting two objects electrically according to claim 1 , wherein the channel is a groove formed on the first surface of the substrate.

7. The method for connecting two objects electrically according to claim 6 , wherein a liquid repellent property of the first surface of the substrate is higher than a liquid repellent property of an inner surface of the liquid-receiving portion of the groove.

8. The method for connecting two objects electrically according to claim 7 , further comprising forming a liquid repellent film on the first surface of the substrate before forming the channel, the liquid repellant film having a liquid repellent property higher than the liquid repellent property of the inner surface of the liquid-receiving portion of the groove.

9. The method for connecting two objects electrically according to claim 1 , wherein one of the two objects is arranged to be away from the substrate upon arranging the two objects.

Assignees

• Sugahara Hiroto
• Brother Ind Ltd

Inventors

• Sugahara Hiroto

Classifications

• H05K3/363

  by soldering · CPC title

• Y10T29/49124

  On flat or curved insulated base, e.g., printed circuit, etc. · CPC title

• Y10T29/49165

  by forming conductive walled aperture in base · CPC title

• H05K3/3415

  on both sides of the substrate or combined with lead-in-hole components · CPC title

• B41J2/1626

  etching · CPC title